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IPC-PE-740A (PDF) Single User
Troubleshooting for Printed Board Manufacture and Assembly
Englisch. 388 pages. Stand: Dezember 1997. Keine Druckberechtigung, DRM-Schutz, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
This is the document all process engineers must have! Useful for day-to-day problem solving, it contains case histories of problems and corrective action in the design, manufacture, assembly and testing of printed wiring products. Each section has be en updated to reflect today's manufacturing challenges. Sections address documentation, phototooling, raw materials, mechanical operations, hole preparation, plated-through hole, cleaning procedures, imaging, electroplating, etching, innerlayer fabri cation lamination, soldering, metallic protective coatings, non-metallic protective coatings, component preparation and assembly, inspection and test, and rework and repair. This revision features an expanded assembly chapter that includes soldering, cleaning and post soldering process. Also new to this revision are examples of additional processes for troubleshooting. And, as an enhancement, an easy-to-use index has been added to help you find your process problem. 388 pages.
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IPC-PtdEleFAM-Kit
Printed Electronics Family
Englisch. IPC-2291, IPC-4591, IPC-4921, IPC-6901, IPC-6903
This is a family of documents for printed electronics.
IPC-2291 Design Guideline for Printed Electronics
IPC-4591 Requirements for Printed Electronics Functional Conductive Materials
IPC-4921 Requirements for Printed Electronics Base Materials (Substrates)
IPC-6901 Application Categories for Printed Electronics
IPC-6903 Terms and Definitions for the Design and Manufacture of Printed Electronics (Additive Circuitry)
IPC-QE-605A (PDF) Single User
Printed Board Quality Evaluation Handbook
Englisch. 52 pages. Stand: Februar 1999. Keine Druckberechtigung, DRM-Schutz, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
This document contains a wide variety of photographic illustrations of various anomalies and characteristics of printed boards for identification of anomalies that are sometimes seen during inspection and evaluation processes. The handbook has been d ivided into fourteen distinct sections covering topics such as solder resist, plated-through holes, conductor characteristics and surface plating to aid the user in determining specific accept/nonconforming criteria for various anomalies. 52 pages.
IPC-QF-143 (PDF) Single User
Specifications for Finished Fabric Woven from Quartz (Pure Fused Silica) for Pri
Englisch. 13 pages. Stand: Februar 1992. Keine Druckberechtigung, DRM-Schutz, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
Covers classification and requirements for finished fabrics woven from quartz fiber yarns that are intended as a reinforcing material in laminated plastics for electrical and electronic use. 13 pages.
IPC-QL-653A (Hardcopy)
Certification of Facilities that Inspect/Test Printed Boards, Components & Materials
Englisch. 15 pages. Stand: November 1997
This specification establishes the certification requirements for facilities that inspect/test printed boards, components and materials. This specification is intended to provide a minimum standardized basis for evaluating or auditing a technically o riented inspection/testing facility. 15 pages.
IPC-QL-653A (PDF) Single User
Certification of Facilities that Inspect/Test Printed Boards, Components & Materials
Englisch. 15 pages. Stand: November 1997. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
This specification establishes the certification requirements for facilities that inspect/test printed boards, components and materials. This specification is intended to provide a minimum standardized basis for evaluating or auditing a technically o riented inspection/testing facility. 15 pages.
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IPC-QRG-PTH-H (Hardcopy)
Through-Hole Solder Joint Evaluation Training & Reference Guide
Englisch. Stand: 2022, Hardcopy
The IPC-QRG-PTH-H desk reference manual contains illustration/images of through-hole solder connections for IPC- A-610H standard. As a convenient manual but not a replacement for IPC-A-610H standard, the IPC-QRG-PTH-H is an additional tool to help operators and inspectors when evaluating the three classes of product for solder joint acceptance. The IPC-QRG-PTH-H is a useful training aid as well. It can be used with other products to understand through-hole criteria when evaluating a components and solder joint acceptance.
IPC-QRG-SMT-H (Hardcopy)
Surface Mount Solder Joint Evaluation Training & Reference Guide
Englisch. Stand: Januar 2022 (Hardcopy)
The IPC-QRG-SMT-H desk reference manual contains illustration/images of surface mount solder connections for IPC- A-610H standard. As a convenient manual but not a replacement for IPC-A-610H standard, the IPC-QRG-SMT-H is an additional tool to help operators and inspectors when evaluating the three classes of product for solder joint acceptance. Useful as a training aid but not a replacement for IPC-A-610, IPC-QRG-SMT-H contains color illustrations of Chip component, Gull Wing, J Lead, BTC and Area Array solder joints. Each image clearly shows the minimum acceptable condition for each type of component misalignment; and details all of the specifications for minimum/maximum solder joint size, including fillet heights and lengths.
IPC-QRG-WHA-D (PDF) Single User
Wire Harness Assembly Training & Reference Guide
Englisch. 62 Seiten. Stand: 2023.
The IPC-DRM-WHA-E desk reference manual contains illustration/images of wire harness assemblies for IPC/WHMA-A-620E standard. IPC-QRG-WHA-E explains the basic acceptance criteria for wire harness assemblers, crimp operators, and QA personnel. The IPC-QRG-WHA-E is handy reference and training tool but does not replace the criteria found in IPC/WHMA-A-620E. IPC-QRG-WHA-E covers: wire types, gauges, insulation stripping, wire tinning, terminals and contact types, coaxial cables, IPC product categories and acceptance criteria, wire preparation, strand and insulation damage, conductor deformations, open and closed barrel crimp definitions and criteria, crimp deformations, cut-off tabs, punctures, insulation support crimps, inspection windows, bellmouth, conductor crimp requirements, conductor brush, closed barrel crimps, insulation damage, ribbon cable, discrete wire, cup terminals and a glossary of related wire harness terminology.
IPC-QRG-WHA-E (Hardcopy)
Wire Harness Assembly Training & Reference Guide
Englisch. Stand: 2023. 62 Seiten.
The IPC-DRM-WHA-E desk reference manual contains illustration/images of wire harness assemblies for IPC/WHMA-A-620E standard. IPC-QRG-WHA-E explains the basic acceptance criteria for wire harness assemblers, crimp operators, and QA personnel. The IPC-QRG-WHA-E is handy reference and training tool but does not replace the criteria found in IPC/WHMA-A-620E. IPC-QRG-WHA-E covers: wire types, gauges, insulation stripping, wire tinning, terminals and contact types, coaxial cables, IPC product categories and acceptance criteria, wire preparation, strand and insulation damage, conductor deformations, open and closed barrel crimp definitions and criteria, crimp deformations, cut-off tabs, punctures, insulation support crimps, inspection windows, bellmouth, conductor crimp requirements, conductor brush, closed barrel crimps, insulation damage, ribbon cable, discrete wire, cup terminals and a glossary of related wire harness terminology.
IPC-S-816 (PDF) Single User
SMT Process Guideline & Checklist
Englisch. 38 pages. Stand: Juli 1993. Keine Druckberechtigung, DRM-Schutz, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
Why waste time looking for answers? This handy, easy-to-use troubleshooting guide lists all types of processing problems and solutions for surface mount assembly. Covers bridging, skips, misalignment, placement and more. 38 pages.
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IPC-SG-141 (Hardcopy)
Specification for Finished Fabric Woven from 'S' Glass for Printed Boards
Englisch. 12 pages. Stand: Februar 1992
Covers the classification and requirements for finished fabrics woven from 'S' glass, electrical grade glass fiber yarns intended as a reinforcing material in laminated plastics for electrical and electronic use. 12 pages.
IPC-SG-141 (PDF) Single User
Specification for Finished Fabric Woven from 'S' Glass for Printed Boards
Englisch. 12 pages. Stand: Februar 1992. Keine Druckberechtigung, DRM-Schutz, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
Covers the classification and requirements for finished fabrics woven from 'S' glass, electrical grade glass fiber yarns intended as a reinforcing material in laminated plastics for electrical and electronic use. 12 pages.
IPC-SM-780 (Hardcopy)
Component Packaging and Interconnecting with Emphasis on Surface Mounting
Englisch. 138 pages. Stand: März 1988
This document examines key issues in advanced packaging techniques. Provides information on what types of parts are available, the techniques and processes necessary for their proper use, possible advantages/disadvantages or problems, how to start im plementation and where to find additional information. 138 pages.
IPC-SM-780 (PDF) Single User
Component Packaging and Interconnecting with Emphasis on Surface Mounting
Englisch. 138 pages. Stand: März 1988. Keine Druckberechtigung, DRM-Schutz, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
This document examines key issues in advanced packaging techniques. Provides information on what types of parts are available, the techniques and processes necessary for their proper use, possible advantages/disadvantages or problems, how to start im plementation and where to find additional information. 138 pages.
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IPC-SM-784 (PDF) Single User
Guidelines for Chip-on-Board Technology Implementation
Englisch.37 pages. Stand: November 1990. Keine Druckberechtigung, DRM-Schutz, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
Discusses chip types, board selection, design issues and thermal transfer methods for COB applications. Details wire bonding, TAB and flip chip designs and provides information on mounting materials, including adhesives, wires and various mechanical bonding techniques. 37 pages.
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IPC-SM-785 (PDF) Single User
Guidelines for Accelerated Reliability Testing of Surface Mount Attachments
Englisch. 50 pages. Stand: November 1992. Keine Druckberechtigung, DRM-Schutz, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
Guidelines for accelerated reliability testing of surface mount solder attachments when evaluating and extrapolating the results of these tests towards actual use environments of electronic assemblies. 50 pages.
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IPC-SM-817A (Hardcopy)
General Requirements for Dielectric Surface Mounting Adhesives
Englisch. 9 pages. Stand: Dezember 2014
Provides requirements for dielectric adhesives to hold components in place from the mounting to the soldering process and identifies test methods to ensure their long term properties.
IPC-SM-817A (PDF) Single User
General Requirements for Dielectric Surface Mounting Adhesives
Englisch. 9 pages. Stand: Dezember 2014. Keine Druckberechtigung, DRM-Schutz, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
Provides requirements for dielectric adhesives to hold components in place from the mounting to the soldering process and identifies test methods to ensure their long term properties.
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IPC-SM-840E (PDF) Single User
Qualification and Performance of Permanent Solder Mask
Englisch. 19 pages. Stand:Dezember 2010. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
Establishes the requirements for the evaluation of liquid and dry film solder mask material and for the determination of the acceptability of use on a standard printed board system. IPC-SM-840 provides two classes of requirements, T and H, to reflect functional performance requirements and testing severity based on industry/end use requirements. Coverage is given to adhesion, material qualification, resistances to solvents, and electrical requirements. Revision E incorporates requirements for fl exible cover materials used as a flexible dielectric protective layer over etched conductors and other conductive features.
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