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IPC/JEDEC-J-STD-020 - Revision E: Moisture/Reflow Sensitivity Classification for Non-hermetic Surface Mount Devices (SMDs)

Englisch. Stand: 2015. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)

IPC JEDEC J-STD-020 is used to determine what moisture-sensitivity-level (MSL) classification level should be used so that surface mount devices (SMDs) can be properly packaged, stored and handled to avoid subsequent thermal and mechanical damage during the assembly solder reflow attachment and/or repair operation. J-STD-020 covers components to be processed at higher temperatures for lead-free and lower temperature Sn-Pb assemblies.

In this revision, clarification was added in numerous areas to ensure consistency in scope and application. The standard incorporates considerations for bare-die with polymer and non-IC package usage. Revision E also clarifies/updates Classification Temperature (Tc), package volume, dry weight characterization, and recording with suggested intervals during dry weight determination. Guidance on bake time is also provided in the case that bake test interruption is observed.
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IPC/JEDEC-J-STD-020 - Revision F: Moisture/Reflow Sensitivity Classification for Non-hermetic Surface Mount Devices (SMDs)

Englisch. 30 Seiten. Stand: 2022

IPC/JEDEC J-STD-020F standard is to identify the classification level of nonhermetic SMDs designed for surface mount assembly that are sensitive to moisture-induced stress so that they can be properly packaged, stored, and handled to avoid damage during assembly solder reflow attachment and/or repair operations. IPC/JEDEC J-STD-020F standard may be used to determine what classification level should be used for nonhermetic SMD qualification. Passing the criteria in this test method is not sufficient by itself to provide assurance of long-term reliability. The Moisture Sensitivity Levels (MSLs) rating generated for an SMD by this document is utilized to determine the soak conditions for preconditioning as per JESD22-A113 and how the SMD can be properly packaged, stored, and handled to avoid damage during assembly solder reflow attachment and/or repair operations as per J-STD-033. For IC devices that may be process sensitive, please refer to J-STD-075 to determine if a PSL (Process Sensitivity Level) classification is required.

Semiconductor Design Standard for Flip Chip Applications

Englisch. 43 pages. Stand: August 1999. Keine Druckberechtigung, DRM-schützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)

This standard addresses semiconductor flip chip design requirements. Provides information for using standard semiconductor substrates, materials, assembly and test methods with established fabrication, bumping, test and handling practices. Electrical , thermal and mechanical chip design parameters and methodologies are covered in the standard, as well as the reliability aspects associated with these conditions and processes. The information applies to all new designs as well as modifications of n on-flip chip designs. Developed by IPC and EIA. 43 Pages.

Mechanical Outline Standard for Flip Chip and Chip Size Configurations

Englisch. 13 pages. Stand: Februar 2003. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)

This standard establishes mechanical outline requirements for devices supplied in flip chip or Chip Size Package (CSP) formats, including die surface, die terminals, and interconnection balls/bumps/lands to the next level. 13 Pages.
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Guideline for Selection and Application of Underfill Material for Flip Chip and Other Micropackages

Englisch. 32 pages. Stand: February 2014. Keine Druckberechtigung DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)

This document provides users of underfill material with guidance in selecting and evaluating underfill material. Underfill material is used to increase reliability of electronic devices by two methods: alleviate CTE mismatch (between the electronic p ackage and the assembly substrate) and/or increase mechanical strength. Materials used in underfill applications should not adversely affect device reliability (e.g. ionic impurities, alpha emitters) nor degrade electrical performance. When correctly selected and applied, underfill material should increase the life of the assembled solder joints. The following three types of currently available, underfill materials addressed in this document are: Capillary Flow Underfill, No-Flow/fluxing Underfi ll and Removable/Reworkable Underfill. 32 pages. Released February 2019
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Performance Standard for Ball Grid Array Balls

Englisch. 10 pages. Stand: Juni 2002. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)

This standard, developed jointly by IPC and the Electronic Industries Association (EIA) establishes the construction detail requirements for balls and other terminal structures on Ball Grid Array (BGA) packages. It also establishes a set of designati ons and expectations for product performance. A large variety of terminal structures are recognized for a wide range of applications ranging from highest reliability computer, space and military applications to disposable commodity applications.
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