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HDBK-4691 (PDF) Single User
Handbook on Adhesive Bonding in Electronic Assembly Operations
Englisch, Seiten 58. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
This handbook assists individuals who make choices regarding adhesive bonding or who must work in adhesive bonding operations for electronic assemblies. The full-color guide also provides guidelines for design, selection and application of adhesive bonding.
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HDBK-830A (PDF) Single User
Guidelines for Design, Selection and Application of Conformal Coatings
Englisch. 183 Seiten. Stand: Oktober 2013. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
This handbook is a compilation of the conformal coating industry's practical experience, and will assist the designers and users of conformal coatings in making informed choices. Users will better understand the properties of the various conformal coatings, the results to be achieved by its application and how to verify that these goals have been met. Use this document as a supplement in conjunction with the industry standard for qualification and quality conformance of conformal coating, IPC-CC-830B. Revision "A" significantly updates the environmental, health, and safety information when dealing with conformal coatings including advice on use of Web-based MSDS reporting. Use of conformal coating for tin whisker and fungus mitigation is also discussed as well as flammability issues. Content of the standard includes the very latest from industry experts on the application and selection of conformal coatings.
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HDBK-840 (PDF) Single User
Solder Mask Handbook
Englisch. Stand: September 2006; 72 Seiten, Keine Druckberechtigung, DRM-Schutz, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
IPC-HDBK-840 supplements the solder mask requirements established in IPC specifications such as IPC-SM-840 and IPC-6012 by providing detailed information on solder mask types, application processes, pre- and post- assembly processes, characteristics and properties that are useful in the selection and use of the most appropriate mask type for a given application. Applicable to solder mask manufacturers, processing equipment manufacturers, PCB manufacturers, assembly manufacturers and ancillary ch emical suppliers.
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HDBK-850 (PDF) Single User
Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly
Englisch. 68 pages. Stand: July 2012. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
This handbook has been written to assist the designers and users of potting and encapsulation in understanding the characteristics of various materials, as well as the factors that can modify those characteristics when the potting or encapsulation is applied. The equipment and processes involved in the preparation and application of potting and encapsulation are also covered. The challenge in developing this handbook is that there has been no clear industry definition that distinguished between potting and encapsulation. From glob-top to dam-and-fill, this document uses terminology associated with processes related only to electronic printed circuit board assembly and protection. Understanding and accounting for these materials can ensure the reliability and function of electronics.
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ICP-4412C-EN (PDF) Single User
Specification for Finished Fabric Woven from "E" Glass for Printed Boards
Englisch. 28 Seiten. Stand: November 2021
The IPC-4412C covers the requirements for reinforcements woven from "E"glass yarn. These reinforcements are used in the production of prepregs, some of which are pressed into laminates. These prepregs and laminates are the base materials for rigid and mulitlayer printed boards. The IPC-4412C standard contains tables which describe each fabriic style in detail including the yarn used, the number of yarns per unit area, the basis weight and the thickness. The IPC-4412C standard also includes the quality assurance aspects of these strategic building blocks for base materials.
IPC-0040 (Hardcopy)
Optoelectronic Assembly and Packaging Technology
Die völlig neue Richtlinie vom Mai 2003 umfasst 163 Seiten A4 und beschreibt die Einführung optischer und optoelektronischer Packaging-Technologien. Behandelte Problemkreise: Technologieauswahl, Designüberlegungen, Materialeigenschaften, Bauelementem ontage, Verbindungsstrukturen, Montageprozess, Test, Anwendung, Nacharbeit, Reparatur, Zuverlässigkeit der eingefügten optoelektronischen Bauelemente. Die optoelektronischen Packaging-Technologien berücksichtigen aktive und passive Bauelemente, diskr ete Glasfaserkabel und deren Kennwerte sowie Besonderheiten ihrer Montage als Teil von Modulen bzw. Submodulen, Leiterplatten.
IPC-1071B (Hardcopy)
Intellectual Property Protection in Printed Board Manufacturing
Englisch. Stand: 2016, 17 Seiten
This standard enables board manufacturers to develop requirements, policies and practices for protecting customers' intellectual property (IP). It also serves as the basis for an IPC certification audit program to ensure a facility is in compliance with this IP standard..
IPC-1071B (PDF) Single User
Intellectual Property Protection in Printed Board Manufacturing
Englisch. Stand: 2016, 17 Seiten. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
This standard enables board manufacturers to develop requirements, policies and practices for protecting customers' intellectual property (IP). It also serves as the basis for an IPC certification audit program to ensure a facility is in compliance with this IP standard.
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IPC-1072 (Hardcopy)
Intellectual Property Protection in Electronic Assembly Manufacturing
Englisch. 13 Seiten, Stand 2016, (Hardcopy)
The purpose of this standard is to provide requirements and best practices for EMS companies to ensure protection of intellectual property for their customers. By using this standard, EMS companies can provide their customers assurance that the intellectual property built into their circuit boards is protected. The document is also a companion to IPC-1071 for printed circuit board manufacturers.
IPC-1072 (PDF) Single User
Intellectual Property Protection in Electronic Assembly Manufacturing
Englisch. 13 Seiten, Stand 2016, Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
The purpose of this standard is to provide requirements and best practices for EMS companies to ensure protection of intellectual property for their customers. By using this standard, EMS companies can provide their customers assurance that the intellectual property built into their circuit boards is protected. The document is also a companion to IPC-1071 for printed circuit board manufacturers.
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IPC-1601-DE (PDF) Single User
Richtlinie für die Handhabung und Lagerung von Leiterplatten
Deutsch. August 2010. 18 Seiten. Keine Druckberechtigung, DRM geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
Der einzige Industrie-Standard für das Handling, die Verpackung und Lagerung von Leiterplatten. Die Anwendung dieser Richtlinie soll Leiterplatten schützen vor Verunreinigung, mechanischer Beschädigung, Verschlechterung der Lötbarkeit und Feuchteaufnahme. Berücksichtigt werden Verpackungsmaterialien- und methoden, Produktionsumgebung, Handling und Transport der Produkte, etablierte und zu empfehlende Feuchtegehalte, anerkannte Trocknungsprofile für die Entfernung von Feuchtigkeit und die Auswirkung der Trocknung auf die Lötbarkeit der Leiterplatten. 18 Seiten, Veröffentlichung August 2010, Übersetzung Oktober 2011
IPC-1601-DE Papierversion
Richtlinie für die Handhabung und Lagerung von Leiterplatten
Deutsch. August 2010. 18 Seiten
Die neue Richtlinie liefert Vorschläge für die angemessene Handhabung, Verpackungsmaterialien und -methoden, Umgebungs- und Lagerbedingungen für Leiterplatten. Diese haben den Zweck Leiterplatten vor Verunreinigungen, physischer Beschädigung, Beeint rächtigung der Lötbarkeit, elektrostatischer Entladung (ESD), falls erforderlich und der Aufnahme von Feuchtigkeit zu schützen.
Aufgenommene Feuchtigkeit in Basismaterialien kann interne Delamination oder exzessive Spannungen in den Durchmetallis ierungen oder anderen Strukturen hervorrufen. Dies ist eine besondere Herausforderung bei höheren Temperaturen in bleifreien Lötprozessen. Behandelt werden alle Phasen von der Herstellung der unbestückten Leiterplatte über die Auslieferung, den Ware neingang, die Lagerung, Bestückung und den Lötprozess.
IPC-1601A (PDF) Single User
Printed Board Handling and Storage Guidelines
Englisch. 19 Seiten. Stand: 2016. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
The industry's sole guideline on the handling, packaging and storage of printed boards. The guidelines in this document are intended to protect printed boards from contamination, physical damage, solderability degradation and moisture uptake. Consideration is given to packaging material types and methods, production environment, handling and transport of product, and establishing baking profiles for moisture removal. Revision A provides expanded coverage of moisture barrier bags (MBBs), the impact of baking on printed board solderability, ESD issues, moisture concerns for etched cores and composites, desiccant material and HIC cards, and example flowdowns of packaging and handling requirements.
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IPC-1602 (Hardcopy)
Standard for Printed Board Handling and Storage
Englisch. 36 Seiten. Stand: April 2020.
The IPC-1602 standard provides requirements intended to protect printed boards from contamination, physical damage, solderability degradation and moisture uptake. Consideration is given to packaging materials types and methods, production environment, handling and transport of product, and establishing baking profiles for moisture removal. IPC-1602 is now providing requirements that can be called out within procurement documentation. The IPC-1602 standard provides expanded coverage of moisture barrier bags (MBBs), the impact of baking on printed board solderability, ESD issues, moisture concerns for etched cores and composites, desiccant material and HIC cards, and example of flow downs of packaging and handling requirements.
IPC-1602 (PDF) Single User
Standard for Printed Board Handling and Storage
Englisch. 36 Seiten. Stand: April 2020. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
The IPC-1602 standard provides requirements intended to protect printed boards from contamination, physical damage, solderability degradation and moisture uptake. Consideration is given to packaging materials types and methods, production environment, handling and transport of product, and establishing baking profiles for moisture removal. IPC-1602 is now providing requirements that can be called out within procurement documentation. The IPC-1602 standard provides expanded coverage of moisture barrier bags (MBBs), the impact of baking on printed board solderability, ESD issues, moisture concerns for etched cores and composites, desiccant material and HIC cards, and example of flow downs of packaging and handling requirements.
IPC-1752A WAM1,2 & 3 (Hardcopy)
Materials Declaration Management Standard
Englisch, 68 Seiten Stand: 2018
IPC 1752A establishes a standard reporting format for material declaration data exchange between supply chain participants and supports reporting of bulk materials, components, printed boards, sub-assemblies, and products. This standard is not supported by a PDF form. In the A revision, the data exchange format is specified as Extensible Markup Language (XML) and IPC-1752A relies on third party solution providers to provide software tools compatible with the standard. Starting in 2014, IPC introduced an annual review process to determine a list of verified solution providers for the IPC-1752A standard. Companies who receive this accolade have submitted sample files that have been verified to the current IPC-1752A requirements. Amendment 3 provides important enhancements to the IPC-1752A standard, including Identity codes to facilitate identification of declarable substances and declarable substance groups in a Class C compliance declaration XML. Prior to Amendment 3, software tools carried out the identification by looking at the text name of the declarable substance or declarable substance group. However, the text name for a declarable substance group can be up to 300 characters long and any discrepancies can cause a software tool to fail to upload the RCD XML. Amendment 3 provides a 5-digit identification code which enables software tools to more easily identify each declarable substance and declarable substance group in the RCD XML file. Defined list of statements, identity codes and revision numbers to support Class A declarations. Each Class A query list now includes a defined list of statements and identity codes. For example, the Class A declaration “Product(s) meets EU REACH substance restrictions” has identify code “01” in query list EUREACH-ARTICLE67-1272/2013. All references to JIG-101 have been replaced with references to IEC 62474. The last version of the JIG-101 list (version 4.1) was published in May 2012. The JIG-101 list is no longer maintained and instead the IEC 62474 has introduced a replacement list of regulated substances and regulated substance groups.
IPC-1752A WAM1,2 & 3 (PDF) Single User
Materials Declaration Management Standard
Englisch, 68 Seiten Stand: 2018. Keine Druckberechtigung, DRM-Schutz, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
IPC 1752A establishes a standard reporting format for material declaration data exchange between supply chain participants and supports reporting of bulk materials, components, printed boards, sub-assemblies, and products. This standard is not supported by a PDF form. In the A revision, the data exchange format is specified as Extensible Markup Language (XML) and IPC-1752A relies on third party solution providers to provide software tools compatible with the standard. Starting in 2014, IPC introduced an annual review process to determine a list of verified solution providers for the IPC-1752A standard. Companies who receive this accolade have submitted sample files that have been verified to the current IPC-1752A requirements. Amendment 3 provides important enhancements to the IPC-1752A standard, including Identity codes to facilitate identification of declarable substances and declarable substance groups in a Class C compliance declaration XML. Prior to Amendment 3, software tools carried out the identification by looking at the text name of the declarable substance or declarable substance group. However, the text name for a declarable substance group can be up to 300 characters long and any discrepancies can cause a software tool to fail to upload the RCD XML. Amendment 3 provides a 5-digit identification code which enables software tools to more easily identify each declarable substance and declarable substance group in the RCD XML file. Defined list of statements, identity codes and revision numbers to support Class A declarations. Each Class A query list now includes a defined list of statements and identity codes. For example, the Class A declaration “Product(s) meets EU REACH substance restrictions” has identify code “01” in query list EUREACH-ARTICLE67-1272/2013. All references to JIG-101 have been replaced with references to IEC 62474. The last version of the JIG-101 list (version 4.1) was published in May 2012. The JIG-101 list is no longer maintained and instead the IEC 62474 has introduced a replacement list of regulated substances and regulated substance groups.
IPC-1752B (PDF) Single User
Materials Declaration Management Standard
Englisch, 92 Seiten Stand: 2020.
The IPC-1752B standard establishes the requirements for exhanging material and substance data between suppliers and their customers for electrical and electronics products and other produicts. IPC-1752B includes data fields to help supply chain members transfer materials data required for submission into the ECHA SCIP database.
IPC-1755 WAM1-2 (Hardcopy)
IPC-1755 WAM1&2 Conflict Minerals Data Exchange Standard
Englisch, 44 Seiten Stand: 2017
This document establishes a standard reporting format for exchange of information between supply chain participants about conflict minerals contained in suppliers' products and supports reporting at the company and product level, as mutually agreed upon between partners.
IPC-1755 WAM1-2 (PDF) Single User
IPC-1755 WAM1&2 Conflict Minerals Data Exchange Standard
Englisch. 44 Seiten, Stand 2017, Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
This document establishes a standard reporting format for exchange of information between supply chain participants about conflict minerals contained in suppliers' products and supports reporting at the company and product level, as mutually agreed upon between partners.
