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FED-Dokumente und IPC-Richtlinien zu Design, Leiterplatten- und Baugruppen-Fertigung jederzeit bequem bestellen.
IPC-4556 AM1 (PDF) Single User
Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards
Englisch, Stand: 2016, 8 Seiten. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
The Amendment 1 to IPC-4556 made the following changes to the base specification: a) It added the absolute value of the maximum thickness for the immersion gold of 0.070 μm [2.8 μin] that accompanies the statistically valid minimum immersion gold thickness; b) It added two more photomicrograph images to provide better information on identifying nickel hyper corrosion; c) It added the basis of determining both the minimum as well as maximum values of immersion gold thickness with ENEPIG surface finish; d) It added the statement that using statistical process control is encouraged but not mandatory with this surface finish; e) It provided two alternate methods for deposition of thicker gold compared to strictly immersion gold; and f) It better defines how the C=0 sampling plan is to be utilized such that it will conform to this surface finishes' requirements.
IPC-4562B (Hardcopy)
Specification for Metal Base Copper Clad Laminates for Printed Boards
Englisch. 43 Seiten. Stand: Oktober 2023
IPC-4562A standard covers metal unsupported foils and foils supported by carrier films suitable for subsequent use in printed boards. IPC-4562B addresses the requirements of metal foils used in printed wiring applications.
IPC-4562B-EN (PDF) Single User
Specification for Metal Base Copper Clad Laminates for Printed Boards
Englisch. 43 Seiten. Stand: Oktober 2023
IPC-4562A standard covers metal unsupported foils and foils supported by carrier films suitable for subsequent use in printed boards. IPC-4562B addresses the requirements of metal foils used in printed wiring applications.
IPC-4761 (Hardcopy)
Design Guide for Protection of Printed Board Via Structures
Englisch, 16 Seiten. Stand: Juli 2006
IPC-4761 is the sole industry guideline providing PCB designers, manufacturers and uses with detailed information on all existing methods for protecting vias on printed boards, including all types of via tenting, plugging, filling and capping. Production issues, long term reliability concerns and material specification and selection are provided to aid in evaluating the benefits and concerns for employing each type of via protection.
IPC-4761 (PDF) Single User
Design Guide for Protection of Printed Board Via Structures
Englisch, 16 Seiten. Released Juli 2006. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
IPC-4761: Designrichtlinie für den Schutz von Vias in Leiterplatten
IPC-4761 'Design Guide for Protection of Printed Board Via Structures' erschien im Juli 2006 und umfasst 16 Seiten. Die Richtlinie ist das einzige Industriedokument, welches den De signern, Leiterplattenherstellern und -anwendern detaillierte Informationen über sämtliche existierende Methoden des Via-Schutzes in Leiterplatten informiert. Dazu zählen Tenting (Abdeckung), Plugging (Verfüllen), Filling (Füllen) und Capping (Verdec ken). Um die jeweils am besten geeignete Technik unter Kenntnis ihrer Vorzüge sowie Nachteile auswählen zu können, gibt die Richtlinie Hiweise zur technologischen Realisierung, zur Langzeitzuverlässigkeit, Materialspezifikation sowie Selektion.
IP C-4761 is the sole industry guideline providing PCB designers, manufacturers and uses with detailed information on all existing methods for protecting vias on printed boards, including all types of via tenting, plugging, filling and capping. Producti on issues, long term reliability concerns and material specification and selection are provided to aid in evaluating the benefits and concerns for employing each type of via protection. 16 pages. Released July 2006.
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IPC-4781 (PDF) Single User
Qualification and Performance Specification of Permanent, Semi-Permanent and Temporary Legend and/or Marking Ink
Englisch. Stand: Mai 2008, 17 Seiten. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
The industry's first specification for the evaluation of a legend and/or marking ink material for the determination of acceptability of use in a standard printed board system. IPC-4781 provides coverage for adhesion, material qualification and testin g, resistances to solvents, requirements for resistance to lead-free solders, and electrical requirements.
Included in the IPC-C-105 and the IPC-C-1000 Collections.
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IPC-4811 (PDF) Single User
Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed Boards
Englisch. Stand: Mai 2008, 26 Seiten. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
This document describes materials that can be used for the fabrication of embedded passive resistor devices within the finished printed circuit board substrate. It provides information on general designations and associated characteristics of embedde d passive device (EPD) resistor materials. The document shall be used as a qualification and conformance standard for designers and users when designing or constructing printed circuit boards containing these EPD materials. This document contains mat erial designation, conformance (requirements), qualification (characterization) and quality assurance specifications. This document should be used in conjunction with both the IPC-2200 series design and the IPC-6010 series qualification and performan ce standards.
Included in the IPC-C-105, IPC-C-107 and the IPC-C-1000 Collections.
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IPC-4821 (PDF) Single User
Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards
Englisch. 34 pages. Released May 2006. Keine Druckberechtigung, DRM-Schutz, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
This document describes materials that can be used for the fabrication of embedded passive capacitor devices within the finished printed circuit board substrate. For this document, embedded passive devices and the phrase embedded passives are conside red to be equivalent. It provides information on general designations and associated characteristics of embedded passive device (EPD) capacitor materials. The document shall be used as a qualification and conformance standard for these materials. Thi s document contains material designation, conformance (requirements), qualification (characterization) and quality assurance specifications. This document covers the requirements for dielectric, conductive, and insulating materials that are used with materials for the manufacture of printed circuit boards containing embedded passive capacitor functionality.
IPC-4922 (Hardcopy)
Requirements for Sintering Materials for Electrical and Thermal Interconnects
Englisch. 24 Seiten. Stand: Januar 2024.
IPC-4922 standard prescribes general minimum requirements for the classification and testing of sintering materials for reliable electrical and thermal interconnects. IPC-4922 standard is a sintering materials classification, quality assurance and procurement document for sintering materials.
IPC-5262 (Hardcopy)
Design, Critical Process and Acceptance Requirements for Polymeric Applications
Englisch. 65 Seiten. Stand: Januar 2022
The IPC-5262 prescribes the minimum design, critical process and acceptance requirements for the application of polymeric materials to electrical/electronic components, modules, printed wiring assemblies and other elements thereof. The intent of IPC-5262 is to establish a baseline of requirements, procedures, practices and process attributes based on lessons learned and best practices that have been demonstrated through use and experience, to result in a robust design and high reliability.
