IPC-7095D WAM1 (Hardcopy)
Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
Englisch. Stand: Januar 2019, 208 Seiten
IPC-7095D-AM1 describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair and reliability issues associated with design and assembly of printed boards using these packages. IPC-7095D-AM1 provides useful and practical information to those who use or are considering using BGAs. It also provides describes how to successfully implement robust design and assembly processes for printed board assemblies using BGAs as well as ways to troubleshoot some common anomalies which can occur during BGA assembly.