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Handbook for Press-fit Standard for Automotive Requirements and other High-Reliability Applications

Englisch. Stand: April 2022, 40 Seiten

PC-HDBK-9798 provides guidelines and supporting information for manufacturing electronic assemblies using compliant press-fit technology. The intent is to explain the ‘‘how-to’’ and ‘‘why’’ information, and fundamentals for these processes. This handbook is supporting the IPC-9797 standard.

Enthält Anforderungen für Lötmaterialien und -prozesse für elektronische Baugruppen

Deutsch. ca. 8 Seiten. Farbig. Stand: 2017, Übersetzt im Juni 2018.

IPC J-STD-001D-Am 1 ist die erste größere Revision der Reinheitsnorm J-STD-001 seit mehr als 25 Jahren. Sie ändert die Herangehensweise der Branche an Reinheits- und Flussmittelrückstandsanforderungen. Die wichtigste Änderung dieser neuen Version sind die Anforderungen zu zulässigen Mengen von Flussmittel- und sonstigen Rückständen bei Löt- und Reinigungsprozessen für Hersteller von Produkten der Klassen 2 und 3 (sofern vom Anwender nichts anderes festgelegt wird), wobei die „... Verwendung des Werts 1,56 µg/NaCl-Äquivalenz/cm2 für den ROSE-Test (Resistivity of Solvent Extract, ionische Kontaminationsprüfung) ohne zusätzliche bekräftigende objektive Nachweise [...] nicht als zulässige Grundlage für die Qualifikation eines Fertigungsprozesses“ gilt. Zu diesem Produkt gehört außerdem die IPC-WP-019A, ein Überblick über globale Veränderungen bei den Anforderungen an ionische Reinheit. Dieses Whitepaper, das von einem Team der Aufgabengruppe 5-22A, die an der Norm J-STD-001G Am 1 arbeitet, verfasst wurde, erläutert die Hintergründe der Änderungen und stellt dem Leser einen Kontext bereit, in dem die neuen Anforderungen betrachtet werden sollten.

Automotive Addendum to IPC J-STD-001G Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610G Acceptability of Electronic Assemblies

Englisch. 137 pages. Released: 2/2/2020

The IPC J-STD-001GA/IPC-A-610GA automotive addendum to J-STD-001G and IPC-A-610G provides criteria to ensure the reliability of mission-critical soldered automotive electrical and electronic assemblies in the field under harsh environments and considers the conditions of automated high-volume production. The IPC J-STD-001GA/IPC-A-610GA addendum is not a standalone document. The addendum requires it be used in conjunction with J-STD-001G and IPC-A-610G as they are used to look at the whole of the electronics assembly manufacturing process from assembly to inspection to address board reliability requirements for the automotive industry.

Automotive Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610H Acceptability of Electronic Assemblies

Englisch. 174 pages. Released: March 2022

PC J-STD-001HA/IPC-A-610HA is the automotive addendum to J-STD-001H and IPC-A-610H. It provides criteria to ensure the reliability of soldered automotive electrical and electronic assemblies in the field under harsh environments and considers automated high-volume production. PC J-STD-001HA/IPC-A-610HA addendum is not a standalone document, and it must be used in conjunction with J-STD-001H and IPC-A-610H.

Requirements for Soldering Fluxes

Englisch. 33 Seiten. Stand: Mai 2023.

IPC J-STD-004D standard prescribes general requirements for the classification and characterization of fluxes for high quality solder interconnections. IPC J-STD-004D standard may be used for quality control and procurement purposes.

Requirements for Solder Pastes

Englisch. 22 Seiten. Stand: März 2024

IPC J-STD-005B standard lists the requirements for qualification and characterization of solder paste. It references test methods, criteria, and metal content, viscosity, slump, solder ball, tack and wetting of solder pastes. Additional support is provided in IPC-HDBK-005, Guide to Solder Paste Assessment.

Classification of Passive and Solid State Devices for Assembly Processes

Englisch. 26 Seiten. Stand: November 2022

EIA/IPC/JEDEC J-STD-075 picks up where J-STD-020 left off by providing test methods to classify worst-case thermal process limitations for electronic components. Classification is referenced to common industry wave and reflow solder profiles including lead-free processing. The classifications represent maximum process sensitivity levels and do not establish rework conditions or recommended processes for an assembler. IPC JEDEC J-STD-075A outlines a process to classify and label non-semiconductor electronic component’s Process Sensitivity Level (PSL) and Moisture Sensitivity Level (MSL) consistent with the semiconductor industry’s classification levels (J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Devices and J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices). Developed by ECIA, IPC and JEDEC.

Qualification and Performance Specification for Mass Lamination Panels for Multilayer Printed Boards

Englisch.21 pages. Stand: Juli 1994

This specification covers qualification and performance requirements of rigid mass laminated panels for use in multilayer printed boards. Testing procedures and criteria are addressed. 21 pages.

Guidelines for High Volume Microsection

Englisch. 31 pages. Stand: Oktober 1993

Discusses the many variables and problems associated with the process--from sample removal to micro-etch-- and the variables common to high volume microsection. The process variables and problems are organized so that the reader can research a specif ic issue or overview the variables of a process area. 31 pages.

Computer Numerical Control Formatting for Drillers and Routers

Englisch. Stand: August 1985, 6 Seiten

Defines a machine readable input format for Computer Numerical Control (CNC) drilling and routing machine tools used by the printed wiring board industry. The format may be used to transfer drilling and routing information between printed board designers, manufacturers and users or as the output CNC standard from converters that expand higher level design input such as IPC-D-350 data. Provides a common command structure that can assist in the board manufacturing process and is not intended to provide for every possible software enhancement.