IPC-7094A (Hardcopy) english
Design and Assembly Process Implementation for Flip Chip and Die Size Components
Englisch. 92 pages.Released Januar 2018
IPC-7094A describes the design and assembly challenges for implementing flip chip technology in a direct chip attach (DCA) assembly. The effect of bare-die or die-size components in a flip chip format has an impact on component characteristics and dictates the appropriate assembly methodology. The IPC-7094A standard focuses on design, assembly methodology, critical inspection, repair and reliability issues associated with flip chip and die-size package technologies, including wafer-level ball grid array (WLBGA). It provides useful and practical information to those who mount bare-die or die-size components in a DCA assembly or those who are considering flip chip process implementation.