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Connected Factory Exchange (CFX)

Englisch. 66 Seiten, Stand: Januar 2023

This standard establishes the requirements for the omnidirectional exchange of information between manufacturing processes and associated host systems for assembly manufacturing. This standard applies to communication between all executable processes in the manufacture of printed board assemblies, automated, semiautomated and manual, and is applicable to related mechanical assembly and transactional processes. IPC-2591, Version 1.7 includes enhancements for closed-loop between AOI and SPI and fields added to Heartbeat to provide repeated active fault and recipe information in each message.

Generic Requirements for Electronic Product Documentation

Englisch. 26 Seiten. Stand: März 2010. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)

This standard establishes the generic requirements for a document set describing electronic products, and the methodology used for revision control and configuration management of the information. The generic descriptions apply to the entire document set and are used to define and maintain the electronic product. The methodology permits different grades of completeness of the documentation, as well as identifying the various products, packaging and interconnection techniques for which unambiguou s documentation is required. The requirements pertain to both hard copy and electronic data descriptions.
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Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions)

Englisch. 26 Seiten. März 2010. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)

This standard establishes the requirements for the documentation of electronic diagrams used as the foundation for defining the electrical interconnectivity of electronic products. The description pertains to either schematic diagrams, logic diagrams or Boolean truth tables and includes methodology for defining circuit flow, electrical or functional restrictions, or maintenance test procedures used to design or maintain the electronic product. The requirements pertain to hard copy, electronic co py or electronic data descriptions.
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Sectional Requirements for Electronic Diagramming Symbol Generation Methodology

Englisch. 31 Seiten. Stand: März 2010. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)

This standard establishes the requirements for generation of electronic symbols used in the documentation of electronic diagrams that define the electrical interconnectivity of electronic products. The descriptions pertain to schematic symbols, logic symbols or Boolean truth tables required to define the circuit configuration. Where appropriate, the standard also includes methodology for defining circuit flow, electrical or functional restrictions, or maintenance test procedures used to design o r maintain the electronic product. The requirements pertain to both hard copy and electronic data descriptions. 31 pages.
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Sectional Requirements for Board Fabrication Documentation

Englisch. 59 Seiten. Stand: März 2010. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)

This standard establishes the requirements for the documentation of printed circuit board fabrication, and identifies the physical attributes and performance requirements of the unpopulated product. The descriptions apply to rigid, flexible, inorgani c substrates or any combination thereof. The construction may be single, double, multilayered, or HDI technology and may include embedded (integrated) components. The requirements pertain to both hard copy and electronic data descriptions.
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Printed Board Dimensions and Tolerances

Englisch. 66 pages. Stand: Juli 2000. Keine Druckberechtigung, DRM-Schutz, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)

The definitive standard on printed board dimensions and tolerances is finally here! IPC-2615 comprehensively covers dimensioning and tolerancing of electronic packaging and is consistent with other IPC printed board standards such as IPC-6012A and IP C-2221. The document includes fundamental dimensioning and tolerancing rules, positional, profile, orientation and form tolerances and detailed geometric symbology. This new standard encompasses over 100 new and revised illustrations. Invaluable to t he PWB designer, this document will help manufacturers and board purchasers achieve the most manufacturable board designs. Supersedes IPC-D-300G. 66 pages.

Guidelines for Electrically Conductive Surface Mount Adhesives

Englisch. 15 pages. Stand: Juli 1996. Keine Druckberechtigung, DRM-Schutz, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)

IPC-3406 offers guidelines for selecting electrically conductive adhesives for use in electronics manufacturing as solder alternatives. The process discussion attempts to stay within the bounds of the existing solder assembly infrastructure. Both maj or types of adhesives, isotropic (conducting equally in all directions) and anisotropic (unidirectional conductivity) are covered. The two major divisions of polymer adhesives, thermosets and thermoplastics are described. 15 pages.

General Requirements for Anisotropically Conductive Adhesives Films

Englisch. 25 pages. Stand: November 1996. Keine Druckberechtigung, DRM-Schutz, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)

This document covers requirements and test methods for anisotropically conductive adhesive films used to bond and electrically connect components. Applications include the following: flexible PWB-to-glass, flexible PWB-to-rigid PWB, flip chip-to-glas s, flip chip-to-flexible PWB, flip chip-to-rigid PWB, and fine pitch SMD. The adhesive film may be supplied pre-attached to a flexible circuit or other product. 25 pages.