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FED-Dokumente und IPC-Richtlinien zu Design, Leiterplatten- und Baugruppen-Fertigung jederzeit bequem bestellen.
IPC-TP-1114 (PDF) Single User
The Layman's Guide to Qualifying a Process to J-STD-001B
Englisch. 13 pages. Stand: Januar 1998, Keine Druckberechtigung, DRM-Schutz, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
Electronics manufacturers are faced with the difficult task of proving that a candidate manufacturing process can produce acceptable hardware, either to the customer of the product, or for internal quality control. Users have to determine many of the process qualification steps on their own. This document leads you through the task of qualifying a candidate process to J-STD-001B.
IPC-TP-1114 (PDF) Single User
The Layman's Guide to Qualifying a Process to J-STD-001B
Englisch. 13 pages. Stand: Januar 1998. Keine Druckberechtigung, DRM-geschützt,!!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
Electronics manufacturers are faced with the difficult task of proving that a candidate manufacturing process can produce acceptable hardware, either to the customer of the product, or for internal quality control. Users have to determine many of the process qualification steps on their own. This document leads you through the task of qualifying a candidate process to J-STD-001B.
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IPC-TR-465-3 (PDF) Single User
Evaluation of Steam Aging on Alternative Finishes, Phase 11A
Englisch. 15 pages. Stand: Juli 1996. Keine Druckberechtigung, DRM-Schutz, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
Details the results of a two-year study to determine the effect of steam aging exposure on components. A variety of solderable finishes were used. A small production simulation utilized preconditioned and as-received samples and tested a total of 2,0 00 joints. 15 pages.
IPC-TR-486 (PDF) Single User
Report on Round Robin Study to Correlate IST & Microsectioning Evaluations for Detecting the Presence of Inner-Layer Separation
Englisch. 51 pages. Stand: Juli 2001. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
This technical report provides full detail of the round robin study charged with assessing the use of Interconnect Stress Test (IST) as a test for incoming inspection in lieu of Thermal Stress in the detection of innerlayer separations in plated-thro ugh holes. Includes background on the Post Separation Task Group, test results, round robin test plan, conclusions and test methods used. 51 pages.
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IPC-TR-579 (PDF) Single User
Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PWB
Englisch. 80 pages. Stand: September 1988. Keine Druckberechtigung, DRM-Schutz, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
Approximately 200,000 PTHs, covering primarily electroplated but also electroless technology, were exposed to several different thermal cycles. A number of PTH diameters, board constructions and plating thicknesses were evaluated. 80 pages.
IPC-TR-583 (PDF) Single User
An In-Depth Look At Ionic Cleanliness Testing
Englisch. 229 pages. Stand: Juli 2002. Keine Druckberechtigung, DRM-Schutz, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
This original research was a cooperative effort between the EMPF and IPC, released as EMPF-RR-0013 in 1993 for better understanding of ionic cleanliness testing. The IPC Ionic Conductivity/Ion Chromatography Test Task Group has validated its continue d importance and relevance to the cleaning community and IPC-TR-583 is the result. It includes how solvent temperature influences the final cleanliness results, criticality of a 75% isopropyl to 25% water ratio, value of spraying the solvent, etc. Th e report provides quantified results to help users determine what variables most influence ionic cleanliness test results. 229 Pages.
IPC-TR-585 (PDF) Single User
Time, Temperature and Humidity Stress of Final Board Finish Solderability
Englisch. 54 pages. Released May 2006. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
This Technical Report details the investigations into identifying stress tests that distinguish between robust and non-robust surface finishes. A robust finish will pass a test for solderability whereas a non-robust finish will fail. The stress tests identified do not necessarily duplicate real world environment (fabrication of the bare printed board through assembly), but they must correlate to solderability performance. The Sequential Electrochemical Reduduction Analysis (SERA) was used extens ively to evaluate the solderability performance of the finishes after stress exposure.
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IPC-TR-587 (Hardcopy)
Conformal Coating Material and Application ‘‘State of the Industry’’ Assessment Report
Englisch. 112 Seiten. Stand: Juli 2020
IPC-TR-587 technical report delivers results of a major study on conformal coating. In most manufacturing specifications, conformal coating thickness is defined as the thickness of the final polymer film on a flat, unencumbered surface of the assembly, however conformal coating thickness on other assembly and component surfaces is not characterized. IPC-TR-587 is a report outlining an IPC study of major conformal coating types, coating application techniques, and coating cure technologies, characterizing the final film thickness on common component surfaces.
IPC-TR-587 (PDF) Single User
Conformal Coating Material and Application ‘‘State of the Industry’’ Assessment Report
Englisch. 112 pages. Stand: Juli 2020. Keine Druckberechtigung, DRM-Schutz, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
IPC-TR-587 technical report delivers results of a major study on conformal coating. In most manufacturing specifications, conformal coating thickness is defined as the thickness of the final polymer film on a flat, unencumbered surface of the assembly, however conformal coating thickness on other assembly and component surfaces is not characterized. IPC-TR-587 is a report outlining an IPC study of major conformal coating types, coating application techniques, and coating cure technologies, characterizing the final film thickness on common component surfaces.
IPC-WP-014A (Hardcopy)
Pb-free Electronics Risk Management (PERM) Council Position on the Use of Pb-free Electronics in the Aerospace and Defense Electronics Industries
Englisch. 12 Seiten. Stand: März 2020
Pb-free materials are considered a major technology disruption to traditional Pb-based interconnect materials for electronics, which is of particular concern for the aerospace & defense industries where safety cannot be compromised and applicable reliability data remains scarce. Until validated data and modelling methods are developed, projects considering Pb-free Aerospace & Defense products and systems need to adopt additional steps, many of which add cost and scheduling. Within the IPC-WP-014A white paper the PERM Council provides key recommendations that offer a way to approach Pb-free deployment in Aerospace & Defense products and systems to assist in maintaining product safety, affordability and sustainability. The IPC-WP-014 revision A white paper provides updated information on the effort to secure U.S. federal funding for Pb-free research and development in creating validated modelling methods.
