Specification for Base Materials for High Speed/High Frequency Applications
Englisch. 67 pages. Stand: 2017
IPC-4103B standard covers the requirements for clad and unclad plastic laminate and bonding layer materials to be used for the fabrication of printed boards for microstrip, stripline and high speed digital electrical and electronic circuits. In addition to better definitions of inclusions and how to properly classify them; redefine "substrates" as, "fabricated sheets"; and a more proper definition of thermal conductivity of laminates and bonding material, IPC-4103B also allows the use of low permittivity (dielectric constant) glass reinforcements for laminates and bonding materials, thus improving both the permittivity and loss tangent properties of the materials conforming to this specification.