Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments
Englisch. 24 Seiten. Stand: 2022.
The IPC-9701B standard establishes a thermal cycling test method to characterize the fatigue lifetimes of surface mount solder attachments of electronic assemblies. The surface mount devices may be solder-attached to rigid, flexible or rigid-flex printed boards. The characterization results can be used to predict the field lifetime of solder attachments for the use environments and conditions of electronic assemblies.