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IPC-9201A (PDF) Single User
Surface Insulation Resistance Handbook
Englisch. 86 pages. Stand: September 2007. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
Surface Insulation Resistance (SIR) testing is a tool used not only for characterization testing of production processes such as solder masks, soldering flux, and conformal coatings, but also for examining the electrochemical reactions at each stage of the electronic assembly production process. This handbook covers the terminology, theories, test procedures and test vehicles of SIR testing, including temperature-humidity (TH) and temperature-humidity-bias (THB). Discussions on failure modes and troubleshooting are also included. Revision A provides significant expansion on the discussion of available industry test vehicles for SIR as well as test chamber setup. 86 pages. Released August 2007.
IPC-9202 (Hardcopy)
Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance
Englisch, 11 Seiten, Release 2011
This document provides tests that record changes in surface insulation resistance (SIR) on a representative sample of a printed circuit assembly. It quantifies any deleterious effects that might arise from solder flux or other process residues left on external surfaces after soldering, which can cause unwanted electrochemical reactions that grossly affect reliability. It uses test vehicles that are intended to be representative of the electronic circuits that are in production and is a test yielding both quantitative and qualitative data. This test may be used for process qualification, demonstrating that a proposed manufacturing process or process change can produce hardware with acceptable end-item performance related to cleanliness. This test may also be used for process characterizations, including development of new processes or improvements to an existing process.
IPC-9202 (PDF) Single User
Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance
Englisch, 11 Seiten, Release 2011. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
This document provides tests that record changes in surface insulation resistance (SIR) on a representative sample of a printed circuit assembly. It quantifies any deleterious effects that might arise from solder flux or other process residues left on external surfaces after soldering, which can cause unwanted electrochemical reactions that grossly affect reliability. It uses test vehicles that are intended to be representative of the electronic circuits that are in production and is a test yielding both quantitative and qualitative data. This test may be used for process qualification, demonstrating that a proposed manufacturing process or process change can produce hardware with acceptable end-item performance related to cleanliness. This test may also be used for process characterizations, including development of new processes or improvements to an existing process.
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IPC-9202A (Hardcopy)
Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance Using the IPC-B-52 Test Assembly
English, 20 Pages, Release 2022.
The IPC-9202A, Material and Process Characterization/Qualification Test Protocol that records changes in Surface Insulation Resistance (SIR) on a representative sample of a printed circuit assembly (PCA). It quantifies any deleterious effects that might arise from solder flux or other process residues left on external surfaces after soldering, which can cause unwanted electro-chemical reactions that grossly affect reliability. It uses test vehicles that are intended to be representative of the electronic circuits that are in production. It is a test, yielding both quantitative and qualitative data. The IPC-9202A test may be used for Process Qualification, demonstrating that a proposed manufacturing process or process change can produce hardware with acceptable end-item performance related to electrochemical risk. Changes may involve any assembly process step, or a change in the printed board supplier, solder mask or metallization, soldering material supplier, conformal coating, etc. The test vehicle construction will vary depending upon the type of change being evaluated.
IPC-9203A (Hardcopy)
Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle
Englisch. Stand 2022, 48 Seiten
While there are a variety of industry test vehicles for the examination of materials compatibility, most available test boards leave something to be desired as there is often a dramatic difference in materials between such test boards and produced assemblies. A test vehicle was needed which could be used for both ion chromatography and SIR testing that would be more representative of mainstream manufacturing materials and processes. This document addresses the IPC-B-52 standard test vehicle which can be used to evaluate optimize a manufacturing process or to provide objective evidence that a chosen manufacturing material set and manufacturing process are compatible from a cleanliness standpoint. This user guideline has also been written as a companion document to the IPC-9202, providing clarification on what a manufacturer "should" do and what a manufacturer "must" do for demonstrating materials and process compatibility.
IPC-9203A (PDF) Single User
Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle
Englisch. Stand 2022, 48 Seiten, Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
While there are a variety of industry test vehicles for the examination of materials compatibility, most available test boards leave something to be desired as there is often a dramatic difference in materials between such test boards and produced assemblies. A test vehicle was needed which could be used for both ion chromatography and SIR testing that would be more representative of mainstream manufacturing materials and processes. This document addresses the IPC-B-52 standard test vehicle which can be used to evaluate optimize a manufacturing process or to provide objective evidence that a chosen manufacturing material set and manufacturing process are compatible from a cleanliness standpoint. This user guideline has also been written as a companion document to the IPC-9202, providing clarification on what a manufacturer "should" do and what a manufacturer "must" do for demonstrating materials and process compatibility.
IPC-9204 (PDF) Single User
IPC-9204: Guideline on Flexibility and Stretchability Testing for Printed Electronics
Englisch. 26 Seiten, Stand März 2017, Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
This guideline describes flexibility and stretchability testing to evaluate printable electronics for stretchable and wearable applications. 26 pages. Released March 2017
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IPC-9241 (Hardcopy)
Guidelines for Microsection Preparation
Englisch. 44 Seiten, Stand 2016, (Hardcopy)
This standard is intended as a guideline in the proper preparation of a metallographic sample (microsection) of a printed board. The finished microsection is used for evaluating the quality of the laminate system and plated structures (e.g. PTHs and vias). Microsection sample preparation is regarded by many as a highly developed skill. The guidelines in this standard discuss the many variables and problems associated with the process from sample removal to micro-etch. The guidelines do not promote any one vendor’s process, but discuss the variables common to microsectioning.
IPC-9241 (PDF) Single User
Guidelines for Microsection Preparation
Englisch. 44 Seiten, Stand 2016, (PDF) Single User, Keine Druckberechtigung, DRM-geschützt
This standard is intended as a guideline in the proper preparation of a metallographic sample (microsection) of a printed board. The finished microsection is used for evaluating the quality of the laminate system and plated structures (e.g. PTHs and vias). Microsection sample preparation is regarded by many as a highly developed skill. The guidelines in this standard discuss the many variables and problems associated with the process from sample removal to micro-etch. The guidelines do not promote any one vendor’s process, but discuss the variables common to microsectioning.
IPC-9252B (PDF) Single User
Requirements for Electrical Testing of Unpopulated Printed Boards
Englisch. 28 Seiten. Stand: 2016. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
IPC-9252 defines levels of appropriate testing and assists in the selection of the test analyzer, test parameters, test data and fixturing required to perform electrical test(s) on unpopulated printed boards and innerlayers. Revision B provides new requirements for resistive and indirect continuity and isolating testing, test record marking and traceability and an updated sample electrical test certificate of conformance (C of C).
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IPC-9257 (Hardcopy)
Requirements for Electrical Testing of Flexible Printed Electronics
Englisch. 28 Seiten. Stand: Februar 2021
The IPC-9257 standard assists in selecting the test equipment, test parameters, test data and fixturing required to perform electrical test(s) on flexible printed electronics. Electrical testing of flexible printed electronics ensures conformance to electrical design requirements specified in IPC-6902. The IPC-9257 standard defines different levels of testing available to achieve this purpose.
IPC-9261A (PDF) Single User
In-Process DPMO and Estimated Yield for PCAs
Englisch. Stand: Oktober 2006; 12 Seiten. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
Now updated to align with IPC-7912A for end item DPMO, this document defines consistent methodologies for computation of in-process defects per million opportunities (DPMO) metrics for any evaluation stage in the assembly process. It is intended for use in measuring in-process assembly steps rather than end product determination. Calculation of completed item DPMO is addressed in IPC-7912A. A guide to defect categorization is provided that can serve as a base for summarizing and reporting in-pro cess defects when used with J-STD-001 and IPC-A-610. It can also be used to develop process step estimated yield - the expected percentage of assemblies with no defects for a particular process step or combined process steps, based on historical defe ct rates.
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IPC-9500-K (PDF) Single User
Assembly Process Component Simulations, Guidelines & Classifications Package
Englisch. 79 pages. Set: IPC-9501 bis IPC-9504. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
Here's a convenient and cost effective way to own the complete set of process simulation documents for component attachment. This set of four documents, 9501-9504, contains the information you need to help you select components that will be compatibl e with your assembly process. Learn about manufacturing solder process limits, moisture sensitivity classifications, preconditioning and assembly process simulations. Save 50% on individual document prices. Each document is also available on its own. 79 total pages.
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IPC-9501 (Hardcopy)
PWB Assembly Process Simulation for Evaluation of Electronic Components
Englisch. 25 pages. Stand: Juli 1999
Will the components work with your process? That determination is the goal of these manufacturing process simulations; to ensure that components chosen meet expected reliability requirements after exposure to factory processes. This document specific ally addresses preconditioning of components. Developed for users and manufacturers, the procedure consists of a set of simulations for IC component storage and use, wave and reflow soldering (SMT and PTH parts), exposure to corrosive (water soluble) fluxes and exposure to often-used cleaning materials. 25 pages.
IPC-9501 (PDF) Single User
PWB Assembly Process Simulation for Evaluation of Electronic Components
Englisch. 25 pages. Stand: Juli 1995. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
Will the components work with your process? That determination is the goal of these manufacturing process simulations; to ensure that components chosen meet expected reliability requirements after exposure to factory processes. This document specific ally addresses preconditioning of components. Developed for users and manufacturers, the procedure consists of a set of simulations for IC component storage and use, wave and reflow soldering (SMT and PTH parts), exposure to corrosive (water soluble) fluxes and exposure to often-used cleaning materials. 25 pages.
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IPC-9502 (PDF) Single User
PWB Assembly Soldering Process Guideline for Electronic Components
Englisch. 12 pages. Stand: April 1999. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
This document describes the manufacturing solder process limits that components subjected to IPC-9501, IPC-9504 and J-STD-020 would survive. It does not include optimum conditions for assembly, but provides guidelines to ensure components are not dam aged. This document applies to both surface-mount (SM) and through-hole (TH) components that are wave soldered, reflowed or hand soldered. This document is intended to complement other industry documents. Note: This document does not address the incr eased temperature requirements of lead-free solders. 12 pages.
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IPC-9505 (Hardcopy)
Guideline Methodology for Assessing Component and Cleaning Materials Compatibility
Englisch, 52 Seiten, Stand September 2017, Hardcopy
The IPC-9505 standard provides details of test methodologies for cleaning chemistry compatibility with electronic assembly materials that replace those in MIL-STD-202 Method 215 for testing electronic and electrical components such as capacitors, resistors, transformers and inductors. The test methods can also be used, when applicable, to parts not covered by military specifications or drawings.
IPC-9505 (PDF) Single User
Guideline Methodology for Assessing Component and Cleaning Materials Compatibility
Englisch. 52 Seiten, Stand Oktober 2017, Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
The IPC-9505 standard provides details of test methodologies for cleaning chemistry compatibility with electronic assembly materials that replace those in MIL-STD-202 Method 215 for testing electronic and electrical components such as capacitors, resistors, transformers and inductors. The test methods can also be used, when applicable, to parts not covererd by military specifications or drawings
IPC-9591 (PDF) Single User
Performance Parameters (Mechanical, Electrical, Environmental and Quality/Reliability) for Air Moving Devices
Englisch. 19 pages. Stand April 2006. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
This document standardizes the Performance Parameters for Air Moving Devices. The phrase 'Air Moving Device' (or 'Air Mover') refers to equipment such as, fans, blowers and other forced air movement technologies. These Air Moving Devices are used in the electronics industry for the cooling of heat-producing components, and range from small devices mounted directly to hot components such as microprocessor air moving devices, to larger devices used to force air through a chassis containing many he at dissipating components. This specification sets requirements for design, manufacture, and test application of Air Moving Devices, and is intended for use by the industry. The term 'end user' as used in this document refers to the OEM or design/mat erials entity responsible for specifying the function and reliability of an Air Moving Device in a final product application. 19 pages. Released April 2006.
Included in Manual S-100 and the IPC-E-500 Series
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IPC-9592B (PDF) Single User
Requirements for Power Conversion Devices for the Computer and Telecommunications Industries
Englisch, Stand: Januar 2013, 126 Seiten Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
This document standardizes the requirements for power conversion devices (PCDs) for the computer and telecommunications industries. The phrase -power conversion devices- refers to ac to dc and dc to dc modules, converters and power supplies. This specification sets the requirements for design; qualification testing; conformance testing and manufacturing quality/reliability processes, but does not include the functional requirements of the specific equipment. PCDs addressed in this document are used in the electronics industry to provide conversion of main power sources, usually ac to lower dc voltages for direct use of electronic circuits or as a secondary source for additional dc to dc PCDs to provide several dc voltage levels for various electronic devices in a product. Revision B of this document includes updated performance evaluations, including thermal and vibration; temperature, humidity and bias; temperature cycling; shock and vibration; random vibration and free-fall drop and shock tests. Additionally, nearly all of the device (component) derating guidelines were updated, including capacitors, resistors, diodes, transistors, transformers, inductors, microcircuits, circuit breakers, fuses, relays, switches and oscillators. The revision also provides more current and correct definitions for reliability terms, including the mean time between failure or MTBF.
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