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Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

Englisch. Stand: November 2017. 65 Seiten. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)

IPC-J-STD-002E prescribes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs, and tabs. The IPC-J-STD-002E standard also includes a test method for the resistance to dissolution/dewetting of metallization. IPC-J-STD-002E is intended for use by both supplier and user. The IPC-J-STD-002E standard was developed by the following three organizations: ECIA, IPC and JEDEC.
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Handbook and Guide to Supplement J-STD-001

English. 120 pages. Released Februar 2016. Keine Druckberechtigung, DRM-Schutz, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)

This handbook is a companion reference to J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies. The intent of the Handbook is to provide supporting information for the Standard, explain the "how-to" and "why" behind the criteria and provide the fundamentals for the processes to make acceptable soldered connections. Released February 2016
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Guide to Solder Paste Assessment

Englisch. 50 Seiten. Stand: January 2006. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)

This handbook is a companion to the solder paste standard J-STD-005 and should be considered to be a guide to help assess the applicability of a solder paste for its use in surface mount technology (SMT) processes. This document also suggests some te st methods that can help with designing and testing solder pastes. It is intended for use by both vendors and users of solder paste.This document has been written as a guide to assess the applicability of a solder paste for a specific process, given the tremendous number of permutations of different materials, atmospheres and process variables currently available.
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Handbook on Adhesive Bonding in Electronic Assembly Operations

Englisch, Seiten 58. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)

This handbook assists individuals who make choices regarding adhesive bonding or who must work in adhesive bonding operations for electronic assemblies. The full-color guide also provides guidelines for design, selection and application of adhesive bonding.
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Guidelines for Design, Selection and Application of Conformal Coatings

Englisch. 183 Seiten. Stand: Oktober 2013. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)

This handbook is a compilation of the conformal coating industry's practical experience, and will assist the designers and users of conformal coatings in making informed choices. Users will better understand the properties of the various conformal coatings, the results to be achieved by its application and how to verify that these goals have been met. Use this document as a supplement in conjunction with the industry standard for qualification and quality conformance of conformal coating, IPC-CC-830B. Revision "A" significantly updates the environmental, health, and safety information when dealing with conformal coatings including advice on use of Web-based MSDS reporting. Use of conformal coating for tin whisker and fungus mitigation is also discussed as well as flammability issues. Content of the standard includes the very latest from industry experts on the application and selection of conformal coatings.
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Solder Mask Handbook

Englisch. Stand: September 2006; 72 Seiten, Keine Druckberechtigung, DRM-Schutz, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)

IPC-HDBK-840 supplements the solder mask requirements established in IPC specifications such as IPC-SM-840 and IPC-6012 by providing detailed information on solder mask types, application processes, pre- and post- assembly processes, characteristics and properties that are useful in the selection and use of the most appropriate mask type for a given application. Applicable to solder mask manufacturers, processing equipment manufacturers, PCB manufacturers, assembly manufacturers and ancillary ch emical suppliers.
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Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly

Englisch. 68 pages. Stand: July 2012. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)

This handbook has been written to assist the designers and users of potting and encapsulation in understanding the characteristics of various materials, as well as the factors that can modify those characteristics when the potting or encapsulation is applied. The equipment and processes involved in the preparation and application of potting and encapsulation are also covered. The challenge in developing this handbook is that there has been no clear industry definition that distinguished between potting and encapsulation. From glob-top to dam-and-fill, this document uses terminology associated with processes related only to electronic printed circuit board assembly and protection. Understanding and accounting for these materials can ensure the reliability and function of electronics.
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Specification for Finished Fabric Woven from "E" Glass for Printed Boards

Englisch. 28 Seiten. Stand: November 2021

The IPC-4412C covers the requirements for reinforcements woven from "E"glass yarn. These reinforcements are used in the production of prepregs, some of which are pressed into laminates. These prepregs and laminates are the base materials for rigid and mulitlayer printed boards. The IPC-4412C standard contains tables which describe each fabriic style in detail including the yarn used, the number of yarns per unit area, the basis weight and the thickness. The IPC-4412C standard also includes the quality assurance aspects of these strategic building blocks for base materials.