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IPC-4203B (PDF) Single User
Cover and Bonding Material for Flexible Printed Circuitry
Englisch. 44 Seiten. Stand: Januar 2013. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
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IPC-4203B establishes the classification system, the qualification and quality conformance requirements for dielectric films coated with an adhesive on one or both sides, which are to be used as cover material and/or bondply for flexible printed circuitry, as well as supported or unsupported adhesive films to be used in the fabrication of flexible printed circuitry. IPC-4203B does not cover non-flexible adhesives designed to be used in the rigid board areas of rigid flex constructions, which are covered in IPC-4101. Materials such as liquid-applied covercoat (see 3.1.8.3) are covered in IPC-SM-840 and are excluded from this document. 38 pages.
IPC-4204B (PDF) Single User
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards
Englisch. 56 Seiten. Stand: August 2018
IPC-4204B establishes the classification system, the qualification and quality performance requirements for flexible metal-clad dielectric materials to be used for the fabrication of flexible printed boards. It encompasses 12 specification sheets that result from the combinations of various copper foil claddings; a polymer base dielectric selected from polyesters, polyimides, liquid crystal polymers and at least nine versions of polymer adhesives as well as adhesiveless bonding agents. The net result of these material combinations provide the industry with suitable clad, flexible dielectrics for fabricating flexible printed board interconnections. IPC-4204B also addresses how to utilize legacy designs that refer to earlier, out-of-date material designations
IPC-4411A (PDF) Single User
Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement
Englisch. 22 pages. Stand: November 2003. Keine Druckberechtigung, DRM-Schutz, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
Covers the nomenclature, definitions and requirements for reinforcement made from nonwoven para-aramid fibers. Para-aramid reinforcement is primarily used in PCBs for HDI and high speed/high frequency applications. IPC-4411A also includes specificati on sheets, which can be used when selecting and purchasing nonwoven para-aramid reinforcement. Includes the incorporation of 14 new nonwoven para-aramid reinforcement specification sheets and the deletion of four nonwoven para-aramid materials that a re no longer commercially available. Due to a test method correction, all specification sheets have been updated. 22 pages.
IPC-4412B (Hardcopy)
Specification for Finished Fabric Woven from E Glass for Printed Boards
Englisch. 27 pages. Released: 06/2013
IPC-4412B exhaustively covers the classification and requirements for finished fabrics that are formed by plain woven glass fiber yarns. Simply, these yarns are appropriately sized bundles of continuous filament, electrical-grade ("E" glass) borosilicate glass. Bulk "E" glass, for ease of description, is composed of a blend of raw metal oxides that form a borosilicate glass upon melting. Once melted, the glass formed loses all relation to the raw metal oxides, including the network forming boron oxides or borates. This specification includes two extensive tables of finished fabric glass styles, one in SI (metric) units and the other in U.S. (English) units. Supersedes IPC-4412A with Amendments 1, 2 and 3, IPC-EG-140 with Amendments 1 & 2 and, in turn, IPC-EG-140.
IPC-4412B (PDF) Single User
Specification for Finished Fabric Woven from E Glass for Printed Boards
Englisch. 27 seiteb. Stand: Juni 2013. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
IPC-4412B exhaustively covers the classification and requirements for finished fabrics that are formed by plain woven glass fiber yarns. Simply, these yarns are appropriately sized bundles of continuous filament, electrical-grade ("E" glass) borosilicate glass. Bulk "E" glass, for ease of description, is composed of a blend of raw metal oxides that form a borosilicate glass upon melting. Once melted, the glass formed loses all relation to the raw metal oxides, including the network forming boron oxides or borates. This specification includes two extensive tables of finished fabric glass styles, one in SI (metric) units and the other in U.S. (English) units. Supersedes IPC-4412A with Amendments 1, 2 and 3, IPC-EG-140 with Amendments 1 & 2 and, in turn, IPC-EG-140.
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IPC-4412C-EN (Hardcopy)
Specification for Finished Fabric Woven from "E" Glass for Printed Boards
Englisch. 28 Seiten. Stand: November 2021
The IPC-4412C covers the requirements for reinforcements woven from "E"glass yarn. These reinforcements are used in the production of prepregs, some of which are pressed into laminates. These prepregs and laminates are the base materials for rigid and mulitlayer printed boards. The IPC-4412C standard contains tables which describe each fabriic style in detail including the yarn used, the number of yarns per unit area, the basis weight and the thickness. The IPC-4412C standard also includes the quality assurance aspects of these strategic building blocks for base materials.
IPC-4413 (Hardcopy)
Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards
Englisch. 28 Seiten. Stand: Dezember 2023
IPC-4413 standard covers finished fabrics woven from low Dk electrical grade glass fiber yarns that are intended as a reinforcing material in laminated plastics for electrical and electronic use. All fabrics covered by IPC-4413 standard are plain weave.
IPC-4552-DE Papierversion
Spezifikation für chemisch Nickel/Gold (ENIG) für Oberflächen von Leiterplatten
Deutsch, Stand: Oktober 2002, 27 Seiten farbig
Anwendungsbereich:
Diese Spezifikation legt die Anforderungen an chemisch Nickel/Gold (ENIG)-Oberflächen als Endoberflächen von Leiterplatten fest. Die Richtlinie spezifiziert auf der Basis von Leistungskriterien die Anforderungen an ENIG-Schichtdi cken. Sie ist für die Verwendung durch Lieferanten, Leiterplattenhersteller, Elektronik-Dienstleister (EMS) und OEM-Hersteller vorgesehen.
ANSI Approved
In answer to numerous industry requests for guidance on Electroless Nickel/Immersion Gold ( ENIG), the IPC-4552 has been developed. Containing full color photographs, this specification sets the requirements for the use of ENIG as a surface finish for printed circuit boards. It includes requirements for ENIG deposit thicknesses based on per formance criteria. It will be an invaluable resource for use by suppliers, board fabricators, electronics manufacturing services (EMS) and original equipment manufacturers (OEMs). The specification's Appendix also includes a FREE copy of the highly s ought after technical paper 'Standard Developments Efforts of Electroless Nickel Immersion Gold' by George Milad and Gerard O'Brien.
The ENIG board surface finish is an electroless nickel layer capped with a thin layer of immersion gold. The immer sion gold protects the underlying nickel from oxidation or passivation over its intended life. It is a multifunctional surface finish, applicable to soldering, aluminum wire bonding, press fit connections, and as a contact surface.
IPC-4552-DE-CD Single User
Spezifikation für chemisch Nickel/Gold (ENIG) für Oberflächen von Leiterplatten
Deutsch, Stand: Oktober 2002, 27 Seiten farbig, Einzelplatzlizenz - Nicht druckbar
Anwendungsbereich:
Diese Spezifikation legt die Anforderungen an chemisch Nickel/Gold (ENIG)-Oberflächen als Endoberflächen von Leiterplatten fest. Die Richtlinie spezifiziert auf der Basis von Leistungskriterien die Anforderungen an ENIG-Schichtdi cken. Sie ist für die Verwendung durch Lieferanten, Leiterplattenhersteller, Elektronik-Dienstleister (EMS) und OEM-Hersteller vorgesehen.
ANSI Approved
In answer to numerous industry requests for guidance on Electroless Nickel/Immersion Gold ( ENIG), the IPC-4552 has been developed. Containing full color photographs, this specification sets the requirements for the use of ENIG as a surface finish for printed circuit boards. It includes requirements for ENIG deposit thicknesses based on per formance criteria. It will be an invaluable resource for use by suppliers, board fabricators, electronics manufacturing services (EMS) and original equipment manufacturers (OEMs). The specification's Appendix also includes a FREE copy of the highly s ought after technical paper 'Standard Developments Efforts of Electroless Nickel Immersion Gold' by George Milad and Gerard O'Brien.
The ENIG board surface finish is an electroless nickel layer capped with a thin layer of immersion gold. The immer sion gold protects the underlying nickel from oxidation or passivation over its intended life. It is a multifunctional surface finish, applicable to soldering, aluminum wire bonding, press fit connections, and as a contact surface.
IPC-4552A (Hardcopy)
IPC-4552A: Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards
Englisch. 148 Seiten. Stand: 2017
The IPC-4552A performance specification sets requirements for Electroless Nickel/Immersion Gold (ENIG) deposit thicknesses for applications including soldering, wire bonding and as a contact finish. The IPC-4552A is intended for use by chemical suppliers, printed board manufacturers, electronics manufacturing services (EMS) and original equipment manufacturers (OEM). The IPC-4552A standard may be used to specify acceptance criteria to meet performance requirements in addition to those found in the IPC-6010-FAM Printed Board Performance Specifications. The ENIG deposit specified by using this document will meet the highest coating durability rating as specified in the J-STD-003 printed board solderability specification.
The IPC-4552A specification is based on three critical factors:
1. The ENIG plating process is in control producing a normal distribution for nickel and gold deposit thickness.
2. That the tool used to measure the deposit and therefore control the process is accurate and reproducible for the thickness range specified.
3. That the ENIG plating process results in uniform deposit characteristics.
If any of these three critical factors are not met, then the deposit produced will not meet the performance criteria defined
IPC-4552B (Hardcopy)
Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards
Englisch. 156 Seiten. Stand: 2021
IPC-4552B standard sets the requirements for Electroless Nickel / Immersion Gold (ENIG) deposit thickness for applications including soldering, wire bonding, and as a contact finish. IPC-4552B standard is used to specify acceptance criteria to meet performance standards for IPC-6010 family of documents including IPC-6012, IPC-6013 and IPC-6018. The ENIG deposit specified using this document will meet the highest coating durability rating as specified in IPC-J-STD-003 printed board solderability specification.
IPC-4552B (PDF) Single User
Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards
Englisch. 156 Seiten. Stand: 2021. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
IPC-4552B standard sets the requirements for Electroless Nickel / Immersion Gold (ENIG) deposit thickness for applications including soldering, wire bonding, and as a contact finish. IPC-4552B standard is used to specify acceptance criteria to meet performance standards for IPC-6010 family of documents including IPC-6012, IPC-6013 and IPC-6018. The ENIG deposit specified using this document will meet the highest coating durability rating as specified in IPC-J-STD-003 printed board solderability specification.
IPC-4553A (PDF) Single User
Specification for Immersion Silver Plating for Printed Boards
Englisch. 36 pages. ANSI Approved - June 2009. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
This specification sets requirements based on performance criteria for the use of Immersion Silver (IAg) as a surface finish for printed circuit boards. It is intended for use by chemical suppliers, printed board manufacturers, electronics manufactur ing services (EMS) companies and original equipment manufacturers (OEM). IAg is a thin immersion deposit over copper. It is a multifunctional surface finish, applicable to soldering. It may also be applicable for some press fit connections and as a c ontact surface. It has the potential to be suitable for aluminum wire bonding. The immersion silver protects the underlying copper from oxidation over its intended shelf life. Exposure to moisture and air contaminants, such as sulfur and chlorine, ma y negatively impact the useful life of the deposit. The impact can range from a slight discoloration of the deposit to the pads turning completely black. Proper packaging is a requirement. Note that, in this revision, both a single thickness range is in place and an upper limit for immersion silver thickness has been established.
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IPC-4554 D 1 (PDF) Single User
Specification for Immersion Tin Plating for Printed Circuit Boards
Englisch. 48 pages. Stand: Januar 2012. Keine Druckberechtigung, DRM-Schutz, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
IPC-4554, Specification for Immersion Tin Plating for Printed Circuit Boards, is included in the IPC-455X series of specifications that set the requirements for printed board surface finishes that are alternates to non-coplanar finishes, most often referred to as tin-lead HASL finish. This specification is a full-color document that is intended for use by the supplier or printed board fabricator, plating chemistry supplier, contract assembler or EMS facility and the original equipment manufacturer (OEM). The immersion tin (Sn) is a metallic finish deposited by a chemical displacement reaction that is applied directly to the basis metal of the printed board, which is copper. The immersion tin is primarily used as a solderable surface for attachment of components. It may also be used when press fit connections are employed and for zero insertion force (ZIF) edge connectors. The immersion tin finish protects the underlying copper from oxidation over the intended shelf life of this finish that is described in IPC/EIA J-STD-003 as a Category 3 coating durability finish (storage of greater than six months). The inserted Amendment 1 provides more detail on the solderability of the immersion tin, using both tin-lead as well as "lead-free" solders using appropriate fluxes. 48 pages. Released with Amendment 1: January 2012.
IPC-4554-DE CD Single User
Spezifikation für chemisch Zinn-Oberflächen von Leiterplatten
Deutsch. Stand: Januar 2007, 42 Seiten farbig, Einzelplatzlizenz - Nicht druckbar
Anwendungsbereich:
Diese Spezifikation legt die Anforderungen an chemisch Zinn-Oberflächen als Endoberflächen von Leiterplatten fest. Sie ist für die Verwendung durch Lieferanten, Leiterplattenhersteller, Elektronik-Dienstleister (EMS) und OEM-Herst eller vorgesehen.
IPC-4554, 'Specification for Immersion Tin Plating for Printed Circuit Boards,' is the third document in a series of specifications [the first two are: IPC-4552 which addresses electroless nickel/immersion gold (ENIG) and IPC-45 53 which addresses immersion silver (IAg)] that set the requirements for printed circuit board surface finishes that are alternates to eutectic tin-lead. IPC-4554, a full color document, is intended for use by supplier, manufacturer, contract manufac turer (CM) and original equipment manufacturer (OEM). The immersion tin (ISn) is a metallic finish deposited by a chemical displacement reaction that is applied directly over the basis metal of the PCB, that is, copper. ISn is primarily used as a sol derable surface. It has been used in press fit connections and as the interface for Zero Insertion Force (ZIF) edge connectors. The ISn protects the underlying copper from oxidation over its intended shelf life.
IPC-4554-DE Papierversion
Spezifikation für chemisch Zinn-Oberflächen von Leiterplatten
Deutsch. Stand: Januar 2007, 42 Seiten farbig
Anwendungsbereich:
Diese Spezifikation legt die Anforderungen an chemisch Zinn-Oberflächen als Endoberflächen von Leiterplatten fest. Sie ist für die Verwendung durch Lieferanten, Leiterplattenhersteller, Elektronik-Dienstleister (EMS) und OEM-Herst eller vorgesehen.
IPC-4554, 'Specification for Immersion Tin Plating for Printed Circuit Boards,' is the third document in a series of specifications [the first two are: IPC-4552 which addresses electroless nickel/immersion gold (ENIG) and IP C-4553 which addresses immersion silver (IAg)] that set the requirements for printed circuit board surface finishes that are alternates to eutectic tin-lead. IPC-4554, a full color document, is intended for use by supplier, manufacturer, contract man ufacturer (CM) and original equipment manufacturer (OEM). The immersion tin (ISn) is a metallic finish deposited by a chemical displacement reaction that is applied directly over the basis metal of the PCB, that is, copper. ISn is primarily used as a solderable surface. It has been used in press fit connections and as the interface for Zero Insertion Force (ZIF) edge connectors. The ISn protects the underlying copper from oxidation over its intended shelf life.
IPC-4555 (Hardcopy)
Performance Specification for High Temperature Organic Solderability Preservatives (OSP) for Printed Boards
Englisch. 24 Seiten. Stand: Januar 2022
The IPC-4555 standard covers the requirements and testing for organic solderability preservatives (OSP) processes for printed boards to be used primarily for electrical and electronic circuits. Details for lead free soldering are covered in IPC-4555.
IPC-4556 AM1 (Hardcopy)
Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards
Englisch, Stand: 2016, 8 Seiten
This specification sets the requirements for the use of electroless nickel/electroless palladium/immersion gold (ENEPIG) as a surface finish for printed boards. It establishes requirements for ENEPIG deposit thicknesses for applications including soldering, wire bonding and as a contact finish. It is intended for use by chemical suppliers, printed board manufacturers, electronics manufacturing services (EMS) providers and original equipment manufacturers (OEMs). ENEPIG is a tertiary layered surface finish plated over copper as the basis metal. ENEPIG is a multifunctional surface finish, applicable to soldering and to gold, aluminum and copper wire bonding. It is also suitable as the mating surface for soft membrane and steel dome contacts. Additional applications include use in low insertion force (LIF) and zero insertion force (ZIF) edge connectors and for press-fit applications. The electroless palladium layer forms a diffusion barrier that impedes nickel diffusion to the gold surface and, in turn, the immersion gold protects the palladium layer from reacting with contaminants prior to processing that might otherwise affect joining processes, such as wire bonding and soldering.
IPC-4556 AM1 (PDF) Single User
Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards
Englisch, Stand: 2016, 8 Seiten. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
The Amendment 1 to IPC-4556 made the following changes to the base specification: a) It added the absolute value of the maximum thickness for the immersion gold of 0.070 μm [2.8 μin] that accompanies the statistically valid minimum immersion gold thickness; b) It added two more photomicrograph images to provide better information on identifying nickel hyper corrosion; c) It added the basis of determining both the minimum as well as maximum values of immersion gold thickness with ENEPIG surface finish; d) It added the statement that using statistical process control is encouraged but not mandatory with this surface finish; e) It provided two alternate methods for deposition of thicker gold compared to strictly immersion gold; and f) It better defines how the C=0 sampling plan is to be utilized such that it will conform to this surface finishes' requirements.
IPC-4562A WAM1 (Hardcopy)
Metal Foil for Printed Board Applications
Englisch. Stand: Mai 2008; 27 Seiten
This specification covers metal foils supported by carrier films and unsupported foils suitable for subsequent use in only printed boards and addresses the requirements for procurement of these same metal foils. Unless otherwise agreed upon between u ser and supplier (AABUS), metal foils shall be considered acceptable as long as the requirements in this specification are met.
Included in the IPC-C-102, IPC-C-105, IPC-C-107 and the IPC-C-1000 Collections.
