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Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle

Englisch. Stand 2022, 48 Seiten, Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)

While there are a variety of industry test vehicles for the examination of materials compatibility, most available test boards leave something to be desired as there is often a dramatic difference in materials between such test boards and produced assemblies. A test vehicle was needed which could be used for both ion chromatography and SIR testing that would be more representative of mainstream manufacturing materials and processes. This document addresses the IPC-B-52 standard test vehicle which can be used to evaluate optimize a manufacturing process or to provide objective evidence that a chosen manufacturing material set and manufacturing process are compatible from a cleanliness standpoint. This user guideline has also been written as a companion document to the IPC-9202, providing clarification on what a manufacturer "should" do and what a manufacturer "must" do for demonstrating materials and process compatibility.

IPC-9204: Guideline on Flexibility and Stretchability Testing for Printed Electronics

Englisch. 26 Seiten, Stand März 2017, Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)

This guideline describes flexibility and stretchability testing to evaluate printable electronics for stretchable and wearable applications. 26 pages. Released March 2017
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Guidelines for Microsection Preparation

Englisch. 44 Seiten, Stand 2016, (PDF) Single User, Keine Druckberechtigung, DRM-geschützt

This standard is intended as a guideline in the proper preparation of a metallographic sample (microsection) of a printed board. The finished microsection is used for evaluating the quality of the laminate system and plated structures (e.g. PTHs and vias). Microsection sample preparation is regarded by many as a highly developed skill. The guidelines in this standard discuss the many variables and problems associated with the process from sample removal to micro-etch. The guidelines do not promote any one vendor’s process, but discuss the variables common to microsectioning.

Requirements for Electrical Testing of Unpopulated Printed Boards

Englisch. 28 Seiten. Stand: 2016. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)

IPC-9252 defines levels of appropriate testing and assists in the selection of the test analyzer, test parameters, test data and fixturing required to perform electrical test(s) on unpopulated printed boards and innerlayers. Revision B provides new requirements for resistive and indirect continuity and isolating testing, test record marking and traceability and an updated sample electrical test certificate of conformance (C of C).
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In-Process DPMO and Estimated Yield for PCAs

Englisch. Stand: Oktober 2006; 12 Seiten. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)

Now updated to align with IPC-7912A for end item DPMO, this document defines consistent methodologies for computation of in-process defects per million opportunities (DPMO) metrics for any evaluation stage in the assembly process. It is intended for use in measuring in-process assembly steps rather than end product determination. Calculation of completed item DPMO is addressed in IPC-7912A. A guide to defect categorization is provided that can serve as a base for summarizing and reporting in-pro cess defects when used with J-STD-001 and IPC-A-610. It can also be used to develop process step estimated yield - the expected percentage of assemblies with no defects for a particular process step or combined process steps, based on historical defe ct rates.
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Assembly Process Component Simulations, Guidelines & Classifications Package

Englisch. 79 pages. Set: IPC-9501 bis IPC-9504. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)

Here's a convenient and cost effective way to own the complete set of process simulation documents for component attachment. This set of four documents, 9501-9504, contains the information you need to help you select components that will be compatibl e with your assembly process. Learn about manufacturing solder process limits, moisture sensitivity classifications, preconditioning and assembly process simulations. Save 50% on individual document prices. Each document is also available on its own. 79 total pages.
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PWB Assembly Process Simulation for Evaluation of Electronic Components

Englisch. 25 pages. Stand: Juli 1995. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)

Will the components work with your process? That determination is the goal of these manufacturing process simulations; to ensure that components chosen meet expected reliability requirements after exposure to factory processes. This document specific ally addresses preconditioning of components. Developed for users and manufacturers, the procedure consists of a set of simulations for IC component storage and use, wave and reflow soldering (SMT and PTH parts), exposure to corrosive (water soluble) fluxes and exposure to often-used cleaning materials. 25 pages.
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