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IPC-6012E-DE Papierversion
Qualifikation und Leistungsspezifikation für starre Leiterplatten
Deutsch. 80 Seiten. Stand: August 2020.
Die Spezifikation IPC-6012E-DE behandelt die Qualifikation und Leistungsspezifikation starrer Leiterplatten und umfasst einseitige und zweiseitige Leiterplatten mit/ohne metallisierte(n) Löcher(n) und Multilayer-Leiterplatten mit/ohne Sacklöcher(n) und nicht-durchgehende(n) Verbindungslöcher(n) sowie Metallkern-Leiterplatten. Sie behandelt Anforderungen an Endoberflächen und Metallisierungsbeschichtungen, Leiterbahnen, Löcher/Durchverbindungen, die erforderliche Häufigkeit von Annahmetests und Qualitätskontrollkriterien sowie elektrische, mechanische und Umwelt-Anforderungen. IPC-6012E-DE enthält viele neue und erweiterte Anforderungen in Bereichen wie z. B. tiefengebohrte Löcher, alternative Endoberflächen, Kupfer-Schultermetallisierung, Bezeichnungsdruckfarben, Lötbarkeitsprüfung, Metallisierungsüberhang, Bewertung von Schliffbildern, Thermischer Schock und leistungsbasierte Prüfungen für Microvia-Strukturen. Vorgesehen für die Verwendung mit IPC-6011. Ersetzt IPC-6012D-DE.
IPC-6012EA (Hardcopy)
Automotive Applications Addendum to IPC-6012E Qualification and Performance Specification for Rigid Printed Boards
English. 16 pages. Released October 2021.
The IPC-6012EA Addendum, when required by procurement documentation/drawings, supplements or replaces specifically identified requirements of IPC-6012 revision E, or rigid printed boards that must survive the vibration and thermal cycling environments of electronic interconnects within the automotive industry. The addendum includes updated requirements for lifted lands, pattern feature accuracy, dielectric removal (e.g. wicking), solder mask thickness, cleanliness and suitability and reliability testing parameters specific to automotive applications.
IPC-6012EA (PDF) Single User
Automotive Applications Addendum to IPC-6012E Qualification and Performance Specification for Rigid Printed Boards
English. 16 pages. Released October 2021. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
The IPC-6012EA Addendum, when required by procurement documentation/drawings, supplements or replaces specifically identified requirements of IPC-6012 revision E, for rigid printed boards that must survive the vibration and thermal cycling environments of electronic interconnects within the automotive industry. The addendum includes updated requirements for lifted lands, pattern feature accuracy, dielectric removal (e.g. wicking), solder mask thickness, cleanliness and suitability and reliability testing parameters specific to automotive applications.
IPC-6012EM (Hardcopy)
Medical Applications Addendum to IPC-6012E Qualification and Performance Specification for Rigid Printed Boards
English. 20 pages. Released 08/2020.
The IPC-6012EM Addendum, when required by procurement documentation/drawings, supplements or replaces specifically identified requirements of IPC-6012E, for rigid printed boards that must meet requirements to high reliability medical device applications. IPC-6012EM is the only global industry-consensus standard for Medical Applications to Qualification and Performance Specifications for Rigid Printed Boards.
IPC-6012EM (PDF) Single User
Medical Applications Addendum to IPC-6012E Qualification and Performance Specification for Rigid Printed Boards
English. 20 pages. Released 9/10/2020. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
The IPC-6012EM Addendum, when required by procurement documentation/drawings, supplements or replaces specifically identified requirements of IPC-6012E, for rigid printed boards that must meet requirements to high reliability medical device applications. IPC-6012EM is the only global industry-consensus standard for Medical Applications to Qualification and Performance Specifications for Rigid Printed Boards.
IPC-6012ES (Hardcopy)
Space and Military Avionics Applications Addendum to IPC-6012E, Qualification and Performance Specification for Rigid Printed Boards
English. 20 pages. Released 2020.
The IPC-6012FS space addendum provides exceptions to IPC Performance Class 3 requirements of the IPC-6012F for use in space and military avionics product. Exceptions include changes to acceptance criteria and/or sample size and test frequency for production lot acceptance testing. The IPC-6012FS covers requirements for rigid printed boards to survive vibration, extreme thermal cycling and ground testing associated with space travel environment. Supersedes IPC-6012ES.
IPC-6012F (Hardcopy)
Qualification and Performance Specification for Rigid Printed Boards
English. 80 pages. Released 2023.
IPC-6012F, covers qualification and performance of rigid printed boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as electrical, mechanical and environmental requirements. IPC-6012 revision F incorporates many new and expanded requirements in areas such as printed board cavities, copper wrap plating, “intermediate” target lands, solderability testing, dewetting, microsection evaluation, internal plated layers, dielectric spacing and reliability issues with microvia structures. IPC 6012F is used with IPC-6011 and supersedes IPC-6012E.
IPC-6012F (PDF) Single User
Qualification and Performance Specification for Rigid Printed Boards
English. 80 pages. Released: September 2023.
IPC-6012F, covers qualification and performance of rigid printed boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as electrical, mechanical and environmental requirements. IPC-6012 revision F incorporates many new and expanded requirements in areas such as printed board cavities, copper wrap plating, “intermediate” target lands, solderability testing, dewetting, microsection evaluation, internal plated layers, dielectric spacing and reliability issues with microvia structures. IPC 6012F is used with IPC-6011 and supersedes IPC-6012E.
IPC-6012F-Redline (PDF) Single User
Qualification and Performance Specification for Rigid Printed Boards - Redline
Englisch. 133 Seiten. Stand: Januar 2023
IPC-6012F Redline document shows the changes from IPC-6012E to IPC-6012F in a side-by-side comparison of the two documents. The IPC-6012F redline is available in both electronic and hardcopy format.
IPC-6012FS (Hardcopy)
Space and Military Avionics Applications Addendum to IPC-6012F, Qualification and Performance Specification for Rigid Printed Boards
English. 20 pages. Published Date: 02/01/2024
This Addendum supplements or replaces specifically identified requirements of IPC-6012D, Revision D, for rigid printed boards that must survive the vibration, ground testing and thermal cyclic environments of space and military avionics.
