IPC-9502 (PDF) Single User
PWB Assembly Soldering Process Guideline for Electronic Components
Englisch. 12 pages. Stand: April 1999. Keine Druckberechtigung, DRM-Schutz
This document describes the manufacturing solder process limits that components subjected to IPC-9501, IPC-9504 and J-STD-020 would survive. It does not include optimum conditions for assembly, but provides guidelines to ensure components are not dam aged. This document applies to both surface-mount (SM) and through-hole (TH) components that are wave soldered, reflowed or hand soldered. This document is intended to complement other industry documents. Note: This document does not address the incr eased temperature requirements of lead-free solders. 12 pages.