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IPC-J-STD-005B (Hardcopy)
Requirements for Solder Pastes
Englisch. 22 Seiten. Stand: März 2024
IPC J-STD-005B standard lists the requirements for qualification and characterization of solder paste. It references test methods, criteria, and metal content, viscosity, slump, solder ball, tack and wetting of solder pastes. Additional support is provided in IPC-HDBK-005, Guide to Solder Paste Assessment.
IPC-J-STD-075A (Hardcopy)
Classification of Passive and Solid State Devices for Assembly Processes
Englisch. 26 Seiten. Stand: November 2022
EIA/IPC/JEDEC J-STD-075 picks up where J-STD-020 left off by providing test methods to classify worst-case thermal process limitations for electronic components. Classification is referenced to common industry wave and reflow solder profiles including lead-free processing. The classifications represent maximum process sensitivity levels and do not establish rework conditions or recommended processes for an assembler. IPC JEDEC J-STD-075A outlines a process to classify and label non-semiconductor electronic component’s Process Sensitivity Level (PSL) and Moisture Sensitivity Level (MSL) consistent with the semiconductor industry’s classification levels (J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Devices and J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices). Developed by ECIA, IPC and JEDEC.
IPC-JP002 (PDF) Single User
JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline
Englisch. Stand 2012, 31 Seiten, Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
This document will provide insight into the theory behind tin whisker formation as it is known today and, based on this knowledge, potential mitigation practices that may delay the onset of, or prevent tin whisker formation. The potential effectiveness of various mitigation practices will also be briefly discussed. References behind each of the theories and mitigation practices are provided. It should be noted that for certain applications with special needs (e.g., military or aerospace), the Sn mitigation methods contained in this document may not be sufficient due to additional performance requirements. 6 pages. Released March 2006.
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IPC-MC-790 (PDF) Single User
Guidelines for Multichip Module Technology Utilization
Englisch. 120 pages. Stand: August 1992. Keine Druckberechtigung, DRM-Schutz, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
Provides information on multichip module technology, including parametric data, design and manufacturing information and a proposed categorization of various approaches to multichip interconnect substrate technologies based on dielectric family. 120 pages.
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IPC-ML-960 (Hardcopy)
Qualification and Performance Specification for Mass Lamination Panels for Multilayer Printed Boards
Englisch.21 pages. Stand: Juli 1994
This specification covers qualification and performance requirements of rigid mass laminated panels for use in multilayer printed boards. Testing procedures and criteria are addressed. 21 pages.
IPC-ML-960 (PDF) Single User
Qualification and Performance Specification for Mass Lamination Panels for Multilayer Printed Boards
Englisch. 21 pages. Stand: Juli 1994. Keine Druckberechtigung, DRM-Schutz, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
This specification covers qualification and performance requirements of rigid mass laminated panels for use in multilayer printed boards. Testing procedures and criteria are addressed. 21 pages.
IPC-MS-810 (Hardcopy)
Guidelines for High Volume Microsection
Englisch. 31 pages. Stand: Oktober 1993
Discusses the many variables and problems associated with the process--from sample removal to micro-etch-- and the variables common to high volume microsection. The process variables and problems are organized so that the reader can research a specif ic issue or overview the variables of a process area. 31 pages.
IPC-MS-810 (PDF) Single User
Guidelines for High Volume Microsection
Englisch. 31 pages. Stand: Oktober 1993. Keine Druckberechtigung, DRM-Schutz, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
Discusses the many variables and problems associated with the process--from sample removal to micro-etch-- and the variables common to high volume microsection. The process variables and problems are organized so that the reader can research a specif ic issue or overview the variables of a process area. 31 pages.
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IPC-NC-349 (Hardcopy)
Computer Numerical Control Formatting for Drillers and Routers
Englisch. Stand: August 1985, 6 Seiten
Defines a machine readable input format for Computer Numerical Control (CNC) drilling and routing machine tools used by the printed wiring board industry. The format may be used to transfer drilling and routing information between printed board designers, manufacturers and users or as the output CNC standard from converters that expand higher level design input such as IPC-D-350 data. Provides a common command structure that can assist in the board manufacturing process and is not intended to provide for every possible software enhancement.
IPC-OI-645 (PDF) Single User
Standard for Visual Optical Inspection Aids
Englisch. Stand: Oktober 1993, 40 Seiten. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
Establishes requirements, definitions and certification provisions for optical inspection aids. Defines inspection grades to be used as accept/reject criteria for optical inspection aids.
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