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FED-Bibliothek Bd17

FED Bibliothek des Wissens Band 17 - Abschlussbericht zum Projekt: Designregeln für den Übergang "Starr-Flexbereich"

1.Auflage 2017, DIN A5, 25 Seiten, Farbabb.

FED-Bibliothek Bundle

FED Bibliothek des Wissens
Band 1 - 17

Aktuelle Auflagen, DIN A5, Farbabb.

IPC-A-610G

IPC-A-610G: Acceptability of Electronic Assemblies
Englisch. 440 Seiten. Released: 31.10.2017

J-STD-001G

J-STD-001G: Requirements for Soldered Electrical and Electronic Assemblies
Englisch. 92 Seiten. Released: 31.10.2017.

Baugruppenproduktion Schulungsfilm

FED-Schulungsfilm - Baugruppenproduktion -
Als DVD oder BluRay

Laufzeit: ca. 25 Min., Ton: Stereo HiFi, Bildformat:16:9

Als RSS-Feed abonnieren.


Schrift

J-STD-020E (Hardcopy)

Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices

Englisch. Stand: 2015
Mitglieder 79.00 USD Nicht-Mitglieder 95.00 USD

Beschreibung J-STD-020E (Hardcopy)

IPC JEDEC J-STD-020 is used to determine what moisture-sensitivity-level (MSL) classification level should be used so that surface mount devices (SMDs) can be properly packaged, stored and handled to avoid subsequent thermal and mechanical damage during the assembly solder reflow attachment and/or repair operation. J-STD-020 covers components to be processed at higher temperatures for lead-free and lower temperature Sn-Pb assemblies.

In this revision, clarification was added in numerous areas to ensure consistency in scope and application. The standard incorporates considerations for bare-die with polymer and non-IC package usage. Revision E also clarifies/updates Classification Temperature (Tc), package volume, dry weight characterization, and recording with suggested intervals during dry weight determination. Guidance on bake time is also provided in the case that bake test interruption is observed.

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