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FED-Bibliothek Bd17

FED Bibliothek des Wissens Band 17 - Abschlussbericht zum Projekt: Designregeln für den Übergang "Starr-Flexbereich"

1.Auflage 2017, DIN A5, 25 Seiten, Farbabb.

FED-Bibliothek Bundle

FED Bibliothek des Wissens
Band 1 - 17

Aktuelle Auflagen, DIN A5, Farbabb.

IPC-A-610G

IPC-A-610G: Acceptability of Electronic Assemblies
Englisch. 440 Seiten. Released: 31.10.2017

J-STD-001G

J-STD-001G: Requirements for Soldered Electrical and Electronic Assemblies
Englisch. 92 Seiten. Released: 31.10.2017.

Baugruppenproduktion Schulungsfilm

FED-Schulungsfilm - Baugruppenproduktion -
Als DVD oder BluRay

Laufzeit: ca. 25 Min., Ton: Stereo HiFi, Bildformat:16:9

Als RSS-Feed abonnieren.


CD

HDBK-850 (CD-ROM)

Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly

Englisch. 68 pages. Stand: July 2012. Keine Druckberechtigung. Single User Licence
Mitglieder 160.00 USD Nicht-Mitglieder 192.00 USD

Beschreibung HDBK-850 (CD-ROM)

This handbook has been written to assist the designers and users of potting and encapsulation in understanding the characteristics of various materials, as well as the factors that can modify those characteristics when the potting or encapsulation is applied. The equipment and processes involved in the preparation and application of potting and encapsulation are also covered. The challenge in developing this handbook is that there has been no clear industry definition that distinguished between potting and encapsulation. From glob-top to dam-and-fill, this document uses terminology associated with processes related only to electronic printed circuit board assembly and protection. Understanding and accounting for these materials can ensure the reliability and function of electronics.

Ihre Ansprechpartner

Reuss

Christopher Reuss
Tel. +49 30 340 6030-57
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Baar

Dietmar Baar
Tel. +49 30 340 6030-54
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