IPC-SM-784 (PDF) Single User
Guidelines for Chip-on-Board Technology Implementation
Englisch.37 pages. Stand: November 1990. Keine Druckberechtigung, DRM-Schutz
Discusses chip types, board selection, design issues and thermal transfer methods for COB applications. Details wire bonding, TAB and flip chip designs and provides information on mounting materials, including adhesives, wires and various mechanical bonding techniques. 37 pages.