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FED-Bibliothek Bd17

FED Bibliothek des Wissens Band 17 - Abschlussbericht zum Projekt: Designregeln für den Übergang "Starr-Flexbereich"

1.Auflage 2017, DIN A5, 25 Seiten, Farbabb.

FED-Bibliothek Bundle

FED Bibliothek des Wissens
Band 1 - 17

Aktuelle Auflagen, DIN A5, Farbabb.


IPC-A-610G: Acceptability of Electronic Assemblies
Englisch. 440 Seiten. Released: 31.10.2017


J-STD-001G: Requirements for Soldered Electrical and Electronic Assemblies
Englisch. 92 Seiten. Released: 31.10.2017.

Baugruppenproduktion Schulungsfilm

FED-Schulungsfilm - Baugruppenproduktion -
Als DVD oder BluRay

Laufzeit: ca. 25 Min., Ton: Stereo HiFi, Bildformat:16:9

Als RSS-Feed abonnieren.


IPC-4554 (PDF)

Specification for Immersion Tin Plating for Printed Circuit Boards

Englisch. 57 pages. Stand: Januar 2012. includes Amendment 1. Keine Druckberechtigung
Mitglieder 160.00 USD Nicht-Mitglieder 192.00 USD

Beschreibung IPC-4554 (PDF)

IPC-4554, 'Specification for Immersion Tin Plating for Printed Circuit Boards,' is the third document in a series of specifications [the first two are: IPC-4552 which addresses electroless nickel/immersion gold (ENIG) and IPC-4553 which addresses imm ersion silver (IAg)] that set the requirements for printed circuit board surface finishes that are alternates to eutectic tin-lead.

IPC-4554, a full color document, is intended for use by supplier, manufacturer, contract manufacturer (CM) and ori ginal equipment manufacturer (OEM). The immersion tin (ISn) is a metallic finish deposited by a chemical displacement reaction that is applied directly over the basis metal of the PCB, that is, copper. ISn is primarily used as a solderable surface. I t has been used in press fit connections and as the interface for Zero Insertion Force (ZIF) edge connectors. The ISn protects the underlying copper from oxidation over its intended shelf life.

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