IPC-HM-860 (CD-ROM) Single User
Specification for Multilayer Hybrid Circuits
Englisch. 66 pages. Stand: Januar 1987. Keine Druckberechtigung
Covers the qualification and performance requirements of multilayer circuits used in hybrid packaging. These circuits consist of three or more layers of conductor patterns separated from each other by insulating materials and interconnected by a cont inuous metallic interlayer connection. The substrate may include passive elements. 66 pages.