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FED-Dokumente und IPC-Richtlinien zu Design, Leiterplatten- und Baugruppen-Fertigung jederzeit bequem bestellen.
IPC-A-620C-S (Hardcopy)
IPC/WHMA-A-620C-S: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620C
Englisch. 41 Seiten. Stand: März 2018.
IPC/WHMA-A-620C-S provides additional requirements to IPC/WHMA-A-620C to ensure the reliability of cable and wire harness assemblies that must survive the vibration and thermal cyclic environments getting to and operating in space. The IPC/WHMA-A-620C-S space addendum cannot be used as a stand alone document, it must be used with the base standard IPC/WHMA-A-620C.
IPC-A-620C-S (PDF) Single User
IPC/WHMA-A-620C-S: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620C
Englisch. 41 Seiten. Stand: März 2018. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
IPC/WHMA-A-620C-S provides additional requirements to IPC/WHMA-A-620C to ensure the reliability of cable and wire harness assemblies that must survive the vibration and thermal cyclic environments getting to and operating in space. The IPC/WHMA-A-620C-S space addendum cannot be used as a stand alone document, it must be used with the base standard IPC/WHMA-A-620C.
IPC-A-630 (PDF) Single User
Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures
Englisch. Stand: September 2013, 30 Seiten, Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
This standard is the first of its kind for IPC; the first acceptability standard for electronic enclosures. It contains acceptability criteria that pertain to the "box build" of the assembly process. This standard has been written to direct manufacturers and end users of electronic enclosures of electrical and electronic equipment to understand the best practices to meet requirements, ensuring the reliability and function of the end-item assembly for its intended design life.
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IPC-AJ-820A (Hardcopy)
Assembly & Joining Handbook
Englisch. 290 pages. Stand: Februar 2012
This handbook contains general information and descriptions of proven techniques for assembly and soldering electronic assemblies. Content was developed and reviewed by noted industry experts and experienced committee members. Sections include: handling electronic assemblies, design considerations, PCBs, components, solderability, materials, component mounting, solder techniques and connections, cleaning, conformal coating, encapsulation and potting, and rework and repair.
IPC-AJ-820A (PDF) Single User
Assembly & Joining Handbook
Englisch. 290 pages. Stand: Februar 2012, Keine Druckbereichtigung, DRM-Schutz, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
This handbook contains general information and descriptions of proven techniques for assembly and soldering electronic assemblies. Content was developed and reviewed by noted industry experts and experienced committee members. Sections include: handling electronic assemblies, design considerations, PCBs, components, solderability, materials, component mounting, solder techniques and connections, cleaning, conformal coating, encapsulation and potting, and rework and repair.
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IPC-BdMatFAM-Kit (Hardcopy)
Base Material Specifications for Printed Boards
Englisch. Inkl. IPC-4101, 4104, 4202, 4203, 4204, 4562, 4563
This is a family of specifications for board materials used in the fabrication process. IPC-4101 Specification for Base Materials for Rigid and Multilayer Printed Boards IPC-4104 Specification for High Density Interconnect (HDI) and Microvia Materials IPC-4202 Flexible Base Dielectrics for Use in Flexible Printed Circuitry IPC-4203 Cover and Bonding Material for Flexible Printed Circuitry IPC-4204 Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry IPC-4562 Metal Foil for Printed Board Applications IPC-4563 Resin Coated Copper Foil for Printed Boards Guideline
IPC-CA-821 (PDF) Single User
General Requirements for Thermally Conductive Adhesives
Englisch. 18 pages. Stand: Januar 1995. Keine Druckberechtigung, DRM-Schutz, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
Covers requirements and test methods for thermally conductive dielectric adhesives used to bond components in place. Permanent, removable and self-shimming adhesives are addressed. 18 pages.
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IPC-CC-830B WAM1 (PDF) Single User
Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies
Englisch. 18 pages. Stand: Oktober 2008. Keine Druckberechtigung, DRM-Schutz, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
This is the industry standard for qualification and quality conformance of conformal coating. Its intent is to show how to obtain maximum information with minimum test redundancy. Includes requirements and evaluations of material properties using sta ndardized test vehicles. Amendment 1 updates include new qualification, retention and conformance inspection requirements for FTIR, MIR and hydrolytic stability.
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IPC-CC-830C (Hardcopy) ENG
Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies
Englisch. 32 pages. Stand: Januar 2019.
The IPC-CC-830C standard establishes qualification and conformance requirements for electrical insulating compounds (conformal coatings). It has been designed and constructed with the intent of obtaining maximum confidence in the materials with minimum test redundancy. The IPC-CC-830C standard covers:
- The qualification and qualification retention of the conformal coating material (Table 3-1, Column A and B).
- The quality conformance of conformal coating material properties (Table 3-1, Column C).
For the purpose of this standard, the term conformal coating is used herein when referring to a type of protective coating for use on printed wiring assemblies. The conformal coating is intended to provide protection from moisture and contamination and provide electrical insulation; not as a sole source of mechanical support.
IPC-CC-830C ENG (PDF) Single User
Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies
Englisch. 32 pages. Stand: Januar 2019. Keine Druckberechtigung, DRM-Schutz, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
The IPC-CC-830C standard establishes qualification and conformance requirements for electrical insulating compounds (conformal coatings). It has been designed and constructed with the intent of obtaining maximum confidence in the materials with minimum test redundancy. The IPC-CC-830C standard covers: • The qualification and qualification retention of the conformal coating material (Table 3-1, Column A and B). • The quality conformance of conformal coating material properties (Table 3-1, Column C). For the purpose of this standard, the term conformal coating is used herein when referring to a type of protective coating for use on printed wiring assemblies. The conformal coating is intended to provide protection from moisture and contamination and provide electrical insulation; not as a sole source of mechanical support.
IPC-CF-152B (Hardcopy)
Composite Metallic Materials Specification for Printed Wiring Boards
Englisch. 39 pages. Stand: März 1998
Covers the requirements for copper/invar/copper (CIC), copper/molybdenum/ copper (CMC) and three-layer composites for use in electronic applications. IPC-CF-152B includes specification sheets, which outline engineering and performance data for each t ype of composite metallic materials. 39 pages.
IPC-CH-65B (PDF) Single User
Guidelines for Cleaning of Printed Boards and Assemblies
Englisch. 200 pages. Stand: July 2011. Keine Druckberechtigung, DRM-Schutz, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
This is a collection of information on electronic board and assembly cleaning in a single location. This major revision explains the relationship between materials, processes, and contaminants in fabrication and assembly operations. It also addresses cleanliness assessment and process control in relation to cleanliness. Color pictures help with understanding. Supersedes IPC-CH-65A, IPC-SC-60A, IPC-SA-61A, IPC-AC-62A, IPC-SM-839.
IPC-CM-770E (PDF) Single User
Component Mounting Guidelines for Printed Boards
Englisch. 150 pages. Stand: Januar 2004. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
This revision provides effective guidelines in the preparation and attachment of components for printed circuit board assembly and reviews pertinent design criteria, impacts and issues. It contains techniques for assembly (both manual and machines in cluding SMT, BGA and flip chip) and consideration of, and impact upon, subsequent soldering, cleaning, and coating processes. 150 pages.
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IPC-CoatBdsAssyFAM-Kit (Hardcopy)
Coating Specifications for Boards and Assemblies
Englisch. Inkl. IPC-HDBK-830, SM-840, HDBK-840
This is a family of documents for coatings used in the printed board fabrication and assembly processes. Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies IPC-HDBK-830 Guidelines for Design, Selection, and Application of Conformal Coatings IPC-SM-840 Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials IPC-HDBK-840 Solder Mask Handbook
IPC-D-279 (PDF) Single User
Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies
Englisch. 137 pages. Stand: Juli 1996. Keine Druckberechtigung, DRM-Schutz, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
Establishes design concepts, guidelines and procedures for reliable printed wiring assemblies. Focuses on SMT or mixed technology PWAs, specifically addressing the interconnect structure and the solder joint itself. Discusses substrates, components, attachment materials, costings and assembly processes and testing considerations. In addition, this document contains detailed appendices covering: solder attachments; plated-through via structures; insulation resistance; thermal considerations; envi ronmental stresses; coefficient of thermal expansion; electrostatic discharge; solvents; testability; corrosion aerospace and high altitude concerns. 137 pages.
IPC-D-310C (PDF) Single User
Guidelines for Phototool Generation and Measurement Techniques
Englisch. 68 pages. Stand: Juni 1991. Keine Druckberechtigung, DRM-Schutz, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
This document provides manufacturing and design considerations, input data requirements, test coupons, process control, tape and preform artwork, cut and strip artwork, vector photoplotting, rasterplotting, direct imaging, measurement and quality ass urance. 68 pages.
IPC-D-322 (Hardcopy)
Guidelines for Selecting Printed Wiring Board Sizes Using Standard Panel Sizes
Englisch. 4 pages. Stand: September 1991
Defines guidelines for choosing sizes of printed wiring boards using standard fabrication panel sizes. 4 pages.
IPC-D-322 (PDF) Single User
Guidelines for Selecting Printed Wiring Board Sizes Using Standard Panel Sizes
Englisch. 4 pages. Stand: September 1991. Keine Druckberechtigung, DRM-Schutz, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
Defines guidelines for choosing sizes of printed wiring boards using standard fabrication panel sizes. 4 pages.
IPC-D-325A (PDF) Single User
Documentation Requirements for Printed Boards
Englisch. 94 pages. Stand: Mai 1995. Keine Druckberechtigung, DRM-Schutz
Establishes the general requirements for documentation necessary to fully describe end product printed boards, regardless of raw material, special fabrication requirements, layer count or end product usage. Includes master drawing requirements, board definition and artwork/phototooling. 94 pages.
IPC-D-326A (PDF) Single User
Information Requirements for Manufacturing Electronic Assemblies
Englisch. 5 pages. Stand: Januar 2004. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
Covers information requirements for the procurement of material, assembly, inspection, test, burn-in and delivery of electronic assemblies. 5 pages.
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