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J-STD-004C (PDF) Single User
Requirements for Soldering Fluxes
Englisch. 32 pages. Stand: Januar 2022
The IPC J-STD-004C standard prescribes general requirements for the classification and characterization of fluxes for high quality solder interconnections. The IPC J-004C standard may be used for quality control and procurement purposes.
J-STD-005A (Hardcopy)
Requirements for Soldering Pastes
Englisch. 10 pages. Stand: Februar 2012
This standard lists requirements for qualification and characterization of solder paste. It references test methods and criteria for metal content, viscosity, slump, solder ball,tack and wetting of solder pastes. Additional support is provided in IPC-HDBK-005, Guide to Solder Paste Assessment (not included with purchase of this standard). Supersedes J-STD-005. 10 pages.Released February 2012.
J-STD-005A (PDF) Single User
Requirements for Soldering Pastes
Englisch. 10 pages. Stand: Februar. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
This standard lists requirements for qualification and characterization of solder paste. It references test methods and criteria for metal content, viscosity, slump, solder ball,tack and wetting of solder pastes. Additional support is provided in IPC-HDBK-005, Guide to Solder Paste Assessment (not included with purchase of this standard). Supersedes J-STD-005. 10 pages.Released February 2012.
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J-STD-006C (PDF) Single User
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders
Englisch. 22 pages. Stand: July 2013. Keine Druckberechtigung, DRM-Schutz, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
This standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon and powder solders for electronic soldering applications; and for ++special++ electronic grade solders. This is a quality control standard and is not intended to relate directly to the material+s performance in the manufacturing process. Solders for applications other than electronics should be procured using ASTM B-32. This standard is one of a set of three joint industry standards that prescribe the requirements and test methods for soldering materials to be used in the electronics industry. The other two standards in this set are IPC/EIA J-STD-004, Requirements for Soldering Fluxes, and IPC/EIA J-STD-005, Requirements for Soldering Pastes.
This "C" revision has been updated to address intentional additions to a solder alloy and impurities in the alloy. In addition, the tables and appendices have been.
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J-STD-006C-AM1 (PDF) Single User english
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications - Amendment 1
Englisch. 12 pages. Stand: November 2017. Keine Druckberechtigung. DRM-Schutz, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
The J-STD-006C-AM1 amendment provides better detail of a solder alloy's maximum allowed deviation about the nominal level of the element's mass than was provided in past alloy standards. The J-STD-006C-AM1 amendment provides information on negative effects of adding rare earth elements to specific, heavy tin- containing, lead-free solder alloys and propensity of tin whisker formation. Finally, the J-STD-006C-AM1 amendment inserted five new, patented lead-free solder alloys from 3 separate alloy suppliers for users of the J-STD-006C standard.
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J-STD-006C-AM1 Hardcopy
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications - Amendment 1
Englisch. 12 pages. Stand: November 2017.
The J-STD-006C-AM1 amendment provides better detail of a solder alloy's maximum allowed deviation about the nominal level of the element's mass than was provided in past alloy standards. The J-STD-006C-AM1 amendment provides information on negative effects of adding rare earth elements to specific, heavy tin- containing, lead-free solder alloys and propensity of tin whisker formation. Finally, the J-STD-006C-AM1 amendment inserted five new, patented lead-free solder alloys from 3 separate alloy suppliers for users of the J-STD-006C standard.
Single-Device DRM-Protected Document
This document has single-device/user digital rights management (DRM) protection. This document will only be accessible by a single user on a single device. If you are purchasing this DRM-protected document for another user, you will need to provide contact information for that user when placing your order.
J-STD-020D-DE Papierversion
Klassifizierung feuchtigkeits-/reflowempfindlicher nichthermischer Halbleiterbauteile für Oberflächenmontage
Deutsch. 13 Seiten. Juli 2007
Das Dokument enthält auf 13 Seiten A4 Verfahren zur Feststellung der Sensibilität nicht hermetischer SMD-Halbleiterbauteile gegenüber durch Feuchtigkeit verursachtem Bauteilstress. Im Ergebnis dessen werden die Bauteile in entsprechende MSL-Klassen (Moisture Sensitivity Level) eingestuft, so dass richtige Handhabung und Verpackung sowie geeigneter Versand und Einsatz vollzogen werden können. J-STD-020D ist eng mit IPC/JEDEC J-STD-033B.1 verbunden.
J-STD-020D-DE-CD Single User
Klassifizierung feuchtigkeits-/reflowempfindlicher nichthermischer Halbleiterbauteile für Oberflächenmontage
Deutsch. 13 Seiten. Stand: Juli 2007, Einzelplatzlizenz - Nicht druckbar
Das Dokument enthält auf 13 Seiten A4 Verfahren zur Feststellung der Sensibilität nicht hermetischer SMD-Halbleiterbauteile gegenüber durch Feuchtigkeit verursachtem Bauteilstress. Im Ergebnis dessen werden die Bauteile in entsprechende MSL-Klassen (Moisture Sensitivity Level) eingestuft, so dass richtige Handhabung und Verpackung sowie geeigneter Versand und Einsatz vollzogen werden können. J-STD-020D ist eng mit IPC/JEDEC J-STD-033B.1 verbunden.
J-STD-020E (Hardcopy)
Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices
Englisch. Stand: 2015
IPC JEDEC J-STD-020 is used to determine what moisture-sensitivity-level (MSL) classification level should be used so that surface mount devices (SMDs) can be properly packaged, stored and handled to avoid subsequent thermal and mechanical damage during the assembly solder reflow attachment and/or repair operation. J-STD-020 covers components to be processed at higher temperatures for lead-free and lower temperature Sn-Pb assemblies.
In this revision, clarification was added in numerous areas to ensure consistency in scope and application. The standard incorporates considerations for bare-die with polymer and non-IC package usage. Revision E also clarifies/updates Classification Temperature (Tc), package volume, dry weight characterization, and recording with suggested intervals during dry weight determination. Guidance on bake time is also provided in the case that bake test interruption is observed.
J-STD-020E (PDF) Single User
IPC/JEDEC-J-STD-020 - Revision E: Moisture/Reflow Sensitivity Classification for Non-hermetic Surface Mount Devices (SMDs)
Englisch. Stand: 2015. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
IPC JEDEC J-STD-020 is used to determine what moisture-sensitivity-level (MSL) classification level should be used so that surface mount devices (SMDs) can be properly packaged, stored and handled to avoid subsequent thermal and mechanical damage during the assembly solder reflow attachment and/or repair operation. J-STD-020 covers components to be processed at higher temperatures for lead-free and lower temperature Sn-Pb assemblies.
In this revision, clarification was added in numerous areas to ensure consistency in scope and application. The standard incorporates considerations for bare-die with polymer and non-IC package usage. Revision E also clarifies/updates Classification Temperature (Tc), package volume, dry weight characterization, and recording with suggested intervals during dry weight determination. Guidance on bake time is also provided in the case that bake test interruption is observed.
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