Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics
Englisch, Stand Januar 2018
Encapsulation, for the purpose of IPC-7621 standard, is defined as a low pressure molded thermoplastic, e.g., polyamide, which is brought to a liquid state and injection molded and (rather quickly) returned to a temperature below its melting point., forming a durable yet pliable (rubbery-like) form. The desired performance characteristics of low pressure molding (LPM) encapsulation depend on the application and must be considered when selecting material. Users are urged to consult material suppliers for detailed technical data. The IPC-7621 standard will aid the user in understanding the capabilities and limits of LPM using thermoplastics. It is the responsibility of the user to determine the suitability, via appropriate testing, of the selected encapsulation and if the application method is suitable for a particular end use application, including but not limited to: Inhibit current leakage and short circuit due to humidity and contamination from service environment.
Inhibit corrosion, tarnish.
Encapsulation may help in reducing the stresses due to CTE mismatches.
Inhibit arcing and corona, in particular, for high voltage applications.
Provide mechanical support and to prevent damages due to mechanical shock and vibration.
Provide a mitigation method limiting the growth of tin-whiskers.
Promote longer life in battery operated devices by limiting parasitic voltage leaching.
Inhibit ability of dendritic element formation.
Prevent damage of circuit by assemblers, installers and end users.