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IPC-4552B (PDF) Single User
Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards
Englisch. 156 Seiten. Stand: 2021. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
IPC-4552B standard sets the requirements for Electroless Nickel / Immersion Gold (ENIG) deposit thickness for applications including soldering, wire bonding, and as a contact finish. IPC-4552B standard is used to specify acceptance criteria to meet performance standards for IPC-6010 family of documents including IPC-6012, IPC-6013 and IPC-6018. The ENIG deposit specified using this document will meet the highest coating durability rating as specified in IPC-J-STD-003 printed board solderability specification.
IPC-4553A (PDF) Single User
Specification for Immersion Silver Plating for Printed Boards
Englisch. 36 pages. ANSI Approved - June 2009. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
This specification sets requirements based on performance criteria for the use of Immersion Silver (IAg) as a surface finish for printed circuit boards. It is intended for use by chemical suppliers, printed board manufacturers, electronics manufactur ing services (EMS) companies and original equipment manufacturers (OEM). IAg is a thin immersion deposit over copper. It is a multifunctional surface finish, applicable to soldering. It may also be applicable for some press fit connections and as a c ontact surface. It has the potential to be suitable for aluminum wire bonding. The immersion silver protects the underlying copper from oxidation over its intended shelf life. Exposure to moisture and air contaminants, such as sulfur and chlorine, ma y negatively impact the useful life of the deposit. The impact can range from a slight discoloration of the deposit to the pads turning completely black. Proper packaging is a requirement. Note that, in this revision, both a single thickness range is in place and an upper limit for immersion silver thickness has been established.
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IPC-4554 D 1 (PDF) Single User
Specification for Immersion Tin Plating for Printed Circuit Boards
Englisch. 48 pages. Stand: Januar 2012. Keine Druckberechtigung, DRM-Schutz, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
IPC-4554, Specification for Immersion Tin Plating for Printed Circuit Boards, is included in the IPC-455X series of specifications that set the requirements for printed board surface finishes that are alternates to non-coplanar finishes, most often referred to as tin-lead HASL finish. This specification is a full-color document that is intended for use by the supplier or printed board fabricator, plating chemistry supplier, contract assembler or EMS facility and the original equipment manufacturer (OEM). The immersion tin (Sn) is a metallic finish deposited by a chemical displacement reaction that is applied directly to the basis metal of the printed board, which is copper. The immersion tin is primarily used as a solderable surface for attachment of components. It may also be used when press fit connections are employed and for zero insertion force (ZIF) edge connectors. The immersion tin finish protects the underlying copper from oxidation over the intended shelf life of this finish that is described in IPC/EIA J-STD-003 as a Category 3 coating durability finish (storage of greater than six months). The inserted Amendment 1 provides more detail on the solderability of the immersion tin, using both tin-lead as well as "lead-free" solders using appropriate fluxes. 48 pages. Released with Amendment 1: January 2012.
IPC-4554-DE CD Single User
Spezifikation für chemisch Zinn-Oberflächen von Leiterplatten
Deutsch. Stand: Januar 2007, 42 Seiten farbig, Einzelplatzlizenz - Nicht druckbar
Anwendungsbereich:
Diese Spezifikation legt die Anforderungen an chemisch Zinn-Oberflächen als Endoberflächen von Leiterplatten fest. Sie ist für die Verwendung durch Lieferanten, Leiterplattenhersteller, Elektronik-Dienstleister (EMS) und OEM-Herst eller vorgesehen.
IPC-4554, 'Specification for Immersion Tin Plating for Printed Circuit Boards,' is the third document in a series of specifications [the first two are: IPC-4552 which addresses electroless nickel/immersion gold (ENIG) and IPC-45 53 which addresses immersion silver (IAg)] that set the requirements for printed circuit board surface finishes that are alternates to eutectic tin-lead. IPC-4554, a full color document, is intended for use by supplier, manufacturer, contract manufac turer (CM) and original equipment manufacturer (OEM). The immersion tin (ISn) is a metallic finish deposited by a chemical displacement reaction that is applied directly over the basis metal of the PCB, that is, copper. ISn is primarily used as a sol derable surface. It has been used in press fit connections and as the interface for Zero Insertion Force (ZIF) edge connectors. The ISn protects the underlying copper from oxidation over its intended shelf life.
IPC-4554-DE Papierversion
Spezifikation für chemisch Zinn-Oberflächen von Leiterplatten
Deutsch. Stand: Januar 2007, 42 Seiten farbig
Anwendungsbereich:
Diese Spezifikation legt die Anforderungen an chemisch Zinn-Oberflächen als Endoberflächen von Leiterplatten fest. Sie ist für die Verwendung durch Lieferanten, Leiterplattenhersteller, Elektronik-Dienstleister (EMS) und OEM-Herst eller vorgesehen.
IPC-4554, 'Specification for Immersion Tin Plating for Printed Circuit Boards,' is the third document in a series of specifications [the first two are: IPC-4552 which addresses electroless nickel/immersion gold (ENIG) and IP C-4553 which addresses immersion silver (IAg)] that set the requirements for printed circuit board surface finishes that are alternates to eutectic tin-lead. IPC-4554, a full color document, is intended for use by supplier, manufacturer, contract man ufacturer (CM) and original equipment manufacturer (OEM). The immersion tin (ISn) is a metallic finish deposited by a chemical displacement reaction that is applied directly over the basis metal of the PCB, that is, copper. ISn is primarily used as a solderable surface. It has been used in press fit connections and as the interface for Zero Insertion Force (ZIF) edge connectors. The ISn protects the underlying copper from oxidation over its intended shelf life.
IPC-4556 (PDF) Single User
Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards
Englisch, Stand: Januar 2013, 82 Seiten. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
This specification sets the requirements for the use of electroless nickel/electroless palladium/immersion gold (ENEPIG) as a surface finish for printed boards. It establishes requirements for ENEPIG deposit thicknesses for applications including soldering, wire bonding and as a contact finish. It is intended for use by chemical suppliers, printed board manufacturers, electronics manufacturing services (EMS) providers and original equipment manufacturers (OEMs). ENEPIG is a tertiary layered surface finish plated over copper as the basis metal. ENEPIG is a multifunctional surface finish, applicable to soldering and to gold, aluminum and copper wire bonding. It is also suitable as the mating surface for soft membrane and steel dome contacts. Additional applications include use in low insertion force (LIF) and zero insertion force (ZIF) edge connectors and for press-fit applications. The electroless palladium layer forms a diffusion barrier that impedes nickel diffusion to the gold surface and, in turn, the immersion gold protects the palladium layer from reacting with contaminants prior to processing that might otherwise affect joining processes, such as wire bonding and soldering.
IPC-4556 AM1 (Hardcopy)
Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards
Englisch, Stand: 2016, 8 Seiten
This specification sets the requirements for the use of electroless nickel/electroless palladium/immersion gold (ENEPIG) as a surface finish for printed boards. It establishes requirements for ENEPIG deposit thicknesses for applications including soldering, wire bonding and as a contact finish. It is intended for use by chemical suppliers, printed board manufacturers, electronics manufacturing services (EMS) providers and original equipment manufacturers (OEMs). ENEPIG is a tertiary layered surface finish plated over copper as the basis metal. ENEPIG is a multifunctional surface finish, applicable to soldering and to gold, aluminum and copper wire bonding. It is also suitable as the mating surface for soft membrane and steel dome contacts. Additional applications include use in low insertion force (LIF) and zero insertion force (ZIF) edge connectors and for press-fit applications. The electroless palladium layer forms a diffusion barrier that impedes nickel diffusion to the gold surface and, in turn, the immersion gold protects the palladium layer from reacting with contaminants prior to processing that might otherwise affect joining processes, such as wire bonding and soldering.
IPC-4556 AM1 (PDF) Single User
Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards
Englisch, Stand: 2016, 8 Seiten. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
The Amendment 1 to IPC-4556 made the following changes to the base specification: a) It added the absolute value of the maximum thickness for the immersion gold of 0.070 μm [2.8 μin] that accompanies the statistically valid minimum immersion gold thickness; b) It added two more photomicrograph images to provide better information on identifying nickel hyper corrosion; c) It added the basis of determining both the minimum as well as maximum values of immersion gold thickness with ENEPIG surface finish; d) It added the statement that using statistical process control is encouraged but not mandatory with this surface finish; e) It provided two alternate methods for deposition of thicker gold compared to strictly immersion gold; and f) It better defines how the C=0 sampling plan is to be utilized such that it will conform to this surface finishes' requirements.
IPC-4562A WAM1 (Hardcopy)
Metal Foil for Printed Board Applications
Englisch. Stand: Mai 2008; 27 Seiten
This specification covers metal foils supported by carrier films and unsupported foils suitable for subsequent use in only printed boards and addresses the requirements for procurement of these same metal foils. Unless otherwise agreed upon between u ser and supplier (AABUS), metal foils shall be considered acceptable as long as the requirements in this specification are met.
Included in the IPC-C-102, IPC-C-105, IPC-C-107 and the IPC-C-1000 Collections.
IPC-4562A-WAM1 (PDF) Single User
Metal Foil for Printed Wiring Applications
Englisch. Stand: Mai 2008, 27 Seiten. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
This specification covers metal foils supported by carrier films and unsupported foils suitable for subsequent use in only printed boards and addresses the requirements for procurement of these same metal foils. Unless otherwise agreed upon between u ser and supplier (AABUS), metal foils shall be considered acceptable as long as the requirements in this specification are met.
Included in the IPC-C-102, IPC-C-105, IPC-C-107 and the IPC-C-1000 Collections.
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