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IPC Quality Benchmarks for the Electronics Assembly Industry 2022

Englisch. Stand 01.08.2022

The 2022 Quality Benchmarks for the Electronics Assembly Industry is a biennial report released by IPC. The report represents the findings from an online quantitative survey fielded between the dates of September 28, 2001 – October 20, 2021. A total of 59 assembly companies completed the survey, representing both contract electronics manufacturing services (EMS) companies and original equipment manufacturers (OEMs). Companies that assemble printed boards and other electronic products can use this report to compare their performance to industry averages.

IPC-Study of Quality Benchmarks for Electronics Assembly 2019

Englisch. 153 Seiten, Stand 31/07/2019, Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)

Study of Quality Benchmarks for Electronics Assembly 2019 is a global survey-based study covering production data, yields, defect rates (DPMO), cost of rework and scrap, customer acceptance of reworked boards, test and inspection methods used, customer returns, supplier performance, customer satisfaction and certification data. Companies that assemble printed boards and other electronic products can use this report to compare their performance to industry averages. Medians, and percentile data are also reported. The survey sample includes 57 contract electronics manufacturers and OEMs worldwide with total sales revenue ranging from under $10 million to more than $1 billion. Aggregate data are segmented by company size tier, region and type of production, including rigid PCBs, flexible circuits, finished end products or systems, mechanical assembly, cable and harness, and discrete wiring terminals and connectors. Released July 2019