Inkjet Printing for Solder Mask on PCB

27. FED-Konferenz | Freitag, 27.09.19, 12:30 Uhr | Funktion trifft Elektronik | Raum: Scharoun

Inkjet printing is a technology capable of precisely depositing small droplets of functional liquid materials onto a substrate. The unique benefits of inkjet are numerous and compelling. It is additive, digital, non-contact, fast, material-saving, precise and cost-effective. Because of these pronounced properties, inkjet printing is a great technique for directly applying highly accurate patterned layers on substrates, hence enables innovative possibilities for depositing solder mask on PCB. Recent revolutionary advances have been made in this area, so the industry can now take advantage of all the benefits inkjet is offering. Moreover, PCB makers are under severe pressure to reduce their environmental impact, e.g. by reducing chemical waste and using less material and energy. Inkjet has enabled innovative layer deposition across a PCB, allowing adaptable and improved coverage at copper edges, higher breakdown voltages and scratch resistance. Additional materials savings can be achieved by selective deposition of solder mask, applying more material where needed on the copper, and less material on the PCB substrate. The presentation explains and shows real product data of innovative solder mask application on PCB, by using advanced printing strategies, and state of the art printheads, equipment and ink.

Joost Valeton is product manager of the PiXDRO inkjet printing product line, with a special focus on application of inkjet technology for fabrication of PCBs. Joost joined Meyer Burger in 2013 as a senior process development engineer. During this time his focus was on implementation of inkjet printing for the manufacture of IC packaging and displays. Joost holds a M.Sc. degree in polymer chemistry from the University of Groningen, The Netherlands.