Solder Materials Family
Englisch. Inkl. J-STD-002, J-STD-003, J-STD-004, J-STD-005, J-STD-006
This is a family of specifications on soldering materials and solderability testing used in the printed board assembly processes.
J-STD-002 EIA/IPC/JEDEC J-STD-002D Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
J-STD-003 Solderability Tests for Printed Boards
J-STD-004 Requirements for Soldering Fluxes
J-STD-005 Requirements for Soldering Pastes
J-STD-006 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications