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Automotive Addendum to IPC J-STD-001G Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610G Acceptability of Electronic Assemblies

Englisch. 137 pages. Released: 2/2/2020

The IPC J-STD-001GA/IPC-A-610GA automotive addendum to J-STD-001G and IPC-A-610G provides criteria to ensure the reliability of mission-critical soldered automotive electrical and electronic assemblies in the field under harsh environments and considers the conditions of automated high-volume production. The IPC J-STD-001GA/IPC-A-610GA addendum is not a standalone document. The addendum requires it be used in conjunction with J-STD-001G and IPC-A-610G as they are used to look at the whole of the electronics assembly manufacturing process from assembly to inspection to address board reliability requirements for the automotive industry.

Through-Hole Solder Joint Evaluation Training & Reference Guide

Englisch. Stand: 2018, Hardcopy

Now updated to Revision G of the latest IPC-A-610 industry standard for the Acceptability of Electronic Assemblies, this Training & Reference Guide illustrates critical acceptance criteria for the evaluation of through-hole solder connections.
With only 30 pages and a compact 5.5 x 8.5 inch (14 x 21.5 cm) size, these convenient spiral-bound manuals make it easy for your inspectors and operators to make the right solder joint acceptance decisions for all three classes of product.
Useful as a training aid in the classroom, or on the shop floor, DRM-PTH contains computer generated color illustrations of component, barrel and solder-side perspectives of a plated-through-hole. Each drawing clearly shows the minimum acceptable condition for requirements such as land coverage, vertical fill, wetting of lead, land and barrel and contact angle.
DRM-PTH-G also contains high quality color microphotographs of the major solder defects and conditions such as nonwetting, corrosion, projections, fractures, lead protrusion and disturbed joints with pictures of both tin-lead and lead free solder joints. The appropriate specification/paragraph references from the IPC-A-610G (A610G) are included for each of the acceptance criteria for further verification.

Specification for Finished Fabric Woven from 'S' Glass for Printed Boards

Englisch. 12 pages. Stand: Februar 1992

Covers the classification and requirements for finished fabrics woven from 'S' glass, electrical grade glass fiber yarns intended as a reinforcing material in laminated plastics for electrical and electronic use. 12 pages.

Composite Metallic Materials Specification for Printed Wiring Boards

Englisch. 39 pages. Stand: März 1998

Covers the requirements for copper/invar/copper (CIC), copper/molybdenum/ copper (CMC) and three-layer composites for use in electronic applications. IPC-CF-152B includes specification sheets, which outline engineering and performance data for each t ype of composite metallic materials. 39 pages.

Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Printed Boards

Englisch. 28 pages. Stand: 2014

This document provides the designer/user with guideline information related to the use of pressure sensitive adhesives (PSAs) for fabrication and assembly of flexible, rigid or rigid-flex printed boards, membrane switches and component attachments. It also provides information on adhesive types available, their inherent strengths, also provides information on adhesive types available, their inherent strengths, weaknesses, limitations and correct processes needed for creating proper assemblies and bare printed boards.

Process Controls for Phototool Generation and Use

Englisch. 6 pages. Stand: März 1996

Covers the information and data to be collected during the generation and use of phototools to improve artwork quality, thereby improving yields downstream. It also helps establish and maintain ISO 9000 certification and SPC by facilitating troublesh ooting, standardizing the process for both experienced and inexperienced operators and by identifying process improvements for the ultimate elimination of inspection and touchup of artwork. 6 pages.

Guidelines for Selecting Printed Wiring Board Sizes Using Standard Panel Sizes

Englisch. 4 pages. Stand: September 1991

Defines guidelines for choosing sizes of printed wiring boards using standard fabrication panel sizes. 4 pages.

Solderability Evaluation of Printed Boards with Protective Coatings Over Long-Term Storage

Englisch. 63 pages. Stand: Oktober 1987

This document provides conclusions and recommendations for the effectiveness of different protective coatings and coating application methods. PWB solderability in typical storage conditions after various time periods as well as the correlation of ti me and storage conditions to thickness and coating characteristics are addressed. 63 pages.

Accelerated Aging for Solderability Evaluations

Englisch. 32 pages. Stand: Dezember 1987

The report was developed to meet the growing need for a standard method of evaluating the solderability retention capability of printed boards during inventory storage. 32 pages.

Electrochemical Migration: Electrically Induced Failures in Printed Wiring Assemblies

Englisch. 14 pages. Stand: 1997

This technical report provides information on an IPC program designed to identify/evaluate electromigration on PWBs. The theory of electrochemical migration and the test procedures needed to assess the susceptibility are discussed. The results of a l iterature review survey are included. 14 pages.

Dimensional Stability Testing of Thin Laminates-Report on Phase 1 & 2 International Round Robin Test Programs

Englisch. 74 pages. Stand: März 1991

The purpose of Phase I was to define a test procedure to evaluate thin laminate material. The purpose of the Phase II testing was to expand that project by adding a thermal stress cycle to the existing IPC Test Method 2.4.39. This test report offers the results of this testing. 74 pages.

Drilling Guidelines for Printed Boards

Englisch. Stand: März 2007, 12 Seiten

IPC-DR-572A: Leitfaden für das Bohren von Leiterplatten

Die neue Ausgabe von IPC-DR-572A 'Drilling Guidelines for Printed Boards' vom März 2007 gibt Hinweise für die Realisierung hochqualitativer Bohrungen in unterschiedlichen Materialien. Der Lei tfaden berührt u.a. folgende Punkte: Bohrer, zu bohrende Materialpakete, Bohrmaschinen, Bohrvorgang, Bohrlochqualität, Lochprobleme.

Certification of Facilities that Inspect/Test Printed Boards, Components & Materials

Englisch. 15 pages. Stand: November 1997

This specification establishes the certification requirements for facilities that inspect/test printed boards, components and materials. This specification is intended to provide a minimum standardized basis for evaluating or auditing a technically o riented inspection/testing facility. 15 pages.

Component Packaging and Interconnecting with Emphasis on Surface Mounting

Englisch. 138 pages. Stand: März 1988

This document examines key issues in advanced packaging techniques. Provides information on what types of parts are available, the techniques and processes necessary for their proper use, possible advantages/disadvantages or problems, how to start im plementation and where to find additional information. 138 pages.

Guidelines for High Volume Microsection

Englisch. 31 pages. Stand: Oktober 1993

Discusses the many variables and problems associated with the process--from sample removal to micro-etch-- and the variables common to high volume microsection. The process variables and problems are organized so that the reader can research a specif ic issue or overview the variables of a process area. 31 pages.

Design Standard for Thick Film Multilayer Hybrid Circuits

Englisch. 80 pages. Stand: Dezember 1989

This standard covers the requirements and considerations for the design of multilayer hybrid circuits based on industry manufacturing capabilities. 80 pages.

Qualification and Performance of Polymer Thick Film Printed Boards

Englisch. 59 pages. Stand: November 1989

Covers the materials, qualification, certification and performance requirements for multilayer polymer thick film (PTF) printed, extrusion deposited, or otherwise applied conductor, insulator and through-hole technology. This specification may also b e used for procurement of single and double-sided boards. 59 pages.

Qualification and Performance Specification for Mass Lamination Panels for Multilayer Printed Boards

Englisch.21 pages. Stand: Juli 1994

This specification covers qualification and performance requirements of rigid mass laminated panels for use in multilayer printed boards. Testing procedures and criteria are addressed. 21 pages.

Trusted Electronic Designer, Fabricator and Assembler Requirements

Englisch, 30 Seiten Stand: August 2021

IPC-1791B standard provides minimum requirements, policies and procedures for printed board design, fabrication, and assembly organizations and/or companies to become trusted sources for markets requiring high levels of confidence in the integrity of delivered products. PC-1791B expands the standard’s requirements to account for trusted sources of cable and wire harness assemblies.