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FED-Dokumente und IPC-Richtlinien zu Design, Leiterplatten- und Baugruppen-Fertigung jederzeit bequem bestellen.
IPC-4104 (PDF) Single User
Specification for High Density Interconnect (HDI) and Microvia Materials
Englisch. 92 pages. Stand: Mai 1999. Keine Druckberechtigung, DRM-Schutz, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
Covers the various conductive and dielectric materials that can be used for the fabrication of HDI and microvias. The 23 specification sheets included in IPC/JPCA-4104 cover the qualification and conformance requirements for such materials as photoim ageable dielectric dry films and liquids, epoxy blends and coated foils. IPC/JPCA-4104 also includes six new test methods developed specifically for the testing of HDI and microvia materials. 92 pages.
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IPC-4110 (PDF) Single User
Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boards
Englisch. 11 pages. Stand: August 1998. Keine Druckberechtigung, DRM-Schutz, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
Determines the nomenclature, chemical and physical requirements of paper made from cellulose fibers for PWB fabrication. IPC-4110 also includes specification sheets for selecting and purchasing these materials. 11 pages.
IPC-4121 (PDF) Single User
Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications
Englisch. 12 pages. Stand: Januar 2000. Keine Druckberechtigung, DRM-Schutz, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
IPC-4121 provides industry-approved guidelines for selecting core constructions for multilayer printed wiring boards (PWBs). The specification sheets in the document categorize the different core constructions by laminate type and nominal thickness. The constructions are rated for characteristics such as dielectric constant (DK), dimensional stability (DS), flatness, smoothness and drillability. This document is a 'must have' for those responsible for purchasing laminate materials for their comp any. Supersedes IPC-CC-110A. 12 pages.
IPC-4130 (PDF) Single User
Specification & Characterization Methods for Nonwoven 'E' Glass Mat
Englisch. 14 pages. Stand: September 1998. Keine Druckberechtigung, DRM-Schutz, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
Determines the nomenclature, definitions and requirements for materials made from nonwoven 'E' glass fibers. IPC-4130 also includes specification sheets for selecting and purchasing these materials. 14 pages.
IPC-4202C (Hardcopy)
Specification for Flexible Base Dielectrics for use in Flexible Printed Boards
Englisch. 28 Seiten. Stand Januar 2022.
The IPC-4202C standard covers the requirements for flexible base materials, herein referred to as laminates, prepregs or films, to be used primarily for flexible printed boards for electrical and electronic circuits.
IPC-4202C (PDF) Single User
Specification for Flexible Base Dielectrics for use in Flexible Printed Boards
Englisch. 28 Seiten. Stand: Januar 2022. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
The IPC-4202C standard covers the requirements for flexible base materials, herein referred to as laminates, prepregs or films, to be used primarily for flexible printed boards for electrical and electronic circuits.
IPC-4203B (Hardcopy)
Cover and Bonding Material for Flexible Printed Circuitry
Englisch. 44 pages. Stand: Januar 2013
IPC-4203B establishes the classification system, the qualification and quality conformance requirements for dielectric films coated with an adhesive on one or both sides, which are to be used as cover material and/or bondply for flexible printed circuitry, as well as supported or unsupported adhesive films to be used in the fabrication of flexible printed circuitry. IPC-4203B does not cover non-flexible adhesives designed to be used in the rigid board areas of rigid flex constructions, which are covered in IPC-4101. Materials such as liquid-applied covercoat (see 3.1.8.3) are covered in IPC-SM-840 and are excluded from this document. 38 pages.
IPC-4203B (PDF) Single User
Cover and Bonding Material for Flexible Printed Circuitry
Englisch. 44 Seiten. Stand: Januar 2013. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
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IPC-4203B establishes the classification system, the qualification and quality conformance requirements for dielectric films coated with an adhesive on one or both sides, which are to be used as cover material and/or bondply for flexible printed circuitry, as well as supported or unsupported adhesive films to be used in the fabrication of flexible printed circuitry. IPC-4203B does not cover non-flexible adhesives designed to be used in the rigid board areas of rigid flex constructions, which are covered in IPC-4101. Materials such as liquid-applied covercoat (see 3.1.8.3) are covered in IPC-SM-840 and are excluded from this document. 38 pages.
IPC-4204A-WAM1 (Hardcopy)
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
Englisch.53 pages. Stand: Oktober 2011
This standard establishes the classification system, the qualification and quality performance requirements for flexible metal-clad dielectric materials to be used for the fabrication of flexible printed circuitry and
flexible flat cable. It encompasses 12 specification sheets that result from the combinations of various copper foil claddings; a polymer base dielectric selected from at least two polyesters, multiple polyimides or
liquid crystal polymers; and at least seven versions of polymer adhesives as well as adhesiveless bonding agents. The net result of these material combinations provide the industry with suitable clad, flexible
dielectrics for fabricating flexible printed circuitry interconnections.
IPC-4204A-WAM1 (PDF) Single User
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
Englisch. 53 Seiten. Stand: Oktober 2011. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
This standard establishes the classification system, the qualification and quality performance requirements for flexible metal-clad dielectric materials to be used for the fabrication of flexible printed circuitry and
flexible flat cable. It encompasses 12 specification sheets that result from the combinations of various copper foil claddings; a polymer base dielectric selected from at least two polyesters, multiple polyimides or
liquid crystal polymers; and at least seven versions of polymer adhesives as well as adhesiveless bonding agents. The net result of these material combinations provide the industry with suitable clad, flexible
dielectrics for fabricating flexible printed circuitry interconnections.
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