Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments
Englisch. 24 pages. Stand: Februar 2006. Keine Druckberechtigung.
Provides specific test methods to evaluate the performance and reliability of surface mount solder attachments of electronic assemblies. Establishes levels of performance and reliability of the solder attachments of surface mount devices to rigid, fl exible and rigid-flex circuit structures. When used with IPC-SM-785, it provides an understanding of the physics of SMT solder joint failure and an approximate means of relating performance tests results to the reliability of solder attachments in th eir use environments. Revision A includes Appendix B which provides recommended changes to the thermal cycling profiles given in the document when utilizing Pb-free solder joints. 24 pages. Released February 2006.