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FED-Dokumente und IPC-Richtlinien zu Design, Leiterplatten- und Baugruppen-Fertigung jederzeit bequem bestellen.
IPC-CF-152B (Hardcopy)
Composite Metallic Materials Specification for Printed Wiring Boards
Englisch. 39 pages. Stand: März 1998
Covers the requirements for copper/invar/copper (CIC), copper/molybdenum/ copper (CMC) and three-layer composites for use in electronic applications. IPC-CF-152B includes specification sheets, which outline engineering and performance data for each t ype of composite metallic materials. 39 pages.
IPC-CH-65B (PDF) Single User
Guidelines for Cleaning of Printed Boards and Assemblies
Englisch. 200 pages. Stand: July 2011. Keine Druckberechtigung, DRM-Schutz, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
This is a collection of information on electronic board and assembly cleaning in a single location. This major revision explains the relationship between materials, processes, and contaminants in fabrication and assembly operations. It also addresses cleanliness assessment and process control in relation to cleanliness. Color pictures help with understanding. Supersedes IPC-CH-65A, IPC-SC-60A, IPC-SA-61A, IPC-AC-62A, IPC-SM-839.
IPC-CM-770E (PDF) Single User
Component Mounting Guidelines for Printed Boards
Englisch. 150 pages. Stand: Januar 2004. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
This revision provides effective guidelines in the preparation and attachment of components for printed circuit board assembly and reviews pertinent design criteria, impacts and issues. It contains techniques for assembly (both manual and machines in cluding SMT, BGA and flip chip) and consideration of, and impact upon, subsequent soldering, cleaning, and coating processes. 150 pages.
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IPC-CoatBdsAssyFAM-Kit (Hardcopy)
Coating Specifications for Boards and Assemblies
Englisch. Inkl. IPC-HDBK-830, SM-840, HDBK-840
This is a family of documents for coatings used in the printed board fabrication and assembly processes. Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies IPC-HDBK-830 Guidelines for Design, Selection, and Application of Conformal Coatings IPC-SM-840 Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials IPC-HDBK-840 Solder Mask Handbook
IPC-D-279 (PDF) Single User
Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies
Englisch. 137 pages. Stand: Juli 1996. Keine Druckberechtigung, DRM-Schutz, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
Establishes design concepts, guidelines and procedures for reliable printed wiring assemblies. Focuses on SMT or mixed technology PWAs, specifically addressing the interconnect structure and the solder joint itself. Discusses substrates, components, attachment materials, costings and assembly processes and testing considerations. In addition, this document contains detailed appendices covering: solder attachments; plated-through via structures; insulation resistance; thermal considerations; envi ronmental stresses; coefficient of thermal expansion; electrostatic discharge; solvents; testability; corrosion aerospace and high altitude concerns. 137 pages.
IPC-D-310C (PDF) Single User
Guidelines for Phototool Generation and Measurement Techniques
Englisch. 68 pages. Stand: Juni 1991. Keine Druckberechtigung, DRM-Schutz, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
This document provides manufacturing and design considerations, input data requirements, test coupons, process control, tape and preform artwork, cut and strip artwork, vector photoplotting, rasterplotting, direct imaging, measurement and quality ass urance. 68 pages.
IPC-D-322 (Hardcopy)
Guidelines for Selecting Printed Wiring Board Sizes Using Standard Panel Sizes
Englisch. 4 pages. Stand: September 1991
Defines guidelines for choosing sizes of printed wiring boards using standard fabrication panel sizes. 4 pages.
IPC-D-322 (PDF) Single User
Guidelines for Selecting Printed Wiring Board Sizes Using Standard Panel Sizes
Englisch. 4 pages. Stand: September 1991. Keine Druckberechtigung, DRM-Schutz, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
Defines guidelines for choosing sizes of printed wiring boards using standard fabrication panel sizes. 4 pages.
IPC-D-325A (PDF) Single User
Documentation Requirements for Printed Boards
Englisch. 94 pages. Stand: Mai 1995. Keine Druckberechtigung, DRM-Schutz
Establishes the general requirements for documentation necessary to fully describe end product printed boards, regardless of raw material, special fabrication requirements, layer count or end product usage. Includes master drawing requirements, board definition and artwork/phototooling. 94 pages.
IPC-D-326A (PDF) Single User
Information Requirements for Manufacturing Electronic Assemblies
Englisch. 5 pages. Stand: Januar 2004. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
Covers information requirements for the procurement of material, assembly, inspection, test, burn-in and delivery of electronic assemblies. 5 pages.
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IPC-D-356B (PDF) Single User
Bare Substrate Electrical Test Data Format
Englisch. 61 pages. Stand: Oktober 2002. Keine Druckberechtigung, DRM-Schutz, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
This standard describes a data format for transmitting bare board electrical test information in digital form, including data suitable for computer-aided repair. When used as a netlist input to test data processing, the receiver of IPC-D-356B data wi ll determine test point assignments and positioning. Enhancements to the B Revision include updates to the concept of testable areas to account for SMD pads and unusually shaped pads, updating of complex records for representing all inter-layer conne ctions in nets, a simple polygon description format that improves graphical representation of the bare board, and new methods for indentifying endpoints and midpoints. 61 pages.
IPC-D-422 (PDF) Single User
Design Guide for Press Fit Rigid Printed Board Back Planes
Englisch. 17 pages. Stand: September 1982. Keine Druckberechtigung, DRM-Schutz, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
Contains backplane design information from the fabrication and assembly perspective. Includes sections on design and documentation; fabrication; assembly; repair; and inspection. 17 pages.
IPC-D-620 (PDF) Single User
Design and Critical Process Requirements for Cable and Wiring Harnesses
Englisch, Seiten 49, Stand: 2015. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
IPC-D-620 provides design and critical process requirements for the three product classes of cable and wire harness assemblies as well as military/space applications. It is the design requirements companion to IPC/WHMA-A-620, "Requirements and Acceptance for Cable and Wire Harness Assemblies," and its associated Space Addendum.
Three white papers are included to provide guidance on key topics discussed in the Standard. These are: - IPC-WP-113, Guidance for the Development and Implementation of a Red Plague Control Plan (RPCP) - IPC-WP-114, Guidance for the Development and Implementation of a White Plague Control Plan (WPCP) - IPC-WP-116, Guidance for the Development and Implementation of a Foreign Object Debris (FOD) Control P.
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IPC-D-620A (Hardcopy)
Design and Critical Process Requirements for Cable and Wiring Harnesses
Englisch, Stand: 2021
IPC-D-620 provides design and critical process requirements for the three product classes of cable and wire harness assemblies as well as military/space applications. It is the design requirements companion to IPC/WHMA-A-620, "Requirements and Acceptance for Cable and Wire Harness Assemblies," and its associated Space Addendum.
Three white papers are included to provide guidance on key topics discussed in the Standard. These are: - IPC-WP-113, Guidance for the Development and Implementation of a Red Plague Control Plan (RPCP) - IPC-WP-114, Guidance for the Development and Implementation of a White Plague Control Plan (WPCP) - IPC-WP-116, Guidance for the Development and Implementation of a Foreign Object Debris (FOD) Control P.
IPC-D-640 (Hardcopy)
IPC-D-640: Design and Critical Process Requirements for Optical Fiber, Optical Cable and Hybrid Wiring
Englisch, 83 Seiten, Stand September 2016, Hardcopy
This full-color document provides design and critical process requirements and technical insight for cable and wire harness assemblies incorporating optical fiber, optical cable and hybrid wiring technology. This standard also includes an Excel spreadsheet Verification and Compliance checklist.
IPC-D-640 (PDF) Single User
IPC-D-640: Design and Critical Process Requirements for Optical Fiber, Optical Cable and Hybrid Wiring
Englisch, 83 Seiten, Stand September 2016, Single User, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
This full-color document provides design and critical process requirements and technical insight for cable and wire harness assemblies incorporating optical fiber, optical cable and hybrid wiring technology. This standard also includes an Excel spreadsheet Verification and Compliance checklist.
IPC-D-859 (Hardcopy)
Design Standard for Thick Film Multilayer Hybrid Circuits
Englisch. 80 pages. Stand: Dezember 1989
This standard covers the requirements and considerations for the design of multilayer hybrid circuits based on industry manufacturing capabilities. 80 pages.
IPC-D-859 (PDF) Single User
Design Standard for Thick Film Multilayer Hybrid Circuits
Englisch. 80 pages. Stand: Dezember 1989. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
This standard covers the requirements and considerations for the design of multilayer hybrid circuits based on industry manufacturing capabilities. 80 pages.
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IPC-DPMO-202 (PDF) Single User
IPC 7912/9261 End Item and In-Process DPMO Set
Englisch. Juli 2000, Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
Both of the industry's standards for computing DPMO are now bundled together at a reduced cost. IPC-7912, Calculation of DPMO & Manufacturing Indices for Printed Board Assemblies, is the standard for benchmarking end-item DPMO and IPC-9261, In-Proces s DPMO and Estimated Yield for PWAs, defines the process for evaluating any stage in the assembly process. IPC-7912 is 13 pages. Released July 2000. IPC-9261 is 14 pages.
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IPC-DR-572A (Hardcopy)
Drilling Guidelines for Printed Boards
Englisch. Stand: März 2007, 12 Seiten
IPC-DR-572A: Leitfaden für das Bohren von Leiterplatten
Die neue Ausgabe von IPC-DR-572A 'Drilling Guidelines for Printed Boards' vom März 2007 gibt Hinweise für die Realisierung hochqualitativer Bohrungen in unterschiedlichen Materialien. Der Lei tfaden berührt u.a. folgende Punkte: Bohrer, zu bohrende Materialpakete, Bohrmaschinen, Bohrvorgang, Bohrlochqualität, Lochprobleme.
