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FED Bibliothek des Wissens Band 17 - Abschlussbericht zum Projekt: Designregeln für den Übergang "Starr-Flexbereich"
1.Auflage 2017, DIN A5, 25 Seiten, Farbabb.
FED Bibliothek des Wissens
Band 1 - 17
Aktuelle Auflagen, DIN A5, Farbabb.
IPC-A-610G: Acceptability of Electronic Assemblies
Englisch. 440 Seiten. Released: 31.10.2017
J-STD-001G: Requirements for Soldered Electrical and Electronic Assemblies
Englisch. 92 Seiten. Released: 31.10.2017.
FED-Schulungsfilm - Baugruppenproduktion -
Als DVD oder BluRay
Report on Phase I of IPC Market Research on Electronics Technology Trends: Insights about 10 Key Trends from Interviews with Industry Experts
esearch conducted by IPC – Association Connecting Electronics Industries - indicates the top ten technology trends to watch in electronics manufacturing include miniaturization, high-performance, high-density interconnect (HDI), embedded technology, flexible circuits, lead free, halogen free, light-emitting diodes (LEDs), optoelectronics and printed electronics. Ideas about the trends have been compiled in a free white paper from interviews with industry experts and executives at printed circuit board (PCB) manufacturers, electronics manufacturing services (EMS) companies, original equipment manufacturers (OEMs) as well as suppliers of materials and equipment to those industries. Their views on the issues, time horizons and potential impact of these trends are covered. The white paper is the first step in the development of a series of studies to assess the current state of development and likely future direction of these trends, and to pinpoint and quantify the market opportunities these trends represent to the electronic interconnect supply chain.