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IPC-2223D (Hardcopy)
Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards
Englisch. Stand: 2016 , 60 Seiten
Used in conjunction with IPC-2221, IPC-2223 establishes the specific requirements for the design of flexible printed boards and forms of component mounting and interconnecting structures. The flexible materials used in the structures are comprised of insulating films, reinforced and/or non-reinforced dielectric in combination with metallic materials. Revision D provides new design guidance and requirements for material selection and construction, selective (button) plating, minimum bending for flexible circuits with coverlay, impedance and capacitance control, unsupported edge conductors/fingers and copper filled vias/microvias.
IPC-2223D (PDF) Single User
Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards
Englisch. Stand: 2016, 60 Seiten. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
Used in conjunction with IPC-2221, IPC-2223 establishes the specific requirements for the design of flexible printed boards and forms of component mounting and interconnecting structures. The flexible materials used in the structures are comprised of insulating films, reinforced and/or non-reinforced dielectric in combination with metallic materials. Revision D provides new design guidance and requirements for material selection and construction, selective (button) plating, minimum bending for flexible circuits with coverlay, impedance and capacitance control, unsupported edge conductors/fingers and copper filled vias/microvias.
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IPC-2223E (Hardcopy)
Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards
Englisch. Stand: Januar 2020 , 60 Seiten
IPC-2223E used in conjunction with IPC-2221, IPC-2223 establishes the specific requirements for the design of flexible printed boards and forms of component mounting and interconnecting structures. The flexible materials used in the structures are comprised of insulating films, reinforced and/or non-reinforced dielectric in combination with metallic materials. IPC-2223E provides new design guidance and requirements for fabrication drawings, hole to edge spacing, bend area conductor considerations, dielectric thickness between rigid and flexible regions and dual row zero insertion force (ZIF) connectors.
IPC-2223E (PDF) Single User
Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards
Englisch. Stand: Januar 2020, 60 Seiten. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
IPC-2223E used in conjunction with IPC-2221, IPC-2223 establishes the specific requirements for the design of flexible printed boards and forms of component mounting and interconnecting structures. The flexible materials used in the structures are comprised of insulating films, reinforced and/or non-reinforced dielectric in combination with metallic materials. IPC-2223E provides new design guidance and requirements for fabrication drawings, hole to edge spacing, bend area conductor considerations, dielectric thickness between rigid and flexible regions and dual row zero insertion force (ZIF) connectors.
IPC-2225 (PDF) Single User
Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies
Englisch. 44 pages.Stand: Mai 1998. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
Used in conjunction with IPC-2221, IPC-2225 establishes the requirements and other considerations (thermal, electrical, electromechanical and mechanical) for the design of Single Chip Module (SCM-L), MCM or MCM-L assemblies. Key concepts include adhe sive interconnection information, typical die attach materials, microvia material properties and relationships with DFM and DFE. IPC-2221 and IPC-2225 together supersede IPC-D-275. 44 pages.
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IPC-2226A (PDF) Single User
Sectional Design Standard for High Density Interconnect (HDI) Printed Boards
Englisch. Stand: 2017. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
PDF-Datei ist DRM geschützt (rechnergebunden)! Bitte nennen Sie beim Kauf den vollständigen Namen und die E-Mailadresse des Users. IPC-2226A, Sectional Design Standards for High Density Interconnect (HDI) Printed Boards is used in conjunction with IPC-2221B. The IPC-2226A standard establishes requirements and considerations for the design of high density interconnect (HDI) printed boards and microvia technology. Revision A constitutes a substantial update to the document, with an all new color key for HDI constructions, new coverage of routing density factors and a complete rebuild of feature size recommendations, including aspect ratio, capture and target land sizes. Almost every graphic in Sections 3, 5 and 9 has been revised and/or supplemented with new graphics addressing various microvia formation processes and HDI constructions
IPC-2231A (Hardcopy)
DFX Guidelines
Englisch. Stand: April 2021 , 60 Seiten
IPC-2231A provides guidelines for establishing a best practice methodology for use in developing a formal DFX (Design for Manufacturing, Fabrication, Assembly, Testability, Cost, Reliability, Environment, Reuse) process for layout of printed boards.
IPC-2231A (PDF) Single User
DFX Guidelines
Englisch. Stand: April 2021, 60 Seiten. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
The IPC-2231 standard provides guidelines for establishing a best practice methodology for use in developing a formal DFX (Design for Manufacturing, Fabrication, Assembly, Testability, Cost, Reliability, Environment, Reuse) process for layout of printed board assemblies that utilize surface mount and through hole devices.
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IPC-2251 (PDF) Single User
Design Guide for the Packaging of High Speed Electronic Circuits
Englisch. Stand: November 2003. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
This guideline addresses the major factors influencing the design of high-speed circuitry. Considerations include electrical noise, electromagnetic interference, signal propagation time, impedance, thermo-mechanical environmental protection, and heat dissipation. Supersedes IPC-D-317A. Key improvements over the IPC-D-317A document include updated impedance models for embedded microstrip, centered stripline and dual stripline geometries, expanded EMI layout practices, signal integrity design cons traints, enhanced graphics and updated terms and definitions.
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IPC-2252 (PDF) Single User
Design Guide for RF/Microwave Circuit Boards
Englisch. 30 pages. Stand: Juni 2002. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
This design guideline provides RF and microwave circuit design engineers, printed circuit board engineers, packaging engineers and drafters with the information necessary to design practical, functional and cost effective microwave circuit boards in the frequency range of 100 MHz to 30 GHz. This guide also applies to operations in the region where distributed circuits are used instead of conventional lumped circuit elements. 30 pages.
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