Surface Mount Solder Joint Evaluation Training & Reference Guide
Englisch. Stand: Januar 2018 (Hardcopy)
Updated to Revision G of the latest IPC-A-610 industry standard for the Acceptability of Electronic Assemblies, this Training & Reference Guide illustrates critical acceptance criteria for the evaluation of surface mount solder connections.
At only 44 pages and a compact 5.5 x 8.5 inch (14 x 21.5 cm) size, these convenient spiral-bound manuals make it easy for your inspectors and operators to make the right solder joint acceptance decisions for all three classes of product. Useful as a training aid in the classroom or on the shop floor, DRM-SMT contains computer generated color illustrations of Chip component, Gull Wing, J Lead, BTC and Area Array solder joints. Each drawing clearly shows the minimum acceptable condition for each type of component misalignment; and details all of the specifications for minimum/maximum solder joint size, including fillet heights and lengths.
DRM-SMT-G also contains high quality color microphotographs of the major solder defects and conditions such as nonwetting, solder bridging and disturbed joints, including samples of both tin-lead and lead-free solder connections. The appropriate specification/paragraph references from the IPC-A-610G (A610G) are included for each of the acceptance criteria for further verification.