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IPC-2223F-ENG (Hardcopy)
IPC-2223 - Revision F - Standard Only: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards
Englisch. Stand: 2026 , 58 Seiten
Used in conjunction with the base IPC-2221 printed board design standard, IPC-2223 establishes the specific requirements for the design of flexible printed boards and forms of component mounting and interconnecting structures. The flexible materials used in the structures are comprised of insulating films, reinforced and/or non-reinforced dielectric in combination with metallic materials. Revision F provides new design guidance and requirements for mechanical and physical layout, usage of nonfunctional lands, coverlay access for surface mounting, conductor routing and tradeoffs between panel, pattern and button (pads only) plating for surface and hole copper plating.
IPC-A-610G-RL (PDF) Single User
Acceptability of Electronic Assemblies-Redlin
Englisch. 898 Seiten. Released: 31.10.2017, Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
This is a redline document showing the changes from IPC-A-610F with Amendment 1 to IPC-A-610G. This document provides a side-by-side comparison of the two documents and includes the figures and tables. The document shows the deleted/changed text in the IPC-A610F with Amendment 1 pages and the new/revised text in purple highlights in the IPC-A610G pages. Yellow pop-up boxes are also present in the IPC-A-610G pages to further explain the changes.
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IPC-6013E (Hardcopy)
Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
Englisch. 84 pages. Released 2021
IPC-6013E standard covers qualification and performance requirements for flexible printed boards designed to IPC-2221 and IPC-2223. The flexible printed board may be single-sided, double-sided, multilayer or rigid-flex multilayer. All of these constructions may include stiffeners, PTHs, microvias, and blind/buried vias. The IPC-6013E standard incorporates new and updated requirements for final finishes, rigid-to-flex transition zones, foreign inclusions, surface mount land anomalies, plated internal layers, dielectric removal as a function of wicking and etchback, copper filled via structures microvia structures.
IPC-A-600M-DE (Papierversion)
IPC-A-600 - Revision M - Standard Only: Abnahmekriterien für Leiterplatten
Deutsch. Seiten: 214. Erscheinungsdatum: Mai 2026
Der maßgebliche illustrierte Leitfaden zur Leiterplattenqualität! Dieses vierfarbige Dokument enthält Fotos und Illustrationen der Soll-, Soll- und Nichtkonformitätszustände, die sowohl intern als auch extern an unbestückten Leiterplatten erkennbar ind. Stellen Sie sicher, dass Ihre Bediener, Prüfer und Ingenieure über die aktuellsten Branchenstandards verfügen. Mit Dutzenden neuer oder überarbeiteter Fotos und Illustrationen bietet die Revision M eine erweiterte und detailliertere Abdeckung von Themen wie Leiterplattenrandplatinierung, Leiterplattenhohlräume, Kantengrate, Benetzungsstörungen, Leiterbahndicke, Registergenauigkeit, interne Kupferpenetration und Plattierungsfehler. Das Dokument entspricht den Akzeptanzanforderungen gemäß IPC-6012F und IPC-6013E. Ersetzt IPC-A-600K.
IPC-600M-DE (PDF) Single User
IPC-A-600 - Revision M - Standard Only: Abnahmekriterien für Leiterplatten
Deutsch. Seiten: 214. Erscheinungsdatum: Mai 2026Deutsch. Seiten: 214. Erscheinungsdatum: Mai 2026
Der maßgebliche illustrierte Leitfaden zur Leiterplattenqualität! Dieses vierfarbige Dokument enthält Fotos und Illustrationen der Soll-, Soll- und Nichtkonformitätszustände, die sowohl intern als auch extern an unbestückten Leiterplatten erkennbar sind. Stellen Sie sicher, dass Ihre Bediener, Prüfer und Ingenieure über die aktuellsten Branchenstandards verfügen. Mit Dutzenden neuer oder überarbeiteter Fotos und Illustrationen bietet die Revision M eine erweiterte und detailliertere Abdeckung von Themen wie Leiterplattenrandplatinierung, Leiterplattenhohlräume, Kantengrate, Benetzungsstörungen, Leiterbahndicke, Registergenauigkeit, interne Kupferpenetration und Plattierungsfehler. Das Dokument entspricht den Akzeptanzanforderungen gemäß IPC-6012F und IPC-6013E. Ersetzt IPC-A-600K.
IPC-HDBK-9798A (Hardcopy)
IPC-HDBK-9798 - Revision A - Handbook
Englisch. Stand: Januar 2026, 52 Seiten
IPC-HDBK-9798A provides guidelines and information for manufacturing electronic assemblies using compliant press-fit technology. The intent is to explain the ‘‘how-to’’ and ‘‘why’’ information of press fit, and fundamentals for these processes. IPC-HDBK-9798A handbook is a supporting document to the IPC-9797A standard.
IPC-J-STD-001JA/A-610JA-EN (Hardcopy)
IPC-J-STD-001 and IPC-A-610 - Revision J - Addendum - Automotive: Automotive Addendum to IPC J‑STD‑001J Requirements for Soldered Electrical and Electronic Assemblies and IPC‑A‑610J Acceptability of Electronic Assemblies
English. 140 pages. Published Date: October 2025.
IPC J-STD-001JA/IPC-A-610JA is the automotive addendum to J-STD-001J and IPC-A-610J. It provides criteria to ensure the reliability of soldered automotive electrical and electronic assemblies in the field under harsh environments and considers automated high-volume production. IPC J-STD-001JA/IPC-A-610JA addendum is not a standalone document, and it must be used in conjunction with J-STD-001J and IPC-A-610J.
IPC-7093B (Hardcopy) - EN
IPC-7093 - Revision B - Standard Only: Design and Assembly Process Guidance for Bottom Termination Components (BTCs)
Englisch, 138 Seiten, Januar 2026
The IPC-7093B guideline provides essential design and assembly guidance for implementing bottom termination components (BTCs). Specifically, IPC-7093B provides guidelines on critical design, materials, assembly, inspection, repair, quality, and reliability issues associated with BTCs.
IPC-4556A (Hardcopy) - EN
IPC-4556 - Revision A - Standard Only: Specification for Electroless Nickel/Electroless Palladium Immersion Gold (ENEPIG) Plating for Printed Boards
Englisch, Stand: 2025, 49 Seiten
IPC-4556A Standard sets the requirements for the use of Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) as a surface finish for printed boards. IPC-4556A standard defines ENEPIG deposit thicknesses for applications including soldering, wire bonding, and as a contact finish.
IPC-A-600M (Hardcopy)
IPC-A-600 - Revision M - Standard Only: Acceptability of Printed Boards
Englisch. Pages: 212. Publishes Date: May 2025
IPC-A-600M is the definitive illustrated guide to printed board acceptability! This four-color document provides photographs and illustrations of the target, acceptable and nonconforming conditions that are either internally or externally observable on bare printed boards. Make sure your operators, inspectors, and engineers have the most current industry consensus information. With dozens of new or revised photographs and illustrations, IPC-A-600M provides new and expanded coverage on topics such as printed board edge plating, printed board cavities, edge burrs, dewetting, conductor thickness, annular ring (registration) internal copper penetration and plating voids. The document synchronizes to the acceptability requirements expressed in IPC-6012F and IPC-6013E. Supersedes IPC-A-600K.
IPC-9271
IPC-9271 - Standard Only: Guidelines for In System Programming
Englisch. 24 pages. Stand: Mai 2025
The IPC-9271 standard provides guidelines for device-level In-System Programming (ISP) as part of electronics assembly process. The standard addresses PCB design for ISP, fundamental characteristics when selecting an ISP programmer and the integration of the programmer in the production environment, including: fixtures, software, mechanical and process integration methodologies to increase efficiency which reduces programming costs and improves productivity and quality in the production environment.
IPC/WHMA-A-620F-Hardcopy
IPC/WHMA-A-620 - Revision F - Standard Only: Requirements and Acceptance for Cable and Wire Harness Assemblies
English. 326 Pages. Published Date: 10/01/2025
PC/WHMA-A-620 is the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies. IPC/WHMA-A-620F describes materials, methods, tests and acceptance criteria for producing crimped, mechanically secured and soldered interconnections and the related assembly activities associated with cable and harness assemblies.
IPC/WHMA-A-620F (PDF) Single User
IPC/WHMA-A-620 - Revision F - Standard Only: Requirements and Acceptance for Cable and Wire Harness Assemblies
English. 326 Pages. Published Date: 10/01/2025
IPC/WHMA-A-620 is the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies. IPC/WHMA-A-620F describes materials, methods, tests and acceptance criteria for producing crimped, mechanically secured and soldered interconnections and the related assembly activities associated with cable and harness assemblies.
IPC-7711/21D-DE-(PDF) Single User
IPC-7711/21 - Revision D - Standard Only: Nacharbeit, Änderung und Reparatur Elektronischer Baugruppen
Deutsch. Stand: 02/2024. Seiten: 286
Der Leitfaden IPC-7711/21 enthält Verfahren für die Nacharbeit, Reparatur und Änderung von Leiterplatten-Baugruppen, einschließlich Werkzeugen und Materialien, häufig angewendete Verfahren, Entfernung der Beschichtung und Grafiken zur Unterstützung des Benutzers.
IPC-J-STD-001JS (PDF) Single User
IPC-J-STD-001 - Revision J - Addendum - Space and Military: Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001J Requirements for Soldered Electrical and Electronic Assemblies
Englisch. 28 pages. Released: January 2025. Keine Druckberechtigung, DRM-Schutz, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
IPC J-STD-001JS Space and Military Addendum supplements or replaces specifically identified requirements of IPC J-STD-001J requirements for soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments of getting to and operating in space and military applications.
J-STD-001JS (Hardcopy)
IPC-J-STD-001 - Revision J - Addendum - Space and Military: Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001J Requirements for Soldered Electrical and Electronic Assemblies
English. 28 pages. Released: 01.01.2025.
IPC J-STD-001JS Space and Military Addendum supplements or replaces specifically identified requirements of IPC J-STD-001J requirements for soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments of getting to and operating in space and military applications.
IPC-7352 (PDF) Single User
IPC-7352 - Standard Only: Generic Guideline for Land Pattern Design
Englisch. 56 pages. Released May 2023. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
IPC-7352 Generic Guideline for Land Pattern Design provides generic guidelines on land pattern geometries used for the attachment of electronic components to a printed board, as well as design recommendations for achieving the best possible solder joints to the devices assembled. IPC-7352 is an essential tool for helping printed board designers to achieve these optimal results.
IPC-4203C (PDF) Single User
IPC-4203 - Revision C - Standard Only: Cover and Bonding Material for Flexible Printed Circuitry
Englisch. 52 Seiten. Stand: Januar 2025. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
This standard establishes the classification system, the qualification and quality conformance requirements for dielectric films coated with an adhesive on one or both sides, which are to be used as cover material and/or bondply for flexible printed circuitry, and supported or unsupported adhesive films to be used in the fabrication of flexible printed circuitry.
IPC-DRM-SMT-G (Hardcopy)
Surface Mount Solder Joint Evaluation Training & Reference Guide
Englisch. Stand: Januar 2018 (Hardcopy)
Updated to Revision G of the latest IPC-A-610 industry standard for the Acceptability of Electronic Assemblies, this Training & Reference Guide illustrates critical acceptance criteria for the evaluation of surface mount solder connections.
At only 44 pages and a compact 5.5 x 8.5 inch (14 x 21.5 cm) size, these convenient spiral-bound manuals make it easy for your inspectors and operators to make the right solder joint acceptance decisions for all three classes of product. Useful as a training aid in the classroom or on the shop floor, DRM-SMT contains computer generated color illustrations of Chip component, Gull Wing, J Lead, BTC and Area Array solder joints. Each drawing clearly shows the minimum acceptable condition for each type of component misalignment; and details all of the specifications for minimum/maximum solder joint size, including fillet heights and lengths.
DRM-SMT-G also contains high quality color microphotographs of the major solder defects and conditions such as nonwetting, solder bridging and disturbed joints, including samples of both tin-lead and lead-free solder connections. The appropriate specification/paragraph references from the IPC-A-610G (A610G) are included for each of the acceptance criteria for further verification.
J-STD-001GS-AM1 (Hardcopy)
Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001G. Requirements for Soldered Electrical and Electronic Assemblies
Englisch. 16 pages. Released: March 2020.
The IPC J-STD-001GS AM 1 amendment to the IPC J-STD-001GS space addendum supplements or replaces specifically identified requirements of IPC J-STD-001G for the cleaning requirements for soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments of getting to and operating in space and military applications.