FED Library of Knowledge Volume 17 - FED-Project: "Transition from rigid – flex area” final report
1st edition 2017, DIN A5, 26 pages, color, English
One area that is described incompletely in the current design rules and thus repeatedly leads to "grey areas" in technical specifications is the transition area "rigid to flex" for rigid-flex PCBs. The German Association for Design, PCB and Electronics Manufactury (FED), Working Group PCB has started a project to fix design rules for this area. In the present volume 17 of the BdW the final report of the project is published. It can be said that the test results obtained are not yet sufficient for design rules, but a number of design recommendations can be derived which have a significant influence on the quality and reliability of flex-rigid PCBs. A different bending cycle duration between ED electrolytic copper and RA rolled copper was found in the test samples. In the Flex to Rigid overlap area, different widths of 0.3mm / 0.5mm / 1.0mm were tested, with meaningful results. And where did the failures in the bending test occur in the test samples? In the flex or transition area? To be read in the present final report.
Editorial office: Dietmar Baar, FED e. V.
Cover photo: ATIS Bending Tester, Fraunhofer Institute - EFNT
4608 - Band17 Englisch