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FED-Dokumente und IPC-Richtlinien zu Design, Leiterplatten- und Baugruppen-Fertigung jederzeit bequem bestellen.
IPC-9704A (PDF) Single User
IPC/JEDEC Printed Wiring Board Strain Gage Test Guideline
Englisch. Stand: Februar 2012, 25 Seiten. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
Strain gage testing allows for objective analysis of the strain and strain rate levels to which a surface mount package may be subjected to during assembly, test and operation. Excessive strain can result in various failure modes for different solder alloys, package types, surface finishes or laminate materials. This document describes specific guidelines for strain gage testing during the printed board manufacturing process, including board assembly, test, system integration and other types of operations that may induce board flexure. This document also provides coverage of test setup and equipment requirements, strain measurement techniques and test report formats. Revision A contains 22 full-color photographs and illustrations depicting instrumented boards and gage placement and has been updated to address lead-free assembly technology.
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IPC-9707 (PDF) Single User
Spherical Bend Test Method for Characterization of Board Level Interconnects
Englisch, 15 Seiten, Release 2011. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
This standard on spherical transient bend testing is intended to characterize the maximum allowable strain that a surface mount component's board level interconnects can withstand in flexural loading. Whereas four-point monotonic bend test methods only address simple planar bending, spherical bend tests establish strain limits of board level interconnects under worst-case flexure conditions that can occur during conventional printed board/system assembly, manufacturing and test operations. This method is applicable to surface mounted BGA components larger than 15.0 mm on a side with organically based substrates, attached to printed boards using conventional solder reflow technologies. This document was developed cooperatively with JEDEC.
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IPC-9708 (PDF) Single User
Test Methods for Characterization of Printed Board Assembly Pad Cratering
Englisch, 17 Seiten, Dezember 2010, Englisch. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
Mechanical bend and shock tests are routinely performed on SMT assemblies to ensure that they can sustain anticipated production, handling and end use conditions. The strains and strain rates applied to SMT assemblies during bend and shock testing can lead to a variety of failure modes in the vicinity of the solder joints. This document provides test methods to evaluate the susceptibility of printed board assembly (PBA) materials and designs to cohesive dielectric failure underneath surface mount technology (SMT) attach pads. The test methods, which include pin-pull, ball-pull, and ball shear, can be used to rank order and compare different printed board materials and design parameters.
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IPC-9709 (Hardcopy)
Test Guidelines for Acoustic Emission Measurement during Mechanical Testing
Englisch. Stand:2013, 11 Seiten (Hardcopy)
Surface mount pad cratering typically initiates prior to detection by existing electrical monitoring test methods. There are limited instrumentation techniques that are currently available that can identify non-electrical damage and its location to a high degree of accuracy. This guideline document establishes an acoustic emission (AE) method to evaluate the performance and reliability of surface mount attachments of electronics assemblies during mechanical loading.
IPC-9709 (PDF) Single User
Test Guidelines for Acoustic Emission Measurement during Mechanical Testing
Englisch. Stand:2013, 11 Seiten. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
Surface mount pad cratering typically initiates prior to detection by existing electrical monitoring test methods. There are limited instrumentation techniques that are currently available that can identify non-electrical damage and its location to a high degree of accuracy. This guideline document establishes an acoustic emission (AE) method to evaluate the performance and reliability of surface mount attachments of electronics assemblies during mechanical loading.
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IPC-9716 (Hardcopy)
Requirements for Automated Optical Inspection (AOI) Process Control for Printed Board Assemblies
Englisch. 28 Seiten. Stand: Dezember 2024
IPC-9716 provides requirements for automated optical inspection (AOI) systems to define, set up, establish, and apply process control for manufacturing printed board assemblies, including general and specific process and AOI system conditions. Requirements include inspection parameters, lighting conditions, calibration, detectability, resolution, threshold limits, program setups, measurement system analysis (MSA), maintenance, and verification protocols.
IPC-9716 (PDF) Single User
Requirements for Automated Optical Inspection (AOI) Process Control for Printed Board Assemblies
Englisch. 28 Seiten. Stand: Dezember 2024
PC-9716 provides requirements for automated optical inspection (AOI) systems to define, set up, establish, and apply process control for manufacturing printed board assemblies, including general and specific process and AOI system conditions. Requirements include inspection parameters, lighting conditions, calibration, detectability, resolution, threshold limits, program setups, measurement system analysis (MSA), maintenance, and verification protocols.
IPC-9797 (Hardcopy)
Press-fit Standard for Automotive Requirements and other High-Reliability Applications
Englisch. Stand: Mai 2020, 52 Seiten (Hardcopy)
IPC-9797 is the only industry-consensus standard for Requirements and Acceptance of Press-fit Pins. IPC-9797 prescribes practices for the characterization, qualification and acceptance requirements of compliant press-fit technology for printed boards that cover the manufacturability and reliability needs for high reliability applications intended for use in harsh environments such as automotive and aerospace.
IPC-9797 (PDF) Single User
Press-fit Standard for Automotive Requirements and other High-Reliability Applications
Englisch. Stand: Mai 2020, 52 Seiten. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
IPC-9797 is the only industry-consensus standard for Requirements and Acceptance of Press-fit Pins. IPC-9797 prescribes practices for the characterization, qualification and acceptance requirements of compliant press-fit technology for printed boards that cover the manufacturability and reliability needs for high reliability applications intended for use in harsh environments such as automotive and aerospace.
IPC-9797A (Hardcopy)
Press-fit Standard for Automotive Requirements and other High-Reliability Applications
Englisch. Stand: Mai 2023, 60 Seiten
IPC-9797A is the only industry-consensus standard for Requirements and Acceptance of Press-fit Pins. IPC-9797 describes materials, methods, tests and acceptance criteria for solderless press-fit pin connections. PC-9797 is supported by IPC-HDBK-9798 “Handbook for Press-fit Standard for Automotive Requirements and other High-Reliability Applications” for those wanting additional information and explanation for press-fit technology.
