Resin Coated Copper Foil for Printed Boards Guideline
Englisch. Stand: November 2007, 19 pages. Keine Druckberechtigung (Download)
This guideline covers the requirements for resin coated copper foil intended for use in the formation of high density interconnect surface microvias for printed boards and printed board assemblies.
Included in Manuals M-105, M-107, S-100 & the E- 500 Collection.