Component Identification Training and Reference Guide
Englisch. 78 pages. Stand: 2011
The Component Identification Training & Reference Guide is a valuable tool for employee training and quick reference. This comprehensive component identification resource for electronics assembly operators and inspectors contains color photographs, c omputer graphics, schematic symbols and detailed descriptions of more than 50 common through-hole and surface mount components used in electronics assembly today.
The new Revision H contains updated info on SSOP, TSOP, QFP, LQFP, PQFP, LCC, QFN, a nd BGA-related packages, including all the variations within those groups.
New components include DFN, QFN - Multi Row, PoP (Package on Package), CSP (ChipScale Package), COB (Chip on Board), Bare Die and Flip Chip. Also includes a new section str essing the dangers of cross contamination when using Lead Free components and assemblies.
The Terminology Section has quick facts on polarity, orientation, lead styles and Component Reference Designators (CRDs). The 'Reading Component Values' sect ion has full-color, easy-to-use color code charts for resistors and inductors, as well as charts for reading numbered capacitor data. Seventy-three pages. Released December 2007.
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