FED-Shop

Connected Factory Exchange (CFX)

Englisch. Stand: Januar 2021, 64 Seiten

The IPC-2591v1.3 standard establishes the requirements for the omni-directional exchange of information between manufacturing processes and associated host systems for assembly manufacturing. This standard applies to communication between all executable processes in the manufacture of printed board assemblies, automated, semi-automated and manual, and is applicable to related mechanical assembly and transactional processes. IPC-2591, Version 1.3 provides updates to several IPC-CFX messages as well as mandatory and optional IPC-CFX message by equipment type.

Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boards

Englisch. 11 pages. Stand: August 1998

Determines the nomenclature, chemical and physical requirements of paper made from cellulose fibers for PWB fabrication. IPC-4110 also includes specification sheets for selecting and purchasing these materials. 11 pages.

Specification & Characterization Methods for Nonwoven 'E' Glass Mat

Englisch. 14 pages. Stand: September 1998

Determines the nomenclature, definitions and requirements for materials made from nonwoven 'E' glass fibers. IPC-4130 also includes specification sheets for selecting and purchasing these materials. 14 pages.

Metal Foil for Printed Board Applications

Englisch. Stand: Mai 2008; 27 Seiten

This specification covers metal foils supported by carrier films and unsupported foils suitable for subsequent use in only printed boards and addresses the requirements for procurement of these same metal foils. Unless otherwise agreed upon between u ser and supplier (AABUS), metal foils shall be considered acceptable as long as the requirements in this specification are met.

Included in the IPC-C-102, IPC-C-105, IPC-C-107 and the IPC-C-1000 Collections.

Generic Performance Specification for Printed Boards

Englisch. 15 pages. Stand: Juli 1996

This specification establishes the general requirements and responsibilities for suppliers and users of printed boards. Serving as the foundation for the IPC-6010 Board Performance Documents series, it describes quality and reliability assurance requ irements that must be met. For use with IPC-6012 through IPC-6018. Supersedes IPC-RB-276, IPC-SC-320, IPC-TC-500, IPC-ML-950C.

Space and Military Avionics Applications Addendum to IPC-6012E, Qualification and Performance Specification for Rigid Printed Boards

English. 20 pages. Released 2020.

The IPC-6012FS space addendum provides exceptions to IPC Performance Class 3 requirements of the IPC-6012F for use in space and military avionics product. Exceptions include changes to acceptance criteria and/or sample size and test frequency for production lot acceptance testing. The IPC-6012FS covers requirements for rigid printed boards to survive vibration, extreme thermal cycling and ground testing associated with space travel environment. Supersedes IPC-6012ES.

Qualification & Performance Specification for Organic Multichip Module Mounting

Englisch. 78 pages. Stand: Februar 1998.

This specification establishes the specific requirements for organic mounting structures used to interconnect chip components, which in combination form the completed functional organic single-chip module (SCM-L) or organic multichip module (MCM-L) a ssembly and the quality and reliability assurance requirements that must be met for their acquisition. For use with IPC-6011. 78 pages. Released February 1998. Supersedes IPC-RF-245, IPC-FC-250A.

Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards

Englisch. 55 pages. Stand: Mai 1999

This document establishes the specific electrical, mechanical and environmental requirements for organic HDI layers with microvia technology. The acceptance criteria of the HDI layers are organized into specification sheets that reflect typical end-u se applications, such as cellular phones, avionics, automotive and personal computers. Key concepts include: HDI conductive surface requirements, microvia integrity, HDI electrical properties and end use application slash sheets. For use with IPC-601 1. 55 pages.

Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)

Englisch. Stand: Januar 2019, 208 Seiten

IPC-7095D-AM1 describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair and reliability issues associated with design and assembly of printed boards using these packages. IPC-7095D-AM1 provides useful and practical information to those who use or are considering using BGAs. It also provides describes how to successfully implement robust design and assembly processes for printed board assemblies using BGAs as well as ways to troubleshoot some common anomalies which can occur during BGA assembly.

PWB Assembly Process Simulation for Evaluation of Electronic Components

Englisch. 25 pages. Stand: Juli 1999

Will the components work with your process? That determination is the goal of these manufacturing process simulations; to ensure that components chosen meet expected reliability requirements after exposure to factory processes. This document specific ally addresses preconditioning of components. Developed for users and manufacturers, the procedure consists of a set of simulations for IC component storage and use, wave and reflow soldering (SMT and PTH parts), exposure to corrosive (water soluble) fluxes and exposure to often-used cleaning materials. 25 pages.

Ergänzung Elektronik-Hardware für Raumfahrt- und Militäranwendungen zu IPC J-STD-001G DE Anforderungen an gelötete elektrische und elektronische Baugruppen

Deutsch. ca. 12 Seiten. Farbig. Stand: Juni 2020.

Die Ergänzung IPC J-STD-001GS AM 1-DE für Raumfahrt-Anwendungen ergänzt oder ersetzt spezifisch identifizierte Anforderungen von IPC J-STD-001G-DE für die Reinigungsanforderungen gelöteter elektrischer und elektronischer Baugruppen, die Schwingungen und die Umgebungsbedingungen thermischer Zyklen von Raumfahrt und militärischen Anwendungen überstehen müssen.

Enthält Anforderungen für Lötmaterialien und -prozesse für elektronische Baugruppen

Deutsch. ca. 8 Seiten. Farbig. Stand: 2017, Übersetzt im Juni 2018.

IPC J-STD-001D-Am 1 ist die erste größere Revision der Reinheitsnorm J-STD-001 seit mehr als 25 Jahren. Sie ändert die Herangehensweise der Branche an Reinheits- und Flussmittelrückstandsanforderungen. Die wichtigste Änderung dieser neuen Version sind die Anforderungen zu zulässigen Mengen von Flussmittel- und sonstigen Rückständen bei Löt- und Reinigungsprozessen für Hersteller von Produkten der Klassen 2 und 3 (sofern vom Anwender nichts anderes festgelegt wird), wobei die „... Verwendung des Werts 1,56 µg/NaCl-Äquivalenz/cm2 für den ROSE-Test (Resistivity of Solvent Extract, ionische Kontaminationsprüfung) ohne zusätzliche bekräftigende objektive Nachweise [...] nicht als zulässige Grundlage für die Qualifikation eines Fertigungsprozesses“ gilt. Zu diesem Produkt gehört außerdem die IPC-WP-019A, ein Überblick über globale Veränderungen bei den Anforderungen an ionische Reinheit. Dieses Whitepaper, das von einem Team der Aufgabengruppe 5-22A, die an der Norm J-STD-001G Am 1 arbeitet, verfasst wurde, erläutert die Hintergründe der Änderungen und stellt dem Leser einen Kontext bereit, in dem die neuen Anforderungen betrachtet werden sollten.

Performance Standard for Ball Grid Array Balls

Englisch. 10 pages. Stand: Juni 2002

This standard, developed jointly by IPC and the Electronic Industries Association (EIA) establishes the construction detail requirements for balls and other terminal structures on Ball Grid Array (BGA) packages. It also establishes a set of designati ons and expectations for product performance. A large variety of terminal structures are recognized for a wide range of applications ranging from highest reliability computer, space and military applications to disposable commodity applications.

Flexible Base Dielectrics for Use in Flexible Printed Boards

Englisch. 40 Seiten. Stand März 2017.

This document provides comprehensive data to help users more easily determine both material capability and compatibility for flexible base dielectric materials for manufacture of flexible printed boards. It includes flexible base material specification sheets that have been updated with the newest properties for the specification material types. It establishes the most current classification system, qualification and quality conformance requirements, including high frequency dielectric properties. A new specification sheet for an adhesive fluorocarbon film has been added as it became available to the marketplace. 23 pages. Released March 2017.

Design Guide for RF/Microwave Circuit Boards

Englisch. 30 pages. Stand: Juni 2002

This design guideline provides RF and microwave circuit design engineers, printed circuit board engineers, packaging engineers and drafters with the information necessary to design practical, functional and cost effective microwave circuit boards in the frequency range of 100 MHz to 30 GHz. This guide also applies to operations in the region where distributed circuits are used instead of conventional lumped circuit elements. 30 pages.

Optoelectronic Assembly and Packaging Technology

Die völlig neue Richtlinie vom Mai 2003 umfasst 163 Seiten A4 und beschreibt die Einführung optischer und optoelektronischer Packaging-Technologien. Behandelte Problemkreise: Technologieauswahl, Designüberlegungen, Materialeigenschaften, Bauelementem ontage, Verbindungsstrukturen, Montageprozess, Test, Anwendung, Nacharbeit, Reparatur, Zuverlässigkeit der eingefügten optoelektronischen Bauelemente. Die optoelektronischen Packaging-Technologien berücksichtigen aktive und passive Bauelemente, diskr ete Glasfaserkabel und deren Kennwerte sowie Besonderheiten ihrer Montage als Teil von Modulen bzw. Submodulen, Leiterplatten.

Users Guide for Cleanliness of Unpopulated Printed Boards

Englisch. 6 pages. Stand: Juli 2003

Rückstände auf der Leiterplatten wirken sich negativ auf die zuverlässige Funktion der Baugruppe aus und können zu ernsthaften Fehlern führen. Wie jedoch diese Rückstände messen? Wie sauber ist 'rein'? IPC-5701 befasst sich mit diesem Thema, wie es g elöst und wie es in den Einkaufsspezifikationen definiert wird. Die Richtlinie gibt Vorschläge zur Festlegung von Reinheitsklassen, zu den notwendigen Messungen und zu den Prüfmustern. Umfang: 6 Seiten A4 (in Englisch)

IPC-4552A: Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards

Englisch. 148 Seiten. Stand: 2017

The IPC-4552A performance specification sets requirements for Electroless Nickel/Immersion Gold (ENIG) deposit thicknesses for applications including soldering, wire bonding and as a contact finish. The IPC-4552A is intended for use by chemical suppliers, printed board manufacturers, electronics manufacturing services (EMS) and original equipment manufacturers (OEM). The IPC-4552A standard may be used to specify acceptance criteria to meet performance requirements in addition to those found in the IPC-6010-FAM Printed Board Performance Specifications. The ENIG deposit specified by using this document will meet the highest coating durability rating as specified in the J-STD-003 printed board solderability specification.
The IPC-4552A specification is based on three critical factors:
1. The ENIG plating process is in control producing a normal distribution for nickel and gold deposit thickness.
2. That the tool used to measure the deposit and therefore control the process is accurate and reproducible for the thickness range specified.
3. That the ENIG plating process results in uniform deposit characteristics.
If any of these three critical factors are not met, then the deposit produced will not meet the performance criteria defined

An In-Depth Look At Ionic Cleanliness Testing

Englisch. 229 pages. Stand: Juli 2002

This original research was a cooperative effort between the EMPF and IPC, released as EMPF-RR-0013 in 1993 for better understanding of ionic cleanliness testing. The IPC Ionic Conductivity/Ion Chromatography Test Task Group has validated its continue d importance and relevance to the cleaning community and IPC-TR-583 is the result. It includes how solvent temperature influences the final cleanliness results, criticality of a 75% isopropyl to 25% water ratio, value of spraying the solvent, etc. Th e report provides quantified results to help users determine what variables most influence ionic cleanliness test results. 229 Pages.