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IPC-4204B (Hardcopy)
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards
Englisch. 56 Seiten. Stand: August 2018
IPC-4204B establishes the classification system, the qualification and quality performance requirements for flexible metal-clad dielectric materials to be used for the fabrication of flexible printed boards. It encompasses 12 specification sheets that result from the combinations of various copper foil claddings; a polymer base dielectric selected from polyesters, polyimides, liquid crystal polymers and at least nine versions of polymer adhesives as well as adhesiveless bonding agents. The net result of these material combinations provide the industry with suitable clad, flexible dielectrics for fabricating flexible printed board interconnections. IPC-4204B also addresses how to utilize legacy designs that refer to earlier, out-of-date material designations.
Artikel-Nr. 3565
IPC-4204B (PDF) Single User
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards
Englisch. 56 Seiten. Stand: August 2018
IPC-4204B establishes the classification system, the qualification and quality performance requirements for flexible metal-clad dielectric materials to be used for the fabrication of flexible printed boards. It encompasses 12 specification sheets that result from the combinations of various copper foil claddings; a polymer base dielectric selected from polyesters, polyimides, liquid crystal polymers and at least nine versions of polymer adhesives as well as adhesiveless bonding agents. The net result of these material combinations provide the industry with suitable clad, flexible dielectrics for fabricating flexible printed board interconnections. IPC-4204B also addresses how to utilize legacy designs that refer to earlier, out-of-date material designations
IPC-4411A (PDF) Single User
Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement
Englisch. 22 pages. Stand: November 2003. Keine Druckberechtigung, DRM-Schutz, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
Covers the nomenclature, definitions and requirements for reinforcement made from nonwoven para-aramid fibers. Para-aramid reinforcement is primarily used in PCBs for HDI and high speed/high frequency applications. IPC-4411A also includes specificati on sheets, which can be used when selecting and purchasing nonwoven para-aramid reinforcement. Includes the incorporation of 14 new nonwoven para-aramid reinforcement specification sheets and the deletion of four nonwoven para-aramid materials that a re no longer commercially available. Due to a test method correction, all specification sheets have been updated. 22 pages.
IPC-4412B (Hardcopy)
Specification for Finished Fabric Woven from E Glass for Printed Boards
Englisch. 27 pages. Released: 06/2013
IPC-4412B exhaustively covers the classification and requirements for finished fabrics that are formed by plain woven glass fiber yarns. Simply, these yarns are appropriately sized bundles of continuous filament, electrical-grade ("E" glass) borosilicate glass. Bulk "E" glass, for ease of description, is composed of a blend of raw metal oxides that form a borosilicate glass upon melting. Once melted, the glass formed loses all relation to the raw metal oxides, including the network forming boron oxides or borates. This specification includes two extensive tables of finished fabric glass styles, one in SI (metric) units and the other in U.S. (English) units. Supersedes IPC-4412A with Amendments 1, 2 and 3, IPC-EG-140 with Amendments 1 & 2 and, in turn, IPC-EG-140.
IPC-4412B (PDF) Single User
Specification for Finished Fabric Woven from E Glass for Printed Boards
Englisch. 27 seiteb. Stand: Juni 2013. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
IPC-4412B exhaustively covers the classification and requirements for finished fabrics that are formed by plain woven glass fiber yarns. Simply, these yarns are appropriately sized bundles of continuous filament, electrical-grade ("E" glass) borosilicate glass. Bulk "E" glass, for ease of description, is composed of a blend of raw metal oxides that form a borosilicate glass upon melting. Once melted, the glass formed loses all relation to the raw metal oxides, including the network forming boron oxides or borates. This specification includes two extensive tables of finished fabric glass styles, one in SI (metric) units and the other in U.S. (English) units. Supersedes IPC-4412A with Amendments 1, 2 and 3, IPC-EG-140 with Amendments 1 & 2 and, in turn, IPC-EG-140.
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IPC-4552-DE Papierversion
Spezifikation für chemisch Nickel/Gold (ENIG) für Oberflächen von Leiterplatten
Deutsch, Stand: Oktober 2002, 27 Seiten farbig
Anwendungsbereich:
Diese Spezifikation legt die Anforderungen an chemisch Nickel/Gold (ENIG)-Oberflächen als Endoberflächen von Leiterplatten fest. Die Richtlinie spezifiziert auf der Basis von Leistungskriterien die Anforderungen an ENIG-Schichtdi cken. Sie ist für die Verwendung durch Lieferanten, Leiterplattenhersteller, Elektronik-Dienstleister (EMS) und OEM-Hersteller vorgesehen.
ANSI Approved
In answer to numerous industry requests for guidance on Electroless Nickel/Immersion Gold ( ENIG), the IPC-4552 has been developed. Containing full color photographs, this specification sets the requirements for the use of ENIG as a surface finish for printed circuit boards. It includes requirements for ENIG deposit thicknesses based on per formance criteria. It will be an invaluable resource for use by suppliers, board fabricators, electronics manufacturing services (EMS) and original equipment manufacturers (OEMs). The specification's Appendix also includes a FREE copy of the highly s ought after technical paper 'Standard Developments Efforts of Electroless Nickel Immersion Gold' by George Milad and Gerard O'Brien.
The ENIG board surface finish is an electroless nickel layer capped with a thin layer of immersion gold. The immer sion gold protects the underlying nickel from oxidation or passivation over its intended life. It is a multifunctional surface finish, applicable to soldering, aluminum wire bonding, press fit connections, and as a contact surface.
IPC-4552-DE-CD Single User
Spezifikation für chemisch Nickel/Gold (ENIG) für Oberflächen von Leiterplatten
Deutsch, Stand: Oktober 2002, 27 Seiten farbig, Einzelplatzlizenz - Nicht druckbar
Anwendungsbereich:
Diese Spezifikation legt die Anforderungen an chemisch Nickel/Gold (ENIG)-Oberflächen als Endoberflächen von Leiterplatten fest. Die Richtlinie spezifiziert auf der Basis von Leistungskriterien die Anforderungen an ENIG-Schichtdi cken. Sie ist für die Verwendung durch Lieferanten, Leiterplattenhersteller, Elektronik-Dienstleister (EMS) und OEM-Hersteller vorgesehen.
ANSI Approved
In answer to numerous industry requests for guidance on Electroless Nickel/Immersion Gold ( ENIG), the IPC-4552 has been developed. Containing full color photographs, this specification sets the requirements for the use of ENIG as a surface finish for printed circuit boards. It includes requirements for ENIG deposit thicknesses based on per formance criteria. It will be an invaluable resource for use by suppliers, board fabricators, electronics manufacturing services (EMS) and original equipment manufacturers (OEMs). The specification's Appendix also includes a FREE copy of the highly s ought after technical paper 'Standard Developments Efforts of Electroless Nickel Immersion Gold' by George Milad and Gerard O'Brien.
The ENIG board surface finish is an electroless nickel layer capped with a thin layer of immersion gold. The immer sion gold protects the underlying nickel from oxidation or passivation over its intended life. It is a multifunctional surface finish, applicable to soldering, aluminum wire bonding, press fit connections, and as a contact surface.
IPC-4552A (Hardcopy)
IPC-4552A: Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards
Englisch. 148 Seiten. Stand: 2017
The IPC-4552A performance specification sets requirements for Electroless Nickel/Immersion Gold (ENIG) deposit thicknesses for applications including soldering, wire bonding and as a contact finish. The IPC-4552A is intended for use by chemical suppliers, printed board manufacturers, electronics manufacturing services (EMS) and original equipment manufacturers (OEM). The IPC-4552A standard may be used to specify acceptance criteria to meet performance requirements in addition to those found in the IPC-6010-FAM Printed Board Performance Specifications. The ENIG deposit specified by using this document will meet the highest coating durability rating as specified in the J-STD-003 printed board solderability specification.
The IPC-4552A specification is based on three critical factors:
1. The ENIG plating process is in control producing a normal distribution for nickel and gold deposit thickness.
2. That the tool used to measure the deposit and therefore control the process is accurate and reproducible for the thickness range specified.
3. That the ENIG plating process results in uniform deposit characteristics.
If any of these three critical factors are not met, then the deposit produced will not meet the performance criteria defined
IPC-4552A (PDF) Single User
Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards
Englisch. 148 Seiten. Stand: 08/2017. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
The IPC-4552A performance specification sets requirements for Electroless Nickel/Immersion Gold (ENIG) deposit thicknesses for applications including soldering, wire bonding and as a contact finish. The IPC-4552A is intended for use by chemical suppliers, printed board manufacturers, electronics manufacturing services (EMS) and original equipment manufacturers (OEM). The IPC-4552A standard may be used to specify acceptance criteria to meet performance requirements in addition to those found in the IPC-6010-FAM Printed Board Performance Specifications. The ENIG deposit specified by using this document will meet the highest coating durability rating as specified in the J-STD-003 printed board solderability specification.
The IPC-4552A specification is based on three critical factors:
1. The ENIG plating process is in control producing a normal distribution for nickel and gold deposit thickness.
2. That the tool used to measure the deposit and therefore control the process is accurate and reproducible for the thickness range specified.
3. That the ENIG plating process results in uniform deposit characteristics.
If any of these three critical factors are not met, then the deposit produced will not meet the performance criteria defined.
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IPC-4552B (Hardcopy)
Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards
Englisch. 156 Seiten. Stand: 2021
IPC-4552B standard sets the requirements for Electroless Nickel / Immersion Gold (ENIG) deposit thickness for applications including soldering, wire bonding, and as a contact finish. IPC-4552B standard is used to specify acceptance criteria to meet performance standards for IPC-6010 family of documents including IPC-6012, IPC-6013 and IPC-6018. The ENIG deposit specified using this document will meet the highest coating durability rating as specified in IPC-J-STD-003 printed board solderability specification.
