J-STD-609B (PDF) Single User
Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-Free) and Other Attributes
Englisch. 24 Seiten. Stand 2016. KeineDruckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
This standard provides a marking and labeling system that aids in assembly, rework, repair and recycling and provides for the identification of:
1) those assemblies that are assembled with lead-containing or lead-free solder; 2) components that have lead-containing or lead-free second level interconnect terminal finishes and materials; 3) the maximum component temperature not to be exceeded during assembly or rework processing; 4) the base materials used in the PCB construction, including those PCBs that use halogen-free resin; 5) the surface finish of PCBs; and 6) the conformal coating on PCBAs.
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Study of Quality BM for Electronics Assembly 2019
IPC-Study of Quality Benchmarks for Electronics Assembly 2019
Englisch. 153 Seiten, Stand 31/07/2019, Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
Study of Quality Benchmarks for Electronics Assembly 2019 is a global survey-based study covering production data, yields, defect rates (DPMO), cost of rework and scrap, customer acceptance of reworked boards, test and inspection methods used, customer returns, supplier performance, customer satisfaction and certification data. Companies that assemble printed boards and other electronic products can use this report to compare their performance to industry averages. Medians, and percentile data are also reported. The survey sample includes 57 contract electronics manufacturers and OEMs worldwide with total sales revenue ranging from under $10 million to more than $1 billion. Aggregate data are segmented by company size tier, region and type of production, including rigid PCBs, flexible circuits, finished end products or systems, mechanical assembly, cable and harness, and discrete wiring terminals and connectors. Released July 2019