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FED-Bibliothek Bd17

FED Bibliothek des Wissens Band 17 - Abschlussbericht zum Projekt: Designregeln für den Übergang "Starr-Flexbereich"

1.Auflage 2017, DIN A5, 25 Seiten, Farbabb.

FED-Bibliothek Bundle

FED Bibliothek des Wissens
Band 1 - 17

Aktuelle Auflagen, DIN A5, Farbabb.

IPC-A-610G

IPC-A-610G: Acceptability of Electronic Assemblies
Englisch. 440 Seiten. Released: 31.10.2017

J-STD-001G

J-STD-001G: Requirements for Soldered Electrical and Electronic Assemblies
Englisch. 92 Seiten. Released: 31.10.2017.

Baugruppenproduktion Schulungsfilm

FED-Schulungsfilm - Baugruppenproduktion -
Als DVD oder BluRay

Laufzeit: ca. 25 Min., Ton: Stereo HiFi, Bildformat:16:9

Als RSS-Feed abonnieren.


Schrift

IPC-4556 (Hardcopy)

Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards

Englisch, Stand: Januar 2013, 82 Seiten
Mitglieder 148.00 USD Nicht-Mitglieder 178.00 USD

Beschreibung IPC-4556 (Hardcopy)

This specification sets the requirements for the use of electroless nickel/electroless palladium/immersion gold (ENEPIG) as a surface finish for printed boards. It establishes requirements for ENEPIG deposit thicknesses for applications including soldering, wire bonding and as a contact finish. It is intended for use by chemical suppliers, printed board manufacturers, electronics manufacturing services (EMS) providers and original equipment manufacturers (OEMs). ENEPIG is a tertiary layered surface finish plated over copper as the basis metal. ENEPIG is a multifunctional surface finish, applicable to soldering and to gold, aluminum and copper wire bonding. It is also suitable as the mating surface for soft membrane and steel dome contacts. Additional applications include use in low insertion force (LIF) and zero insertion force (ZIF) edge connectors and for press-fit applications. The electroless palladium layer forms a diffusion barrier that impedes nickel diffusion to the gold surface and, in turn, the immersion gold protects the palladium layer from reacting with contaminants prior to processing that might otherwise affect joining processes, such as wire bonding and soldering.

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Reuss

Christopher Reuss
Tel. +49 30 340 6030-57
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Baar

Dietmar Baar
Tel. +49 30 340 6030-54
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