Sectional Standard on Rigid Organic Printed Boards
Stand: Dezember 2010, 33 Seiten, Englisch
Used in conjunction with IPC-2221, IPC-2222 establishes the specific requirements for the design of rigid organic printed boards and other forms of component mounting and interconnecting structures.
This standard applies to single-sided, double-s ided or multi-layered boards. Key concepts in this document are: rigid laminate properties, design requirements for printed board assembly and design requirements for holes/interconnections. Revision A provides new design guidance and requirements fo r dielectric spacing, lead-free laminate materials, scoring and routing parameters, printed board thickness tolerance, nonfunctional lands, hole aspect ratios and clearance areas in planes.