FED-Shop

IPC-Richtlinien und FED-Dokumente zu Design, Leiterplatten- und Baugruppen-Fertigung jederzeit bequem bestellen

Alle PDF-Dateien sind DRM-geschützt! Bitte benennen Sie unter "Anmerkungen" den User der Datei (Vor-, Nachname und E-Mail).

Ihr Warenkorb ist leer.
Warenkorb ansehen
IPC Englisch LP-Fertigung Papierversion

IPC-6018C (Hardcopy)

Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

Englisch. 64 pages. Stand: 2016

This specification covers qualification and performance of high frequency (microwave) boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as electrical, mechanical and environmental requirements. Revision C incorporates many new requirements in areas such as HASL coatings, alternative surface finishes, edge plating, marking, microvia capture and target lands, copper cap plating of filled holes, copper filled microvias, PTFE smear and dielectric removal. For use with IPC-6011. Supersedes IPC-6018B and IPC-6016.